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1、Camera ModulePrepared ByPrepared By：Kim JinKim Jin内容大纲内容大纲内容大纲内容大纲l常见封装方式1.1.PLCC/CLCCPLCC/CLCC（ Plastic/Ceramic Leaded Chip Carrier Plastic/Ceramic Leaded Chip Carrier ）2.2.CSPCSP（ Chip-Scale Package Chip-Scale Package ）3.3.COBCOB（Chip On BoardChip On Board）4.4.COFCOF（Chip On FpcbChip On Fpcb）5.5.F
2、LIP CHIPFLIP CHIP（芯片倒装）（芯片倒装）Camera ModuleCamera Module常见封装方式常见封装方式常见封装方式常见封装方式Single Chip Solution (ISP embedded type) 1) Module assembly using with prepackaged plastic or ceramic unit CONNECTORLENS HOLDERFPC(CIS + ISP) CHIPPCBPrepackaged Ceramic unitLENS ASSYIR CUT FILTERPASSIVE STIFFENERCamera Mo
3、duleCamera Module常见封装方式常见封装方式常见封装方式常见封装方式Single Chip Solution (ISP embedded type)2) Module assembly using with prepackaged Glass CSP unit CONNECTORLENS HOLDERFPCPrepackaged GlassCSP unitPASSIVE STIFFENERLENS ASSYIR CUT FILTERSTIFFENERCamera ModuleCamera Module常见封装方式常见封装方式常见封装方式常见封装方式Single Chip Solu
4、tion (ISP embedded type)3) Module assembly using with Chip On Board (COB)CONNECTORLENS HOLDERFPCWIREPASSIVE DVC(CIS + ISP) CHIPLENS ASSYPCBIR CUT FILTERCamera ModuleCamera Module常见封装方式常见封装方式常见封装方式常见封装方式ACFPassiveIR FilterCMOSCONNECTORSingle Chip Solution (ISP embedded type) 4) Module assembly using
5、with Chip On FPC（COF）Camera ModuleCamera Module常见封装方式常见封装方式常见封装方式常见封装方式Single Chip Solution (ISP embedded type)5) Module assembly using with flip-chip bonding technologyCONNECTORLENS HOLDERFPCPASSIVE DVCLENS ASSYSUBSTRATEIR CUT FILTER OR GLASSCIS CHIPACFCamera ModuleCamera Module常见封装方式常见封装方式常见封装方式常见
6、封装方式Single Chip Solution (ISP embedded type) 4) Module assembly using with chip stacking methodCONNECTORLENS HOLDERFPCWIREPASSIVE DVCDSP CHIPLENS ASSYPCBIR CUT FILTERCIS CHIPCamera ModuleCamera Module常见封装方式常见封装方式常见封装方式常见封装方式Two Chip Solution (Image sensor & DSP)2) Module assembly using with DSP embe
7、dded PCBCONNECTORLENS HOLDERFPCWIREPASSIVE DVCDSP CHIPLENS ASSYPCBIR CUT FILTERCIS CHIPCamera ModuleCamera Module常见封装方式常见封装方式常见封装方式常见封装方式Two Chip Solution (Image sensor & DSP)3) Module assembly using with DSP on the back sideCONNECTORLENS HOLDERFPCWIREPASSIVE DVCDSP CHIPLENS ASSYPCBIR CUT FILTERCIS
8、CHIPCamera ModuleCamera Module常见封装方式常见封装方式常见封装方式常见封装方式Camera Module Design ProcessStructure for sample buildModule DimensionChip InformationA. Video FormatB. Pixel Size C. Image Area SizeD. Image Area Position(X, Y)E. Chip SizeF. Wafer ThicknessG. Chip shiftLens designLens SpecA. Lens constructionB.
9、 Angle of viewC. Focal lengthD. Relative apertureE. Relative illuminationF. Back focal lengthG. EtcLens assy designSubstrate DimensionA. PCB size & thicknessB. Bottom mold size &thicknessC. PCB pin hole size & positionHolder design IR filter sizeFPC informationA. Module mounting method (Direct main board insert or FPC)B. FPC bonding land layoutC. ZIF connector modelD. FPC lengthFPC designPacking informationA. Tray dimensionB. Tray arrayTray designBoard design
