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1、New Product Introduction, and the Importance of Advanced Quality Planning,1-1,新 產 品 導 入, 先期品質計劃的重要性,1-2,Workshop Objectives,Revisit the New Product Introduction stage as a key step in your Quality Strategy and the typical pitfalls during this stage Revisit the concept of Concurrent Engineering (CE)
2、successes and lessons are seldom captured and shared between business units or departments: mistakes repeat, and success dont. no measures are available to all project managers to assess the performance of their projects against other projects; nobody knows if he has done better or worse than his co
3、mpetitors.,16-1,R separate design and manufacturing documentation Individual contribution highly valued and rewarded Over-the-wall design transfer and serial design and manufacturing activities considered normal mode of operation,21-1,獨立階段,於新產品開發階段，相互之間很少或沒有互動。 設計由開發人員獨佔；設計文件與制造文件分開。 過高看重個人貢獻並給與獎勵。
4、“隔牆”設計轉移，串行設計及制造活動被視為正常的運作模式。,21-2,Evaluation meeting with manufacturing were conducted after the design work was complete Designs were frequently reworked to accommodate manufacturing issues, resulting in longer development intervals Relationship between manufacturing and design changed from little
5、 interaction to an antagonistic, emotionally charged and tense relationship,22-1,評價 設計工作完成之後，與制造部門進行溝通。 設計需頻繁修改以兼顧制造問題，而導致開發時間延長。 制造及設計間的關系由很少互動轉為一種對抗的，互相指責的且緊張的關系。,22-2,Education reviews and rework were reduced Designers became more knowledgeable and sensitive to manufacturing and other downstream
6、processes affected by the design; product designs began to reflect manufacturing issues up front in the design process, and some full-stream optimization occurred Manufacturing engineers remained isolated from design process, with the exception of manufacturability reviews Designers began to realize
7、 that it is difficult to keep up with and handle all the manufacturing information; awareness increased that designers cannot do DFX by themselves,23-1,訓練 評估及重工減少。 設計人員變得更博學，對制造問題及其它受設計影響的下序制程更敏感；產品設計開始提前於設計階段就反映制造問題，整個流程實現某種程度的優化。 除了進行制造可行性評估外, 制造工程師依然被隔離於設計制程之外。 設計人員開始意識到難於做到與所有制造資訊保持同步及適時處理，更強烈地意
8、識到並非設計人員能夠獨自進行DFX 。,23-2,Part Time Participation Stage,Manufacturing became involved early in the design process as an active participant (still part-time); reviews and rework eliminated Frequent interactions occurred between design and manufacturing; communication paths were opened Concurrent desig
9、n of product and the associated downstream processes took place on a limited basis, with some shared decision making between design and manufacturing; manufacturing readiness intervals (final design to production ship) began to decrease Success factors for concurrent engineering began to surface, in
10、cluding shared objectives, communication tools, shared design tools, common values and reward systems, and common processes Designers continued to “own” the product design,24-1,部分時間參與階段,制造作為一個積極參與者（仍然是部分時間) 逐漸介入於設計制程早期階段；評估及重工被消除。 設計及制造部門開始頻繁互動；溝通渠道敞開。 產品及相聯系的下序制程的同步設計只發生在有限的基礎上，於設計及制造間一些決策文件共享；制造準備
11、時間（最終設計至生產出貨）開始縮短。 同步工程的成功因素開始顯現，包括目標共享，溝通工具，設計工具共享，共享價值及報酬體系，共有制程。 設計人員繼續“擁有”產品設計。,24-2,Integrated Development Teams Stage,This is the final stage where Design and Manufacturing work closely together to achieve the companys goals.,25-1,經整合之開發團隊階段,這是最後階段, 于此階段, 設計及制造部門密切合作，共同達成公司目標。,25-2,Presentatio
12、n on Concurrent Engineering Activities,26-1,同步工程活動介紹,26-2,The Concurrent Engineering Stage,R NPI FMEA Early process optimization Effective CLCA,The Factory as an Internal Customer,45-1,影響工廠之問題,問題解決,問題出現,營運利潤,品質之能動作用 減少工廠新問題發生之頻率 增加問題解決之頻率,新設計 供應商元件 所需文件 NPI FMEA 早期制程優化 有效之 CLCA,視工廠為內部客戶,45-2,Mapping
13、 R 2nd week 75%; 3rd week 100%,Done. Direct labour only.,Initial Mass Production - 75% Final Mass Production - 85%,Done. Attachment 4,Done. See Attachment 5 (workmanship Standards 第2周 75%; 第3周 100%,Done. 僅對直接人員,初步量產 - 75% 最終量產 - 85%,Done. 附件 4,Done. 見附件 5 (工藝標準 HDD type: Mode 3 or Mode 4 or UP,Prima
14、ry IDE,Sample Test Plan Attachment 1,75-1,測試項目,功能測試,前置測試,抽樣,功能描述,老化,OQC,自動即時時鐘,自動設置主板即時時鐘 CMOS 時間/日期 檢查RTC功能,如有使用，進行高端內存檢測,高端內存測試,檢查CPU速度,CPU 速度測試,1.44MB軟驅磁片執行隨机讀寫測試,軟驅測試,串行口鼠標左右鍵及移動測試,串行鼠標測試,PS/2 鼠標左右鍵及移動測試,PS/2 鼠標測試,使用回路連接頭測試串行口信號,波特率分別為: 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200,串行口測試,外
15、部回路連接頭測試數据線和控制線,并行口測試,IDE以 MS-DOS 引導并運行所有測試程式;硬盤類型:MODE3 或MODE4或更高,主IDE接口,抽樣測試計划 附件 1,75-2,Test Item,Func Test,Pretest,Sampling,Function Description,Aging,OQC,Secondary IDE,Performs ATAPI CD-ROM Read/Write/Compare tests. CD-ROM type: Mode3 or Mode 4 or UP.,General Arithmetic Logical test DMA 8237A-1
16、, DMA 8237A-2, Page registers test. Protect Mode test Interrupt test ADD, SUBTRACT, Multiplication, Division test, Clock, Calendar test.,Main Components,System Memory Test,Check system memory size Test base memory NC=8step; SP=2step,Resistor,712,600,84.27%,NC=107step; NP=5step; SP=0step,Capacitor,559,159,28.44%,Parallel=248step; NC=152step; NP=0step,Inductor,0,0,0%,SP=0step; NC=0step,Diode,66,48,72.73%,NP=0step; NC=18step,Transistor,56,40,7
