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1、制制工工 ME修訂日修訂日Rev Date注意事項注意事項 Notes:使用材料使用材料 Material Used: 制作制作 Prepared By品品管管 QA發行發行Issue制訂日制訂日Pre Date核定核定 Approved By作業步驟作業步驟Operation Procedure:操作條件操作條件Operation Condition:頁次頁次PagePage版次版次Rev.規規 范范 編編 號號Standard NO.設備設備( (工具工具) ) Equipment Tool工站名稱工站名稱 Station產產 品品 料料 號號Product No.圖示圖示Figure:N
2、/A AX22PLTSW00032007-3-20劉文瑞/30FOXCONN INTERANTIONAL HOLDINGS.,LTDSTANDARD OPERATION PROCEDURE 制造作業規范制造作業規范CGMHPA-0001環境條件 : 相對濕度:40%-70%; 溫度:23 4,照明:11001300LUX Environment : relative humidity:40%70%, Temperature:234,lighting:11001300LUX使用設備: QUICK203H電烙铁 Using Equipment: QUICK203H Solder Iron助焊膏使用
3、要求: 按HP輔料要求標準 EL-MF862-07 14條規定. Using flux cream demand: according to 14 spec the HP assistant materials EL-MF862-07 of standard. 1.设置烙铁温度為360380度之間; Set Iron proper temperatures:3603802.將1pc PCBA平放於治具中. Put a PCBA in the fixture and make sure that is on right place.3.再取1PC WIFI天線,將WIFI天線的兩個腳對准PCBA
4、上相對應的兩個孔.(如圖一） Made the Antenna WIFI pin aim at the PCBAs two hole of speaker location. (Fig.2)4.用牙簽取少量助焊膏, 塗抹於PCBA相應的WIFI天線焊點上,然後用手按住WIFI天線,防止其偏移,用烙鐵進行焊接(圖二),直到觀察焊錫完全熔化(12秒) Adding some flux with tooth pin onto the soldering pad of the Antenna WIFI. Then, press WIFI antenna to avoid shifting, and t
5、hen solder with iron until all the solder melted (the time 12s) .(Fig.2)注意: 焊接過程中, 烙鐵不能碰到Antenna WIFI,以免燙壞Antenna WIFI. Notice: Do not bump or knock the part by iron during manual solder.5.焊接完畢後, 按壓WIFI天線的動作不應立即停止,應持續23秒,以防由於板受熱變形,影響焊接效果 When the solder finish, the Action of press Antenna WIFI dont
6、stop offhanded,. Should sustained23s, prevent the thin PCBA distortion due to adding hot Influence the solder effect.6.在主板的BT天線兩個Pad點上涂上適量的助焊膏.然后插上BT天線,確保卡合到位,用手指按住BT天線,再用鉻鐵進行焊接,直到觀察焊錫完全熔化(12秒) Add some solder flux onto the two pads of BT, then insert the BT antenna to make sure it properly engaged
7、into the PCBA and then solder with iron until all the solder melt (the time 12s) .7.焊接完畢後,按壓BT天線的動作不應立即停止,應持續23秒,以防由於板受熱變形,影響焊接效果 When the solder finish, the Action of press Antenna BT dont stop offhanded,. Should sustained23s, prevent the thin PCBA distortion due to adding hot Influence the solder
8、effect.8. 檢查WIFI天線和BT天線有無偏位, 焊點焊錫是否均勻平整,(圖四) 確認OK後流入下一工站. Inspection the Antenna WIFI and ANTENNA_BT location if shift and solder pad if level up with magnifier ,(Fig.4) if ok places inflow the next station.1. 檢查所需治具與工具,是否與要生產機種相符且功能 正常,若有問題請通知領班協助處理。 Make sure the fixture and tools required are in
9、accordance with the model produced and their functions are OK. Inform line supervisor if there is any problem.(Fig.1-2)2. 作業員需配戴靜電環和手指套,并且靜電環接於桌子 下方接地插孔。 Operator must wear wrist straps and finger cover. Ensure that the wrist strap is plugged into the hole desk below which connect with the ground.3.
10、 作業員應對此工站的完成件進行自檢,注意WIFI天 線和BT天線組裝方向不能反向。 Operator self-check sub-assy after finished operation4. 整個操作過程中注意不可碰撞電子元件。 No component damaged in the whole operation.5.焊盘上要有适当数量的锡避免虚焊. No touch ups are allowed (Fill lands with a good amount of solder to avoid unsolder leads).圖 一Fig.1焊接時需用手按住WIFI天線,防止其脫落及
11、偏移Press WIFI antenna for soldering to avoid Shifting圖二Fig.2圖三 Fig.3 WIFI天線上的兩個孔位 Two holes for WIFI焊點焊錫要均勻平整The solder of pad should be level up 圖四Fig.4焊接時需用手按住BT天線,防止其脫落及偏移Press BT antenna during soldering to avoid shifting焊接焊接BT&WIFI Solder BT&WIFIMaterialH.H P/NCUS P/NQtyBT天線ANTENNA_BTS0A4037B000S0A4037B0001pcWIFI天線ANTENNA_WIFIS0A4037W000S0A4037W0001pcPlato主板Main Board31PLTM1000D31PLTM1000D1pc1電烙鐵電烙鐵, ,助焊膏助焊膏固定治具固定治具
