《LCD制程简介(含ODF)-简体》由会员分享，可在线阅读，更多相关《LCD制程简介(含ODF)-简体（46页珍藏版）》请在金锄头文库上搜索。
1、蘇榮華,1,LCD制程简介,Page2,TFT-LCD制程流程,Page3,面板世代廠,Page4,LCD Panel构造,LCD PANEL构造图,Page5,Page6,Page7,TN Type Panel,TN Type Panel需经过配向制程，使液晶产生预倾角，电压驱动时利用液晶倾斜角度的变化使光源穿透或阻挡.(Normally White:未驱动时为白色),Page8,MVA Type Panel,MVA Type Panel不需经配向制程，液晶与基板呈垂直站立状(Normally Black:未驱动时为黑色),Page9,TN vs. MVA Type 在制程上的差异PI/LC
2、/End Seal等材料及制程参数不同,Page10,Panel制作,CF,CF,CF,CF,CF,CF,TFT,TFT,TFT,TFT,TFT,TFT,Panel,Page11,O,O,O,O,O,O,O,O,O,O,X,X,CF84%,TFT84%,Panel Yield 67%,O,O,O,O,X,X,Page12,LCD Process Flow Chart (Conventional),TFT,基板投入,单板切割,基板洗净,PI,印刷,PI,预烤,PI,硬烤,配向,CF,基板投入,单板切割,基板洗净,PI,印刷,PI,预烤,PI,硬烤,配向,银胶打点,基板组立,热压着,CELL,后制
3、程,基板洗净,/,干燥,基板洗净,/,干燥,间隔剂散布,框胶,涂写,LCD PANEL,Page13,LCD Process Flow Chart (ODF),Page14,LCD Process Flow Chart,LCD PANEL后工程流程图,NHAD,NHBD,Page15,LCD PI印刷前洗净制程,Page16,LCD PI印刷前洗净制程,Page17,PI制程原理,Page18,LCD配向制程-1,Page19,LCD配向制程-2,Page20,如何判断LC分子是左旋或右旋,Page21,LCD配向后洗净制程,Page22,LCD框胶涂布/银胶打点制程,Page23,LCD间隔
4、剂散布制程,Page24,LCD间隔剂散布制程,Spacer,间隔剂散布工程(Dry Spacer Spray),Sprinkler,TFT基板,Page25,LCD面板组立制程,面板组立工程(Panel Aligner),Page26,LCD Cell former,Page27,Cellgap的决定,Page28,LCD Process Flowchart( ODF ),TFT,基板投入,单板切割,基板洗净,PI,印刷,PI,预烤,PI,硬烤,配向,CF,基板投入,单板切割,基板洗净,PI,印刷,PI,预烤,PI,硬烤,配向,银胶打点,ODF,热压着,CELL,后制程,基板洗净,/,干燥,
5、基板洗净,/,干燥,框胶,涂写,LCD PANEL,Page29,ODF(One Drop Filling)原理,Page30,ODF设备简介,Page31,LCD Process Flow Chart,LCD PANEL后工程流程图,NHAD,NHBD,Page32,LCD Cell切割裂片制程-1,Page33,LCD Cell切割裂片制程-2,Page34,LC Filling & End Seal制程原理-1,液晶注入工程(LC Filling),Page35,LC Filling & End Seal制程原理-2,End seal,Page36,LCD Realign Oven,Pa
6、ge37,LCD Panel Clean,Page38,磨边导角工程(ABVL),Page39,ACRM Process,刮除异物工程(ACRM),去除Panel表面异物1. Cullet2.End-Seal3. 表面其它脏污,Page40,SRCN Process,面板整列部VCR,R/B洗净部,温风干燥,除电部,Rinse(F/S),拧干部,HPMJ,L/DConveyor,表面clean,磨边后洗净机,一次外观,磨边后(表面清洁后) ，Light-On前表面残留Particle清洁端子部清洁,Page41,LOT 1 点灯测试,Light on test,偏贴前Light On点灯测试,
7、Page42,PACN Process,面板整列部VCR,R/B洗净部,温风干燥,除电部,Rinse(F/S),拧干部,HPMJ,L/DConveyor,表面clean,磨边后洗净机,一次外观,偏光板贴付前，玻璃表面之清洁避免Panel于偏贴前受污染提供洁净之Panel至偏贴机,Page43,APAM Process,偏光板贴附工程(APAM),穩定之偏光板自动贴附,Page44,LOT 2 点灯测试,Light on test,偏贴后Light On点灯测试,Page45,Packing Process,Shipping Type a. PP Box(粉红色冰淇淋盒) b. 黑色静电箱 c. Dense Pack d. Hard Case f. Cassette,Hard Case,Dense Pack,PP Box,黑色静电箱,Cassette,蘇榮華,46,Q & A,Thinks!,
