ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights1 1CHAPTER 6ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights2 2Bond Stick On Ball(BSOB)/Bond Ball On Stitch(BBOS)/Tail BreakASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights3 31.0)BOND STICK ON BALL(BSOB)1.1)DescriptionThis bonding process is specially developed by ASM to handle multi-die(MCM)bonding application.In the conventional approach,if one is trying to connect the gold wire from one die to the another,a capillary mark of second bond will be evident on top of the die which may damage the die.The BSOB process will solve this problem by bonding a ball onto the dies surface first,followed by bonding another wire where the second bonds wedge will be landing on top of this bonded ball(figure 1).ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights4 4Die 1Die 2Bond Ball2nd Bond(wedge)1st Bond Figure 1:Bond Stick On Ball(BSOB)ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights5 52.0)BOND BALL ON STITCH(BBOS)/SECURITY BOND2.1)DescriptionThis process is also known as security bond.It bonds a ball on top of the wedge of the normal connection wire.This process is mainly used to secure the second bond sticking capability.(Figure 2)Die 1LeadBond Ball2nd Bond(wedge)1st Bond Figure 2:Bond Ball On Stitch(BBOS)ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights6 63.1)Free Air Ball(FAB 2)is aligned to the center of the bond pad on device 2.Device 1Device 2FAB 23.0 STANDOFF BALL CONTROL BONDING SEQUENCEASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights7 73.2)Capillary descends and bonds ball to bond pad.Device 1Device 2W/clamp openCapillaryApplication of 1st bond stand off ball parameter to form Ball Thickness and Ball SizeDuring Stand Off Bonding,SOB parameters are applied.ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights8 83.3)Capillary rises to loop base to clear ball.Device 1Device 2W/clamp openCapillary rises to set Loop BaseLoop BaseContact Pt.Loop base is the distance between the capillary tip and contact point.Recommended setting=2ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights9 93.4)Capillary move to programme ball offset.Ball offset can be programmed towards or away from the first bond.+ve towards 2nd bond -ve away 2nd bond Device 1Device 2W/clamp openActual Ball Offset=Setting x 10umIf Ball Offset Setting=22Then Actual Loop Base=220umRecommended Setting=-ve 35ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights10103.5)Capillary descends and forms stitch bond on top of the ball.Device 1Device 2W/clamp open*Ball ThicknessSOB Parameter (Stand Off Ball Parameter)Capillary descends to set Ball Thickness(Amt.Z movement above the ball height)Contact Pt.*Ball Thickness is the distance between the capillary tip and contact point Recommended setting=2 ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New Heights11113.6)Capillary moves horizontally for a scrub distance to weaken the wire at ball neck.Device 1Device 2W/clamp openScrub one direction away from ballActual Scrub Distance=Setting x 0.8 umIf Scrub Distance Setting=10Then Actual S。