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1、Page 1Automatic Optical Inspection in Solar PV MarketXing-Fei He & Mark ButlerApril 30, 2009Page 2Solar energy reaching the Earths surface satisfies 10,000x global demandSi is the 2nd most abundant element5% worlds dry land needed for PV installation to meet global needsPV generates much more energy
2、 over its lifetime than its needed for productionSolar PV has no CO2 emissionSolar Energy Is SustainablePage 3Solar PV Market by End of 2008Annual growth 35% since 1998Accumulated capacity 15GWSource: EPIAPage 4Growth 2030% from 200813Accumulated capacity 211GW by 2020Solar PV Market OutlookSource:
3、EPIAPage 5Investment ForecastSource: EPIAMarket $31B, capex $6B in 2010Page 6Assuming the same costing of AOI system, component market for solar reached 1/3 of that for FPD in 2008 Estimated Market Size: Solar vs. FPDFPD 08Solar 08Solar 10Market size$100B$23B$31BCapex $11B$4B$6BAOI 3%$330M$120M$180M
4、Vision comp 5%$17M$6M$9MPage 7P-Si oversupply due to vast investment on production capacityEconomic crisis slowdown PV installation in 2009/10Module price expected to fall and see grid parity soonerMany activities in vision systems to improve cell qualityMarket StatusPage 8Cost factors:EfficiencyLif
5、etimeYieldThroughputSolar PV: Cost and CompetitivenessPage 9Country:China (29%), Japan (22%), Germany (20%), Taiwan (11%), USA (6%)Company:Q-Cells (9%), Sharp (8%), Suntech (8%), Kyocera (5%), First Solar (5%), Motech (4%), SolarWorld (4%), Sanyo (4%)Top Solar Cell ProducersPage 10Equipment sales: $
6、US4.4B in 2008Company: Applied Materials ($455M), Roth & Rau ($275M), Centrotherm ($270M), Oerlikon ($250M), Manz Auto ($140M), Schmid ($125M), Von Ardenne Anlagentechnik ($120M), Rena ($85M), 3S Swiss Solar ($70M)Top Equipment SuppliersSource: VLSI ResearchPage 11Technology: Wafer-Based and Thin Fi
7、lmPage 12How Solar Electricity WorksConvert photon to electricityCell, module, inverter, grid-connectionPage 13Solar Cell StructureSize: 156x156mm, 210x210mmThickness: 200um, 150umPage 14The Value ChainPage 15Wafer Manufacture ProcessPage 16Quality check before sawingGeometry, surface, chamfer inspe
8、ction and measurementCamera: 3D with structured lightIngot InspectionPage 17Cell Manufacture ProcessPage 18Metrology: Size, shape, corner, edge, bending (3D), etc.Surface: Hole, stain, finger print, chipping, contamination, saw-mark (3D)Camera: 4k/8k, 10/7um, P2/P3/HS, 2M/4MWafer InspectionPage 19Mi
9、crocrack InspectionSmall cracks down to 5um, can not be seen with visible lightUse backlight imaging with NIR LEDs (850950nm)Page 20Transmission in NIR at 850 or 950nm depends on wafer thicknessCamera: 28k, 714um, better QE in NIR, also area scanNIR Backlight ImagesPage 21Create multi-reflection to
10、capture more sun lightSurface reflectivityCamera: 4k/8k, 10/7um, P2/P3/HS.Texture InspectionPage 22SiN AR coating to reduce optical reflection Colour (Blue), thickness, defect, coating homogeneity within 1%Camera: 4k/8k, 10/7um, PC/SC, 2M/4MCoating InspectionPage 23Ag/Al prints as electrodes on fron
11、t side and rear sideWidth, position, interrupt, stain, missing paste, contamination, etc.Camera: 4k/8k, 10/7um, P2/P3/HS, 2M/4MPrint InspectionPage 24EL: Emit light peaked at 1.15um upon a forward current 40mA/cm2QE of CCDs too low, currently need 1s exposure time Electroluminescence (EL)Page 25EL I
12、magesFinished cell inspectionInspect: microcrack, finger, resistanceArea scan camera usedPage 26PL: Emit light upon laser excitation (laser wavelength = 800900nm)QE of CCDs in too low. Same issue as ELPhotoluminescence (PL)Page 27ContactlessInspect/measure: Broken finger, crack/microcrack, resistanc
13、e, Area scan camera usedPL ImagesPage 28Current Si CCD has poor QE at 1um Responsivity is limited by Si bandgap (1.1eV)EL/PL Detection Needs Better QE in NIRPage 29Module Manufacture ProcessPage 30Final inspection before system installationEL is the technique of choiceInspection of: Cell position, s
14、tring quality, efficiency, damage, etc.Module InspectionPage 31Improve PV efficiency and qualityReduce cost by reducing scrapDirect feedback to processing control and managementAvoid down time of production line due to cleaning up breakage of wafersAOI ValuesPage 32ATMvision, ICOS, ISRA, Vitronic, Schmid, GP Inspect, Manz Auto, Hennecke, GraphikonApplied Materials, KLA, Meikle Auto, ATS Auto, Adept, Andor, Veeco, DarkfieldSanyo, Delta, GPM, Chroma, and moreAOI Equipment Suppliers
