全彩共阴贴片LED灯珠-1206贴片LED灯珠规格书

上传人:淇** 文档编号:88692119 上传时间:2019-05-06 格式:DOCX 页数:10 大小:368.63KB
返回 下载 相关 举报
全彩共阴贴片LED灯珠-1206贴片LED灯珠规格书_第1页
第1页 / 共10页
全彩共阴贴片LED灯珠-1206贴片LED灯珠规格书_第2页
第2页 / 共10页
全彩共阴贴片LED灯珠-1206贴片LED灯珠规格书_第3页
第3页 / 共10页
全彩共阴贴片LED灯珠-1206贴片LED灯珠规格书_第4页
第4页 / 共10页
全彩共阴贴片LED灯珠-1206贴片LED灯珠规格书_第5页
第5页 / 共10页
点击查看更多>>
资源描述

《全彩共阴贴片LED灯珠-1206贴片LED灯珠规格书》由会员分享,可在线阅读,更多相关《全彩共阴贴片LED灯珠-1206贴片LED灯珠规格书(10页珍藏版)》请在金锄头文库上搜索。

1、承认书SPECIFICATION FOR APPROVAL客户Customer:客 户 品 号Customer P/N:鑫光硕品号Xgs Model:规格Specification :制作XGS-PB3216UEUGUB-04-BSMD 1206 RGB共阴 20MAPrepared By:李忠审核Checked By:Customer Confirmation 客户确认采购部Pur Dept By品质部QA Dept By工程部Eng Dept By深圳市鑫光硕科技有限公司SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD公司地址:广东省深圳市宝安区沙井万

2、丰村前路31号8楼 一厂地址:广东省深圳市龙岗区嶂背创业二路18-1号二厂地址:广东省东莞市石排镇庙边王村沙迳工业区Tel: 13798585378 QQ:2373888283Website :Http:/ E-mail: Customer:Technical Data SheetPN: XGS-PB3216UEUGUB-04-B For: IF=20mAContents 1.Features 2.Applications3.Package dimensions 4.Absolute maximum rating5.Electrical optical characteristics 6.BI

3、N range7.Package label 8.Soldering pad dimensions 9.Soldering conditions10. Package tape specifications11. Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions14.NoteCustomer confirmApproved byChecked byIssued by Features:Part No.XGS-PB3216UEUGUB-04-BEm

4、itted ColorSuper RedSuper GreenSuper BlueChip MateriaAlGaInInGaNLens ColorWater Clear Features:Compatible with automatic placement equipment Compatible with reflow solder processLow power consumption and wide viewing angleThis product doesnt contain restriction Substance, comply ROHS standard. Appli

5、cations:Automotive and TelecommunicationFlat backlight for LCD ,switch and symbol in telephone and fax General use for indicators Package Dimensions:Notes:1. All dimensions are in millimeters (inches).2. Tolerance is 0.1(0.004) unless otherwise noted.3. Specifications are subject to change without n

6、otice.Page 1 of 8 Absolute Maximum Rating (Ta=25)ParameterSymbolValueUnitRGBPower DissipationPd60110110MwPulse Forward CurrentIFP60100100mADCForward CurrentIF25mAReverse VoltageVR5VOperating Temperature RangeTopr-4085Storage Temperature RangeTstg-40100 IFP condition: pulse width 1ms ,duty cycle 1/10

7、 Electrical Optical Characteristics(Ta=25)ParameterSymbolMinTyp.Max.UnitTest ConditionLuminous IntensityIVRed72140-mcdIF =20mAGreen300550-Blue80140Forward VoltageVFRed-2.02.4VIF =20mAGreen-3.33.6Blue-3.33.6Reverse CurrentIRRed-10uAVR=5VGreen-50Blue-50Dominant WavelengthdRed-624-nmIF=20mAGreen-525-Bl

8、ue-470-Spectral Line Half WidthRed-20-nmIF=20mAGreen-35-Blue-35-Viewing Angle21/2/-120-Deg.IF =20mAPage 8 of 8 Soldering Pad Dimensions: Soldering Conditions(Maximum allowable soldering conditions)Reflow soldering profileTemperatureTime Reflow soldering should not be done more than two times. Do not

9、 stress its resin while soldering. After soldering,do not warp the circuit board. Package Tape Specifications: (2000 pcs/Reel) Feeding, DirectionDimensions of Tape Typical Electro-Optical Characteristics Curves:Reliability(1) Test Items and ConditionsNOTest ItemTest ConditionsSampleAc/Re1Temperature

10、 Cycle-4052551005255(30min,5min,30min,5min) 100 Cycles200/12High Temperature StorageTa:1005Test time=1000HRS(-24HRS,+72HRS)200/13High Temperature AndHigh Humidity WorkingTa:855,RH:855%,IF=15mA Test time=500HRS(-24HRS,+72HRS)200/14Low Temperature StorageTa:-405Test time=1000HRS(-24HRS,+72HRS)200/15Op

11、erating Life TestConnect with a power IF=20mA Ta=Under room temperatureTest time=1000HRS(-24HRS,+72HRS)200/16Thermal Shock-4051005(15min,15min) 100 Cycles200/17IR-Reflow Pb-Free Process80100120160170235270255,60cm/min,2 times200/1(2) Criteria of judging the damageItemSymbolTest conditionCriteria for

12、 judgementMin.Max.Forward voltageVFIF=Test Current/U.S.L*1.1Reverse currentIRVR=5V/15uALuminousintensityIVIF=Test CurrentL.S.L*0.7/Wave lengthD/PIF=Test Current/U.S.L2nmAppearance/View checkNo mechanical damage* U.S.L: Upper standard levelL.S.L: Lower standard level Cautions1、PackageWhen moisture is

13、 absorbed into the package it may vaporize and expand during soldering. There is apossibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package.2、StorageBefore opening the package: The L

展开阅读全文
相关资源
相关搜索

当前位置:首页 > 行业资料 > 其它行业文档

电脑版 |金锄头文库版权所有
经营许可证:蜀ICP备13022795号 | 川公网安备 51140202000112号