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1、1ConfidentialCONFIDENTIALChina StarHitachi Anisotropic Conductive FilmDisplays materials R&D Dept. Displays materials Div. Electronic Materials Business SectorRAnisolmAnisolm2 2 2 22Conducting particle Au / Ni coated plastic ball : 3 - 10um, Ni particle : 2 - 6umAdhesive Thermosetting resin : Epoxy
2、/ Acrylic ester【Side View of ACF “ANISOLM”】Separator (Support film : White or Translucent)【Standard Package of ACF “ANISOLM”】 *Protected with plastic reel *50 - 300M Length *1.0 - 4.0mm Width *16 - 45um ThicknessStructure of ACF “ANISOLM”ACF : Conductive particles are dispersed in adhesive film.Sing
3、le Separator Type (Main product)3 3 3 33Melt Viscosity (ACF Hardness)Mechanism of ACF InterconnectionIC, FPC, COFCushion MaterialTool HeadStart / -Heat & Pressure to ACFFlowing / -Filling into Electrode Space -Captured Particle between ElectrodesPWB, GlassHardeningFlowingCooling (Finish) / -More Adh
4、esive Hardening -Connection FinishCoolingTemperatureHardening / -Particle Deformation for Electrical Connection -Adhesive HardeningACF Physical Change Bonding Process HardSoftLowHighConductivityInsulationAdhesion4 4 4 44COG （IC / Glass）AC-8000 seriesFOB （FPC or COF / PWB）AC-2000 seriesAC-9000 series
5、FOG （FPC or COF / Glass）AC-3000 seriesAC-4000 seriesAC-5000 seriesAC-7000 seriesCOF （IC / COF）AC-200 seriesCOB （IC / PWB）FC-200 seriesUF-500 seriesLineup of ACF “ANISOLM” for LCD ApplicationChoice Best Type & Size of ACF for Application (Electrode, Pitch etc.)Connector Substitution MFseries5 5 5 55A
6、pplication Example (Connector substitution)Make thin packageMake thin packageMake thin packageMake thin packagePackage thickness：1mmPackage thickness：0.03mmPackage thickness：1mmPackage thickness：0.03mm6 6 6 66 6Small, light&thin electronic devices can be achieved by using our AC series !3.Low Temper
7、ature Low temperature & Short bond time 1. Thin PackagePackage thickness = substrate thickness Make small, light, thin & smart packageAdvantages of Substitute Connection Film 4.Environmentally Friendly2. High DensityFine pitch minum100um High pin countPb free RoHS compliant 7 7 7 77CoatingResinMixin
8、gCuring agentConductive particleAppearance Thickness InspectionDryer zoneCoatingWindingRe-windingSeparatorMixingKEEP COOLPacking Reel AssemblyPackingShipmentCuttingAppearance inspectionCuttingMixing Adhesive solutionVisual inspectionManufacturing Process of ACF “ANISOLM”8 8 8 88Choice Best Type & Si
9、ze for Electrode, Pitch & ApplicationDesign of Conductive Particle (1)For Metal Electrodes (Cu, Others) 【ACF for FOB】For Metal Electrodes (Cu, Others) 【ACF for FOB】Pure Ni Pure Ni Star Shape or SphereStar Shape or SphereMaterialMaterialShapeShapeAbout 2-6umAbout 2-6umSizeSize100-200um100-200umMin. E
10、lectrode PitchMin. Electrode PitchFor ITO, IZO, Metal Electrodes (Cu, Au Bump) 【ACF for FOG, COG】For ITO, IZO, Metal Electrodes (Cu, Au Bump) 【ACF for FOG, COG】Au/Ni or Ni or Pd/Ni plated PlasticAu/Ni or Ni or Pd/Ni plated PlasticSphereSphere3-10um3-10um20-100um20-100um9 9 9 99Ni particle (About 2-6
11、um)Cu electrode on TCP Cu/Ni/Au electrode on PWBCross Sectional Image (SEM)Ni particles stick onto electrodes in bonding and achieving excellent connection reliability.Design of Conductive Particle (2) Nickel Particle Pure Nickel particleAmorphous star shape, High hardness1010101010Sphere shape, Nar
12、row size distribution, Elastically deformedStructure of Metal Coated Plastic BallPlastic BallAu/Ni Thin LayerApplied Ni/Au coated plastic balls for ACF for the first time in the world(1987) and realized fine pitch connection.Design of Conductive Particle (3) Plastic Particle 10umPanelPolyimide on CO
13、FConductive Particle CopperCross Sectional Image (SEM)111111111111substratesubstrateCushion materialCushion materialHeating toolHeating toolCover filmCover filmFlexFlexsubstratesubstratesubstratesubstratesubstratesubstrateCushion materialCushion materialHeating toolHeating toolCover filmCover filmEx
14、. 805sec1MPaEx. 805sec1MPa1. Lamination1. Lamination2. Remove cover film2. Remove cover film3. Alignment3. Alignment4. Bonding4. BondingEx. 18010sec3MPaEx. 18010sec3MPaBonding Process1212121212FOB （FPC or COF / PWB）AC-2000 seriesAC-9000 seriesACF for FOB Interconnection131313131313入力側端子接続熱LCD性能影響The
15、rmal influence on LCD quality during input leads interconnection（warpage in PWB, elongation of TCP)Large LCD Panel Higher electrode density ( less than 50m） ） Narrow Rim size (Thermal Influences)Small LCD Panel Light weight (P-LCD) Low cost (Thermal Influences , Shortening of Throughput)TCP/COF入力側端子
16、接続用ANISOLM対要求特性 Requirement trend on ACF for TCP/COF(input leads) interconnectionANISOLM対要求特性対要求特性LCD動向（動向（LCD trend） ）狭化（Finer Pitch leads） 狭額縁化（Narrower LCD frame） 大型化（Larger LCD size）低温、短時間接続化 （Low temp & short time bonding)（ （Requirement trend on ACF） ）141414141419901995200020052010 YearTrend of PCB interconnectionTCPCOFPackaging Technology600mm Maximum PCB size200mm 350mm 200300length100ACFCuring Sy
