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1、Nan Ya CCLCCL Technical Dept., Electronic Materials Div.Nan Ya Plastics CorporationTAIWANNan Ya MultilayerNan Ya MultilayerPCB LaminatesPCB Laminates南亚PNHF材料介绍Nan Ya CCLEnvironmental ProtectionSignal Speed&IntegrityReliabilitySmaller Form FactorPCB TechTrendsBuild up/HDIPhosphorous FreeImpedance Con
2、trolNarrower LineSpacingFlexibleEmbedded PassivesHigh Layer CountLow Dk/Low LossHi TgInsulationLow CTEHalogen FreeLow Water AbsorptionCAF-Resistant產品開發與應用產品開發與應用產品開發與應用產品開發與應用Lead Free CompatibleNP-200 (BT Grade) NP-180F (Hi Tg & Low CTE) NP-175(F) NP-155(F) NP-170 NP-150 NP-140M(Low Tg/Hi Td) Anti-
3、CAF Materials High CTI FR4 NPG NPGN-150NPG-170NPGN-170 NPX-200 (For Substrates) Bendable CCL Laser Prepreg RCC2 mil & 3 mil CoresUltra thin glass yarn1037Embedded CapacitanceNPLDII & Low Dk glass南亚PNHF材料介绍Nan Ya CCL南亞產品列表南亞產品列表TG Tg by DSC Suitable for Lead Free Optional for Lead Free NPG(Halogen Fr
4、ee)NPG-200NPG-170NP-LDII NP-175/FNP-170NP-155/FNP-150FR-4 D/S200NPG-180 High Tg(H.F) high layer count MLB IC SubstrateNP-200BT Laminate IC Substrates BT Laminate (H.F) IC Substrate NP-180/FFR-5 Gradehigh layer count MLB IC SubstrateRCCFR-4 Gradehigh layer Count MLB High Tg (H.F) high layer count MLB
5、High performance FR-4 Special applicationFR-4-86 UVFR-4-98 CTI 600NPGNPGN-150 Halogen Free FR-4NP-140MNP-140FR-4 Tetra-functional for MLB180CEM-3CEM-1CEM-3-86/CEM-3-01 Halogen freeCEM-1-87/ CEM-1-97 CTI600Laser PP Laser drillable prepreg for HDI175150140135130Low Dk/DfHigh frequency/low loss Resin c
6、oated copper for HDI180180O O O O O O南亚PNHF材料介绍Nan Ya CCL印刷電路板印刷電路板(PCB) 應用應用NP-180RCCLaser P.P移动电话移动电话HDI产品产品CEM-1CEM-3电源供应器，监视电源供应器，监视器，电视游戏器，电视游戏NP-140MNP-140個人電腦個人電腦, 筆記本筆記本電腦電腦,個人電腦外個人電腦外設設FR-4 個人電腦個人電腦, 筆記本筆記本電腦電腦 ,個人電腦外個人電腦外設設NP-155(F)NP-150個人電腦個人電腦,笔记本笔记本电脑电脑 PCMCIAPCMCIA卡卡NPGNNPG個人電腦個人電腦& 筆
7、記本筆記本電腦磁盤驅動器電腦磁盤驅動器NPG-180BGA, CSP, 網絡服務器網絡服務器 NP-200BGA, CSPBGA, CSPNPG-200NP-LD基站基站NP-175(F)NP-170通信服務器通信服務器BGA, CSP, 汽車網絡服務器汽車網絡服務器南亚PNHF材料介绍Nan Ya CCL“ “無鉛無鉛無鉛無鉛” ”對元件組裝影響對元件組裝影響對元件組裝影響對元件組裝影響無鉛組裝之焊錫材料熔點更高無鉛組裝之焊錫材料熔點更高回流焊過程有更高的溫度曲線回流焊過程有更高的溫度曲線焊錫類型焊錫類型熔點熔點()()I.R I.R 最高溫度最高溫度（) )高溫高溫. .Sn-Ag-CuS
8、n-Ag-Cu(96.5 3 0.3)(96.5 3 0.3)217217220220245245260260較高溫度較高溫度. .Sn-Ag-Cu-Bi(in)Sn-Ag-Cu-Bi(in)210210220220235235245245一般一般Pb-SnPb-Sn(33 67)(33 67)183183225225230230南亚PNHF材料介绍Nan Ya CCL Soaktime Ramp-uprate Leadfreereflow(SnAgCu) Tin/Lead(63/37)reflow 迴流焊溫度曲線比較迴流焊溫度曲線比較T:30-44T:20-30PeakTempTimeabo
9、veliquidus(TAL)500100150200250MeltingpointLFMeltingpoint南亚PNHF材料介绍Nan Ya CCL高耐熱性高耐熱性(Br-樹脂樹脂)覆銅板產品系列覆銅板產品系列NP-150NP-200NP-180TG()NP-140200180175150140BTLaminateFR-5GradeMediumTgFR-4FR-4NP-180(F) NP-175NP-175F NP-155NP-155FNP-140Modify(New)NP-140Modify(New)HighThermalStabilityMaterialNP-170HighTgFR-4
10、南亚PNHF材料介绍Nan Ya CCLNP-140NP170NP140MNP-155FNP-175FThickness(mm)1.61.61,61.61.6DSCTg135171135155170PeelStrength(1oz)12.510.511.59.59.51/2hrPCTmoisture0.226%0.190.2100.15%0.147%1/2hrPCT+288solderdipping330”430”10”1010Z-axis1/ppm/67.1606548.349.5Z-axis2/ppm/288.0285289256.5259.7CTE50-260%4.33.74.33.33
11、.1T-288delamination2.07min255min30min30minT-260delamination25.03min253030min60min60minTGATd(onset)309.2311323.5357359TGA5%WtLoss311.3312.2325.9360361FR-4,NP-155F,NP-175F特性比對特性比對南亚PNHF材料介绍Nan Ya CCLIPC規范規范vsNanYa材料材料南亚PNHF材料介绍Nan Ya CCLItemFR4NPGNPGN-150NPG-170NPGN-170NPG-180NPG-200Resin systemBr. Ep
12、oxyHalogen FreeHalogen FreeHalogen FreeHalogen FreeHalogen FreeHalogen FreeCuring agentDicyDicy Non DicyDicyNon DicyNon DicyNon DicyTg (,DSC)140150145(TMA)170170190(DMA)205(DMA)CTE(%,50250)4.12.42.42.32.42.22.0T-260(min)25606060606060T-288(min)25205204040Td(,TGA)310350360359360367370Dk(1GHz)4.504.60
13、4.504.604.534.824.40Df(1GHz)0.0160.0120.0130.0120.0130.0150.013Rigid construction: 4 ply 7628NPG: “G” for Green (HF) Materials南亚各系列无卤材料特性南亚各系列无卤材料特性比較比較南亚PNHF材料介绍Nan Ya CCLHATSHATS冷热冲击测试结果冷热冲击测试结果冷热冲击测试结果冷热冲击测试结果MaterialAconditionPre-condition245reflowx6Pre-condition260reflowx6一般材料一般材料162-247150-266
14、142-227Mid-TgPN+填充材填充材10001000800-900Hi-TgPN+填充材填充材100010001000无卤材料无卤材料100010001000TestCondition:-40-145/1000cyclesSample:12-layertestvehicle南亚PNHF材料介绍Nan Ya CCL热膨胀特性热膨胀特性热膨胀特性热膨胀特性Expansion,PPM/一般材料一般材料PNFR4+填充材填充材HiTg无卤材料无卤材料X-CTEY-CTE151815181315131511131113Z-CTE,BeforeTgZ-CTE,AfterTg582874526035
15、.3210南亚PNHF材料介绍Nan Ya CCL线路板加工之影响一般材料一般材料无卤材料无卤材料钻孔钻孔2,000钻钻1,500钻钻除渣除渣OK需调整制程条件需调整制程条件黑棕化药水黑棕化药水OK接着力较低接着力较低 压合压合操作空间操作空间較較广广需调整制程条件需调整制程条件印刷线路板加工条件之建议印刷线路板加工条件之建议印刷线路板加工条件之建议印刷线路板加工条件之建议南亚PNHF材料介绍Nan Ya CCL钻孔条件钻孔条件Machine Hole sizSpeedInfeedRTRThkPNL/StsckSchmoll LZ0.30mm160 Kr/min134 IPM437 IPM1.
16、62 ply钻头磨损比较钻头磨损比较1000 hit2000 hit3000 hit Total (48000 hit)NPG 24.46%30.72%36.52%30.56%NPGN-15025.28%27.32%32.93%28.51%NPG&NPGN-150鑽孔比對測試鑽孔比對測試南亚PNHF材料介绍Nan Ya CCL钻钻孔精度孔精度比較比較NPGNPGN-150Cp/Cpk1.334/0.7851.859/1.204Target ( 2.0 mil )1325/48098660/481042.75%1.37%南亚PNHF材料介绍Nan Ya CCL钻头磨耗比较钻头磨耗比较新新钻头钻头
17、 FR4PN+填充材填充材无卤材料无卤材料条件条件Rpm:200KIPM:114.2Hits:3500Hole size:10 mil南亚PNHF材料介绍Nan Ya CCLMaterialtypesBlackOxideBrownOxideChemicalABCDStandardFR44.933.854.563.57NPG3.233.123.012.74NPGN-1503.693.463.593.12Unit:lb/in无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较南亚PNHF材料介绍Nan Ya CCL無鹵材性能比較表
18、無鹵材性能比較表-CCL南亚PNHF材料介绍Nan Ya CCLNPG(Dicy)NPGN-150(PN)PCBLayer10L14LThicknessmm1.8-2.02.4-2.5DSC-Tg155150.6288Solderfloating10”-6cycles10cycles260IRReflowcycles-6-7cycles10cyclesT-260min8.5824.06T-288min2.258.68PCBLayer2+4+23+2+3Thicknessmm1.00.8DSC-Tg156.8150.5260IRreflowcycles-10-1215T-260min25.42-T-288min2-530無鹵材性能比較表無鹵材性能比較表-PCB南亚PNHF材料介绍Nan Ya CCL南亞無鹵材市場應用狀況南亞無鹵材市場應用狀況南亚PNHF材料介绍Nan Ya CCL謝謝指教謝謝指教謝謝指教謝謝指教http:/南亚PNHF材料介绍
