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1、PEC电子工程英语证书考试-半导体词汇汇总1号极限开关LS1(limit suitch 1)232 bus的使用寿命已到或线路短路或断路232 bus error488 bus的使用寿命已到或线路短路或断路488bus error5S(整理、整顿、清扫、清洁、修养)5S（Seiri-Seiton-Seiso-Seiketsu-Shitsuke)5u之pp质滤心cartridge p.p 5uABC分类法ABC classificationAUTO模automatic molding systemA板A plateBT指示剂eriochrome black t indicatorB板B plat
2、eCO2气泡机CO2 bubblerDIP 产品上的裂角任何一方向大于1.25mm且另一方向亦大于0.5mm拒收Any device having a chip out greater than 0.5mm in width (or depth) and 1.25mm in length is rejectable.DIP 从胶体末端算起,支持棒突出部分不得大于0.25mm(SOP为0.15mm)。The product is rejectable when pad support protrudes more than 0.25mm from the end of the package b
3、ody.(sop:0.15mm).DIP：不符合脚量规之脚弯拒收。Any device showing bent leads (in case of doubts use the applicable gauge) is rejectable.DIP：不均匀的镀层表面，使得小脚厚度大于0.4mm或宽度大于0.5mm或大脚以上厚度大于0.75mm，拒收。Non-uniform solder such that a lead exceeds the dimensions of 0.4mm thick and 0.5mm wide below the seating plate, or an ove
4、rall thickness of 0.75mm above the seating plane is rejectable.DIP：从脚尖端到肩膀弯脚处，脚的镀层表面须均匀且连续。Lead finish on the leads shall be smooth and continuous from lead tip up to and over bend of lead.DIP：顶出孔不得高于胶体面或低于胶体表面0.5mm。Ejector marks more than above the surface or more than 0.5mm below the surface of th
5、e device is rejectable.DIP：离胶体0.5mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。Lifting, peeling or flaking of the lead finish is rejectable excluding 0.5mm from the body.DIP：小脚上不得有任何外来物造成之沾污。大脚上不得有大于0.15mm直径圆面积之沾污。Package leads shall be free from attached foreign material except for foreign material located above the sea
6、ting plane of the lead, not bigger than 0.15mm in diameter.DIP：由于冲切造成之支持棒残存凸出或大脚凹陷大于0.25mm拒收。Any lead with dam bar step dimensions exceeding 0.25mm is rejectable.Driver board的使用寿命已到或线路短路或断路driver board errorEDTA-2NA 标准溶液EDTA-2NA standard solutionEprom的使用寿命已到或线路短路或断路eprom errorKBS 94 混床树脂筒leasing mix
7、 bed resin bottle, kbs 94L/F存放架stack loaderL/F放反将导致反弯脚。Lead frame reverse will cause reverse bending.L/F排放机Lead Frame Auto Loader MachineL/F用剥锡剂 TLS-85asolde stipper for plastic package,TLS-85aL/F用剥锡剂 TLS-85bsolde stipper for plastic package, TLS-85bL/F用剥锡剂 TLS-86solder stipper for plastic package,T
8、LS-86L形尾塞end plug (L)L型尾塞end plug(L)MPU的使用寿命已到或线路短路或断路MPU errorN2流量nitrogen gas flow rateOC曲线poprtation curveP.P 打包袋P.P BandPDCA管理循环PDCA（Plan-Do-Check-Action)PIN1标示PIN1 identificationPIN1标示要有且与规格所订的尺寸一致。The PIN1 identification must be present and in accordance with the specified dimensions.PP材质阳极袋an
9、ode bag p.p.QA允收章QA markQFP用的塑胶承载盘QFP plastic trayRAM的使用寿命已到或线路短路或断路RAM read/write error即RAM errorSOP：不均匀的镀层表面，使得脚的宽度大于0.5mm或脚厚度大于0.25mm。Non-uniform lead finish such that a lead exceeds the specified dimensions 0.5mm or leadl thickness exceeds 0.25mm is rejectable.SOP：产品边缘上的裂角宽或深大于0.2mm，长大于0.6mm或露出体
10、材料拒收。Any devices having a chip out greater than 0.2mm width(or depth) and 0.6mm in length or exposed lead frame material is rejectable.SOP：顶出孔低于胶体表面0.2mm，或是高于胶体表面拒收。Ejector marks more than above the surface or more than 0.2mm below the surface of the device is rejectable.SOP：脚浮不得超过0.1mm。Lead coplana
11、rity shall be within 0.1mm of one another in the vertical direction.SOP：脚上不得有任何外务物之沾污，但如果是废胶则不能大于50脚宽为直径的圆面积。Leads shall be free attached foreign material, flash shall not exceed 50% of the lead surface.SOP：离胶体0.2mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。Lifting, peeling or flaking of the lead finish is rejectable ex
12、cluding 0.2mm of the lead length from body.SOP：由于冲切造成之支持棒残存凸出或凹陷大于0.1mm时拒收。Any lead with dam bar step dimensions exceeding 0.1mm is rejectable.S形尾塞end plug (S)XX部门经理manager of XX departmentXX电子有限公司XX Electronics CO.LtdX管率X-ray yieldX射线X-rayX-射线检验X-ray inspection安全光幕safety curtain安全库存量safety stock安全眼
13、镜safety glasses氨水ammoniam water按下紧急按钮。Press the emergency button.按需订货lot for lot昂球lifted bond昂楔lifted wedge凹模cavity plate,cavity block百万分之一PPM (parts per million)柏拉图Pareto chart板状模组模具plate mold半导体semiconductor半球insufficient ball size半自动框架输送机off loader包反wrong orentation molding包反wrong orientation mol
14、ding包封molding包封molding 包封模具mold chase包封模具mold chase包封偏差molding mismatch包装packing包装packing 包装盒(内箱)packing box包装盒缺点packing defect criteria包装外箱shipping box保管费carrying cost保管费率carrying cost rate保险期safety time保压时间holdup time保质期shelf life报废scrap备注remark背金/银backside metal (Au/Ag)背面back side背面打印back marking
15、崩角chip package崩碎chips比重specific gravity比重specific gravity比重计hydrometer闭环物料需求计划closed loop MRP闭模时间closing time边筋翘起bending side rail边晶edge die边晶reject die around slice edge边框side rail边沿芯片edge die编带Tape & Reel编带tape/real编带拉力测试peel back force test编织层braid扁平电缆flat cable,ribbon cable扁球flat ball变差variation变色discoloration变色（发黄，发黑，发花，水渍，酸斑）d
