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1、Title1.印制电路:printed circuit2.印制线路:printed wiring3.印制板:printed board4.印制板电路:printed circuit board (pcb)5.印制线路板:printed wiring board(pwb)6.印制元件:printed component7.印制接点:printed contact8.印制板装配:printed board assembly9. 板:board第一篇:第一篇: 常用术语常用术语 10.单面印制板:single-sidedprintedboard(ssb)11.双面印制板:double-sidedpr
2、intedboard(dsb)12.多层印制线路板:mulitlayerprintedwiringboard13.刚性印制板:rigidprintedboard14.刚性单面印制板:rigidsingle-sidedprintedboard15.刚性双面印制板:rigiddouble-sidedprintedboard17.刚性多层印制板:rigidmultilayerprintedboard18.MI:ManufactureInstruction(制作指示制作指示)19.ECN:EngineeringChangeNotice(工程更改通知工程更改通知)20.MOR:MarketingOrde
3、rReleaseOC:OrderConfirmation(定单定单)21.IPC-TheInstituteforInterconnectingandpackagingElectronicCircuits(美国电子电路互连与封装协会美国电子电路互连与封装协会)22.UL:UnderwritesLaboratories(美国保险商实验所)23.ISO-InternationalStandardsOrganization国际标准化组织24.OnholdandRelease:暂停和释放25.SPEC:specification客户规格书26.WIP:Workinprocess正在生产线上生产的产品27
4、.Gerberfile:软件包28.MasterA/W:客户原装菲林29.Netlist:客户提供的表明开短路的文件30.HMLV:HighMixedLowVolume,多批少量31.TCN:TemporaryChangenotice临时更改通知临时更改通知32.ENIG:ElectrolessNickel/ImmersionGold(IPC-4552)33.OSP:OrganicSurfaceprotection34.IT:ImmersionTin35.IS:ImmersionSilver36.HAL:Hotairleveling第二篇:第二篇: 有关材料有关材料1.Copper-cladL
5、aminate:覆铜箔基材2.Prepreg:聚酯胶片3.FR-4(FlameRetardant-4):一种用玻璃布和环氧樹脂制造有阻燃性能的材料4.Soldermask:阻焊剂5.Peelablesoldermask:蓝胶7.Dryfilm:干膜6.CarbonInk:碳油8.RCC:ResinCoatedCopper(不含玻璃布)9.基材:base material10. 层压板:laminate11. 覆金属箔基材:metal-clad bade material12、 覆铜箔层压板:copper-clad laminate (ccl)13、 单面覆铜箔层压板:single-sided
6、copper-clad laminate14、 双面覆铜箔层压板:double-sided copper-clad laminate15、 复合层压板:composite laminate16、 薄层压板:thin laminate17、 金属芯覆铜箔层压板:metal core copper-clad laminate18、 金属基覆铜层压板:metal base copper-clad laminate第三篇:第三篇: 有关工序有关工序PTH1.PTH:(Platedthroughhole)电镀孔A.Viahole:通路孔。?作用:作用:B.IChole:插件孔。?作用:作用:仅作为导通用
7、(不作插件或焊接),如测试点和一般导通孔。用于插件或焊接,也可导通内外层。2.NPTH:?作用:作用:一般是作为装配零件的定位孔或工具孔。NPTH?(Non-platedthroughhole)非电镀孔3.SMT/SMD?SurfaceMountingTechnology:表面贴覆技术?SMTPad:SMT指在线路板表面帖覆焊接元件的Pad,包括QFP(Quadflatpad),2-Roll等。这些也是SMTpad4.BGA/CSP:BGA-BallGridArrayCSP-ChipScalepackage?要求:要求:一般BGA区域VIA孔要求塞孔?说明:说明:它们都是一种封装技术。在PCB
8、上都表现为一VIA孔联了一个焊接PAD。BGA/CSPBGAPadLineViaHole5.Fiducialmark:?作用:作用:装配时作为对位的标记?说明:说明:它是非焊接用的焊盘,通常为圆形或方形,有金属窗和绿油窗。Fiducialmark6.Dummypattern(thiefpattern):?作用:作用:使整块板的线路分布更均匀,从而提高图电质量和减少板的曲度和扭度。?要求:要求:通常以不影响线路为标准,一般为又有三种:圆形/方形-命名为“Dummy”网状-命名为“网状Dummy”铜皮-命名为“铜皮”Dummy7.无孔测试无孔测试Pad:TextPad/BreakingTab?此类
9、Pad仅供装配完后作为测试点,不装配零件。不包括SMTPAD,BGAPAD,Fiducialmarkpad.8.BreakingTab:?印制板上无电气性能,在制作过程中用于加工具孔、定位孔或Dummy等的部分。与线路板主体部分相连处有折断孔或V-Cut。BreakingTabV-Cut9.Thermal:?作用:作用:它使在焊接时因截面过分散热而产生虚焊的可能性减少。?(heatshield)热隔离盘(大面积导电图形上,元件周围被蚀刻掉的部分)Thermal/Clearance10.Clearance:?无铜空间(通常指铜皮上为孔开的无铜区域)11.S/MBridge:?作用:作用:防止焊接
10、时Pad间被焊锡短路。阻焊桥(装配Pad间的阻焊条)S/MbridgeS/MBridgeSoldermaskintheseareasS/Mbridge12.Goldfinger:金手指?说明:说明:电镀金耐磨。一般金指的S/MOPENING均为整体开窗。13.Keyslot:键槽?作用:作用:使印制板(金手指)只能插入与之配合的连接器中,防止插入其他连接器中的槽口。?要求:要求:一般公差要求较紧。14.Beveling:金指斜边Goldfinger/Keyslot/Beveling15.VIP:?要求:要求:一般为S面塞孔,C面作为SMTPAD。16.VOP:?(ViaInPad)Via孔位于
11、SMTPad上。?说明:说明:(ViaOnPad)Via孔先被树脂塞满,其表面(一面或两面)经过打磨、沉铜、板电镀等工序后,要求作为装配Pad。VIP/VOPS面塞孔SMTPadViahole树脂塞孔SMTPadBlind/Buriedhole17.Blind/Buriedhole:盲/埋孔?盲孔:从一个表面开始,在内层结束,未贯穿整板的孔。?埋孔:不经过两外表面,只在某些内层中贯穿的孔。盲孔盲孔埋孔埋孔19.LDI?HighDensityInterconnection:高密度互联-特点:直接用激光在干膜上曝光,不必用菲林,能保证完成线宽更细。18.HDI?LaserDirectImage-镭
12、射直接曝光-特点:一般线宽/线间小于3mil/3mil导通孔小于8mil,microvia一般要求用激光钻孔。20.Heatsink:SidefaceBottomSideTop SidePCBPallet大铜块大铜块PrepregPCB+Prepreg+PalletAspectratio21.AspectRatio:纵横比(板厚孔径比)-影响电镀和喷锡?说明:说明:一般采用板厚最大值与最小孔径之比。dHDAspectRatio=d/H22.AGP:显卡主显示芯片AGP23.Motherboard:内存插孔PCI插槽CPU插座AGP插槽主(机)板Motherboard24.Memorybank:
13、Memorybank内存条内存芯片组内存芯片组第四篇:第四篇: 检查与测试检查与测试欧盟RoHS&WEEE指令对无铅PCB要求无铅PCB必须满足欧盟 RoHS(Restriction of the use of certain Hazardous Substances in electrical and electronic equipment)2002/95/EC指令 和电子信息产品生产污染防治管理办法的规定,从2006年7月开始禁用六种物质(铅、镉、六价铬、水银、PBB(多溴化联苯)、PBDE(多溴联苯醚)。其中PCB板主要检测项目包括:PCB基材、阻焊、丝印、铜皮等。 If this s
14、pecification conflicts with any otherdocumentsthefollowingorderofprecedenceshallapply:a)Purchaseorderb)Printedwiringboarddrawingsanddrillandtrimdocumentationc)Thisspecificationd)Documentsreferredtointhisspeciation.Supplier shall use applicable fabrication panelcoupon as defined in IPC-2221.Micro-sec
15、tionscoupon,andsoldersamplesshallbeprovidedwitheachshipmentforvalidationrequirement.1.Maximum3repairoperationsareallowedoneachboardandthenumberofrepairedPCBScannotexceedthe10percentoftheentirelotpopulation.2.Unlessotherwisespecifiedontheengineeringdrawing,platedthroughviaholeswithanominalsizeof0.020
16、inchorlessmaybepartiallyorcompletelypluggedwithsolder.3.Asapreventiveprecaution.beforethelayingdownofthesolder,thePCBSwillhavetobewashedtoremovetheresidualsduetotheproductionprocess,theclearingdegreeofthePCBSbeforethecoatinghastobethefollowingoneMAX1ug/squarecm.1.Soldermask(SMOBC)-ApplyLPIsoldermask
17、sperIPC-SM-840typeB.class3.colorgreenandminimumsoldermasks thickness over the edges shall be 0.001”.LPI soldermaskandsoldershallmeettheUL94v-orequirements.ThereshallbenosoldermasksovertheSMTpads,thereshallbenoexposed traces on outside layers and solder mask openingshouldbe0.002”sidelargerthanpad.2.P
18、CB“Stack-Up”constructionrequirementsaretobedeterminedbythePCBvendorunlessspecified.Leitchwillsupply the overall nominal PCB thickness, and all otherassociatedfunctionalrequirements.ACertificateofCompliance is required for all PCBs, where Leitch hasspecified specific functional requirements. (e.g. Impedancespecifications,etc.)