第第1讲讲DIE PREPARE 芯片及划片之操作芯片及划片之操作PURPOSE AND SCOPE 目的与范围目的与范围 To establish operating guidelines and process control procedures for aaaa die prepare operation 建立建立aaa芯片及划片之操作守则与 制程控制标准芯片及划片之操作守则与 制程控制标准2. SAFETY 安全事项安全事项 Never touch the rotating blade. 切勿触碰旋转中的切刀切勿触碰旋转中的切刀.EQUIPMENT Full Cut Through 划割模式划割模式 : 下划下划 ; 划穿划穿 Saw Machine Saw BLADE MAXIMUM CUT LENGTH (feet/ WEAR OUT) 划芯片机型号划刀型号最大划割长度划芯片机型号划刀型号最大划割长度(呎呎) / 磨耗磨耗 ----------------------------------------------------------------- Saw Blade Change Base on result of cut feet or wear out either frist. 换划刀时机是根据刀刃长度或刀刃磨耗为其更换依据换划刀时机是根据刀刃长度或刀刃磨耗为其更换依据. Saw blade type MAXIMUM CUP SPEED (INCH/SEC) 切刀型号 最大划刀速度切刀型号 最大划刀速度 ----------------------------------------------------- SEMITEC ST568 4.0 P.S For WQE or RE49 Devices, Cutting Mode and Parameters Shows as Below:划刀模式和参数如下划刀模式和参数如下 Cut Mode : Two Phase Cut 划刀模式划刀模式 : 两阶段切割方式两阶段切割方式 Cut Order : Long Side Short Side 划刀顺序划刀顺序 : 长边长边 短边短边 Cut Depth : Phase One 1/3 of wafer depth Phase Two Cut through 划片深度划片深度 : 第一阶段第一阶段 芯片的三分之一厚度 第二阶段芯片的三分之一厚度 第二阶段 切穿切穿SPECIAL NOTE 特别事项特别事项 (1) 1. Saw speed should be slowed down by step when kerf is not smooth in monitor of saw machine; If kerf touches or is over the edge of saw street, the saw blade should bechange. 在划片机的监视器上在划片机的监视器上,观察到划片痕不平滑时观察到划片痕不平滑时, 划片速度应该一步步降低划片速度应该一步步降低; 若划 痕碰到或超过划片道边缘若划 痕碰到或超过划片道边缘,则划片刀应该换新则划片刀应该换新. 2 Wafer with more than one straight side should be mounted on contact chuck table. 有两个平边的芯片必须使用接触式芯片盘贴芯片有两个平边的芯片必须使用接触式芯片盘贴芯片 3 When cutting REW2 and REW1 wafer, it’s allowed to use old blade, but needs to use “FRE” program to start cutting. 当划当划REW2和和REW1芯片时芯片时, 可使用原旧刀切可使用原旧刀切, 但需从磨刀程序但需从磨刀程序(FRE)开始切开始切. 4 UV tape expired period is 6 months from manufacturing date. UV 胶布保存期限为制造日加胶布保存期限为制造日加6个月个月.SPECIAL NOTE 特别事项特别事项 (2) 5. UV tape cure UV胶带除胶胶带除胶 A) Ensure that wafers processed on UV tape undergo UV cure after saw before moving to die attach. 在移送至贴片站前在移送至贴片站前,须确认须确认UV胶带已除胶胶带已除胶. B) Wafer process on UV tape must be cured within 5 days. 芯片贴于芯片贴于UV胶带后胶带后, UV胶带须在胶带须在5日内除胶日内除胶. C) The UV lamp must be replaced after UV machine alarm. Reset the indicator after UV lamp is replaced. 当机器警告时当机器警告时UV 灯管必须更换后计时灯管必须更换后计时. D) All pade device need to use the UV tape. 所有的所有的 PADE 型号必须使用型号必须使用UV TAPE.6. Detergent application 清洁剂的应用清洁剂的应用 Need to add detergent during cutting C05 technique wafers and more advanced technique wafers. 针对针对C05技术及比技术及比C05技术更新的芯片技术更新的芯片, 在切割时都要 增加清洁剂在切割时都要 增加清洁剂.FAILURE CRITERIA 缺点标准缺点标准 4.1 During production, operator have to perform sample inspection. (Minimum 100X microscope) 生产操作中操作员必须实行抽验检查生产操作中操作员必须实行抽验检查 – 100倍以上的显微镜倍以上的显微镜. 5. DISPOSITION 问题材料处置问题材料处置 5.1 If found more than a die related with saw/die defects at inspection, has to do inspection with 100% on this lot and inform engineer or supervisor to do with the lot. 若发现在检验时有划片缺点若发现在检验时有划片缺点,须对此批作须对此批作100%检验检验, 并通知工程师并通知工程师 RECORD RETENTION 记录保存记录保存 Control items Retention during ----------------------------------------------- - Saw Blade Change Record 切巴刀片换刀记录二 年切巴刀片换刀记录二 年- Saw Surveillance 切巴自我抽检记录二 年切巴自我抽检记录二 年第第2讲讲DIE INTERFACE DIE STOCK ROOM 芯片芯仓芯片之操作守则芯片芯仓芯片之操作守则Purpose And Scope 目的与范围目的与范围To establish operating Guidelines and process control procedures for SS wafers handling of Die Stock Room. 建立 芯片芯仓芯片之操作守则与制程 控制标准建立 芯片芯仓芯片之操作守则与制程 控制标准EQUIPMENT the marking is to be viewed at a distance of 6-12 inches in normal room light without the aid of magnification. 由灰屑所造成之印章不良由灰屑所造成之印章不良 - 有文字或数字在判读上造成 困难是不可接 受的有文字或数字在判读上造成 困难是不可接 受的; 检查印章的条件检查印章的条件: 6-12 英吋的距离英吋的距离. 正常灯光下正常灯光下, 未使用辅助装 置未使用辅助装 置. 2, Any package was scratch caused by cleanning machine is not allow. 有任何的胶体被此机台刮伤是不允许有任何的胶体被此机台刮伤是不允许. 3 , Any lead finish was scratch caused by cleanning machine is not allow. 有任何的脚被此机台刮伤是不允许有任何的脚被此机台刮伤是不允许Note: 1. Mfg should be house keeping for inside and outside of this machine befire each shift end. 注意注意: 制造部必须于每班下班前将此机器之内外部清理干净制造部必须于每班下班前将此机器之内外部清理干净. 2. Mfg should be renew cleanning brush once per shift. 制造部必须于每班更换清洁刷子一次制造部必须于每班更换清洁刷子一次. 3. Periodic inspection for the cleanning machine - keep the record for min 6 months 此擦拭机的定期检验此擦拭机的定期检验 - 保存记录最少六个月保存记录最少六个月.第第8讲讲SYMBOL/TRIMFORM LINK MODULE OPERATIONPURPOSE AND SCROP 目的和範圍目的和範圍This spec is to define the symbol/trim/form link module process procedures. 此規格定義蓋印此規格定義蓋印/切腳切腳/成形過程程序成形過程程序.SAFTY 安全安全 1, Machine can only be operated by well trained people. 機器僅能由受過訓練的人操作機器僅能由受過訓練的人操作. 2, Materials with incomplete filled, distortion or off-centered problem can not be used on machine with automatic type. 未充滿變形或偏心的产品未充滿變形或偏心的产品, 不能用自動型式機器上使用不能用自動型式機器上使用. 3, There are emergency stop switches which can be used at any time when machine has problem. 機器發生問題時機器發生問題時, 有緊急開關可供緊急停止有緊急開關可供緊急停止. 4 , Use air gun to clean the residue on die before using the machine and inspect the chassis for cleanliness, wear safety glasses when u。