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1、英特尔半导体（大连）有限公司介绍2007 年 3 月 26 日，英特尔宣布投资 25 亿美元在大连市建设 300 毫米（12 英寸）芯片制造工厂。该工厂是英特尔在亚洲的第一个晶圆厂进一步体现了英特尔对中国的承诺和深入推进本地化的决心，同时也是公司在中国长期投资的延续。秉承与中国共成长的战略，该项目将带动辽宁乃至整个老东北工业基地的经济发展，有助于本土信息技术产业形成集群效应，使产业链延伸至更广阔的市场区域。F68 Process EngineerWorking Location: DalianResponsibilities and DetailsIn this position, you w
2、ill be reporting to Process Engineering Manager and working closely with process engineering, yield/integration and manufacturing teams to start up and ramp the 1st Intel 300 mm Fab in Asia and will be located in Dalian. Applying to this posting will allow you to be considered for all process engine
3、er positions available at this time. Your responsibilities will include but not be limited to: Leading and owning process and equipment qualification, tool preventative maintenance, management of troubleshooting activities, regular monitoring of tool/process performance, defect analysis/reduction an
4、d cost reduction to achieve both operation and equipment excellence under LEAN principle. Working with existing Intel 300mm Fabs around the world to improve tool and process performance, reduce cost, and increase flexibility in process transfer. Working and leading manufacturing equipment teams to d
5、evelop inventive solutions to improve execution and efficiency in a high-volume manufacturing environment Specific function areas/toolsets Litho scanner, track, process integration and litho metrology. Diffusion, implant, RTA, CVD, PVD, Cu plating, CMP, Thin Film Metrology, defect metrology equipmen
6、t, and wafer handling equipment. Wet clean/etch and plasma etch/ash.QualificationsCandidate must be on track to obtain a BS/MS/Ph.D degree, by 2010, in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, and Chemistry or in the related fields, with good
7、skills in MS office and related software applications.Candidates should have good communication skills in Chinese and have passed CET6 test. Candidates should be able to provide some problem solving cases by applying logical thinking and problem solving techniques. Candidate must be able to consiste
8、ntly perform on a 12-hour shift schedule - Compressed Work Week (CWW) schedule.Sort Test EngineerWorking Location: DalianResponsibilities and DetailsThis position is Fab68 Sort Test Engineer for a 300 mm HVM Fab in Dalian, China. Successful candidate will be responsible for Working on specific Sort
9、module equipment and process, like CMT tester, TEL Prober and Agilent Tester etc., being module owner on both equipment and process, to ensure they are in good status for Sort High Volume Manufacturing. Supporting factory start-up during processing tools qualification and building validation Transfe
10、rring, validating, and supporting Sort modules and E-test test programs for production and qualification Supporting product engineering with respect to testing methods, procedures, device specification and yield problems, minor redesign of devices and masks, analysis of customer returns, and optimiz
11、ing device production relative to cost constraints Interfacing with yield analysis, integration, product engineering, quality and reliability network, test content owners to support product launch and overall outgoing quality. Working with equipment suppliers to develop and deliver required hardware
12、 and software solutions, validating test platforms and driving equipment availability Evaluating the electrical and physical characteristics of integrated circuits to determine the root cause of failure, recommending corrective action to prevent reoccurrence of problems, and disposition impact mater
13、ial correctly. Mentoring/Training Sort Manufacturing Technician on process/equipment knowledge gap closure, Owning module equipment Preventive Maintenance schedule and checklist Owning module equipment to meet standard capacity POR and module availability goals, Owning module Continuous Improvement
14、to keep process optimization and equipment performance enhanced Reporting to Sort Engineering Group Leader and Module team leaderQualificationsYou should possess a minimum of B.S. degree in Electrical Engineering, Mechanical Engineering, Automation or Material Engineering. A strong candidate will be
15、 self-motivated with good written and verbal communication skills, be proficient in written and spoken English language and have the ability to work hard in a dynamic environment. The candidate should be eager to take challenges and compete tasks under pressure. Additional qualifications would be an
16、 added advantage including: Knowledge of electrical device analysis and tools Knowledge of logic circuit design and/or programming skills Knowledge of test program development process and tools Knowledge of Computer programming languages and scripting skills Basic knowledge of statistics and data analytical applications. Basic knowledge of tester programming, product architec
