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1、Innolux Display Corporation MB-IQC,By: billji,1. IC in Tray,Gold Bump,A:15 um B:50 um C:20 um,IQC IC Inspection,2. Appearance Inspection,3.Dimension Measured,A,Bump (ACF cleaned),Conductive Particle,Bump (after bonding),3.1um,Concern Point(condutive particle 3.1um only),Innolux Display Corporation M
2、B-IQC,By: billji,IC conduction problem,1.Bump 高度差,2.Back side grinding cause uniformity issue,Gold Bumping Process Introduction,J.B. Chyi Wafer Engineering Division,1.1 Process Flow:,1.2 Process,Incoming wafer,PI Coating,PR Coating,Exposure,Mask,PR Stripping,UBM Sputtering,PR Coating,Mask,Exposure,P
3、lating,PR Stripping,Etched UBM,PI + Bumped Wafer,1.4 Process information,Stage Equipment Process Incoming Wafer Auto loader/un-loader OM UBM Sputtering Single wafer sputtering system Alumina etching Batch type sputtering system Ti/W layer + Au layer Lithography Coater/Developer track Positive resist
4、 stepper 22m Electroplating Cup type single wafer Sodium sulfite (non-cyanide)1518m Stripping Track & wet bench Organic solvent Gold Etching Wet bench Iodine/iodide (non-cyanide) Ti/W Etching Wet bench Hydrogen peroxide Anneal N2 Oven,Technology,2.1 Road map,2.2 Gold bumping design guide,2.3 Future development,2025um pitch gold bump according to market. finer grain size , less bump surface roughness for next generation gold bump flip chip assembly application. higher plating speed and litho process condition optimization for throughput enhancement.,
