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1、印刷電路板設計規範Print Circuit Board Layout RuleHON HAI PRECISION IND. CO., LTD.HSINCHU SCIENCE PARK BRANCH OFFICEPROPRIETARY NOTEThis item is the property of Hon Hai Precision Ind. Co, LTD., Taiwan, and contains confidential and trade secret information. This item may not be transferred from the custody of
2、 Hon Hai, except as authorized by Hon Hai Precision Ind. Co, LTD. and then only by way of loan for limited purposes. It must not be reproduced in whole or in part and must be returned to Hon Hai Precision Ind. Co, LTD. upon request and in all events upon completion of the purpose of the loan.設計規範修改履
3、歷表項目日期版本變更說明負責人11999/12/200無覃桂芳鄭雅慧黃介彥 22001/12/1111. 重新檢討SMT, Wave Solder與手焊設計規範.2. 新增自動插件機設計規範.譚瑞梅鄭雅慧蔡育誌周有麟3 2002/8/121.修改Chip R, C Pad設計.2.新增零件Pad設計 : 0.4mm Pitch QFP, CSP, MLFP, Filter, Crystal, CP Point, Transformer, LED.3. 新增無折斷邊設計規則.4. 新增零件角度定義.5. 修正Fiducial Mark設計.6. 測試點規格變更覃桂芳鄭雅慧蔡育誌周有麟42003/
4、8/131.修改折斷邊導圓角,via_hole蓋綠漆原則,最小排版尺寸,金手指no_used pin取消：2.修改SMT零件Pad設計 3.新增撈孔裂片設計原則4.新增UV點膠限制5.新增C型螺絲孔設計,橢圓孔設計,Ring Pad設計, PCB表面焊接Pin與Pad尺寸,淚滴設計覃桂芳鄭長秦黃介彥蔡育誌52004/11/1841. 增长英文對照2. 修改1808電容靠板邊設計條件(P14)3. 修改金手指設計條件(P22)4. 修改V_CUT規格(P10)5. 修改Via-hole規格(P18)6. 修改排板標準(P23/P24/P25)7. 修改高壓電容底部撈孔限制(P26)8. 修改BG
5、A可不加辨識點條件(P30)9. 修改SMT零件Pad設計(P38/P47/P53/P59/P60)10. 增长BGA/CSP PCB表面處理限制(P48/P49)11. 刪除後焊屏蔽設計,增长易開罐式屏蔽設計(P61)12. 修改背面印膠PAD SIZE(P68,P69)13. 修改Wave solder與手焊設計規範(P72.P73,P77,79,P80,P81,P84)14. 修改自動插件機設計規範(P85,P91)鄭長秦黃介彥蘇柄綺吳瑞祥葉霙秋目錄 Table of Content.前言 Introduction.PCB機構設計 Mechanical Design for PCB 1.
6、折斷邊設計 Break-away Design Rule 1.1定位孔 Tooling Hole 1.2光學對位記號 Fiducial Mark 1.3郵票孔Routing Tab 1.4 V-形切槽 V-Cut1.5 PCB板厚規格 PCB thickness2.限制區 Limitation / Restriction 2.1機構限制區 Restriction for Mechanism 2.2郵票孔限制 Restriction for routing tab 2.3 V-cut限制 Restriction for V-cut2.4 PCB外形尺寸限制 Limitation for PCB
7、Outline Dimension2.5 銅柱製程限制 Restriction for Stand off Process 2.6 PCB變形量限制 Limitation for PCB Warpage2.7 PCB外形缺口限制(含排版) Restriction for PCB outline Slot Hole (including panelization) 2.8 TRACE限制 Restriction for Trace 2.9 VIA HOLE設計 Restriction for Via Hole 2.10測試點置放旳規則及限制Restriction for Test Point3.
8、金手指 Golden Finger4.排版 Panelization.PCB零件設計 Component Design for PCB5.零件擺置方向 Orientation of Component Placement6.光學辨識點 Fiducial Mark on QFP & BGA 6.1 金屬基板辨識點外形規格 Fiducial mark on metal PCB 6.2 PQFP & BGA辨識點外形規格 Fiducial mark on PQFP & BGA7.文字面與極性標示 Legend and Polarity Mark 7.1表面黏著元件 Surface Mount Com
9、ponent (device) 7.2鑽孔元件 Drill hole component 7.3標籤黏貼位置在文字面上旳標示 Legend for Label Position 7.4標準零件間距 Space between Components8.迴焊製程規範 Reflow Process 8.1 PAD 表面噴錫厚度 Thickness of Hot Air Solder Level 8.2迴焊製程使用PAD尺寸Pad Dimension for Reflow Process9.其他 Others.Wave Solder與手焊設計規範 Design rule for Wave Solder
10、 and Manual Soldering10.一般性規格 General Specification11. PCB 外形尺寸 PCB Dimension12.螺絲孔設計 Design for Screw Hole13.背面SMD印膠PAD SIZE Pad Design for SMD with Red Glue Printing14.零件擺放限制 Limitation of Component Placement15. PCB過錫爐方向 PCB Direction on Wave Solder16.一般零件孔徑與線徑 Hole size and Lead Diameter17.功率晶體之間
11、距離 Pitch of Power Transistor18. PCB外形有缺口時需補齊缺口 Patch on PCB19. PCB 表面焊接PIN與PAD尺寸 Pin and Pad Dimension on PCB Surface20. 波焊製程CP點內距 Space between CP for wave solder process21. 打鉚丁限制區域 Limitation of rivet 22. DIP與DIP 零件之間PAD距離Space between pad of DIP components. 自動插件機設計規範 Design Rule for Automatic dip
12、 machine23. R/I (立式)之Layout原則 Layout Rule for Radial Component24. R/I PCB尺寸/厚度 Dimension/Thickness of Radial Component25. R/I定位孔 Alignment hole for R/I26. R/I零件旁邊零件距離限制 Limitation of Space from R/I Component27. A/I (臥式) 之Layout原則 Layout Rule for Axial Component28. 淚滴PAD Tear Drop Pad29. A/I臥式零件與旁邊零件
13、距離限制Limitation of space from axial component.前言 Introduction1.目旳Purpose：基於生產製程需求，及讓電路板佈置設計，有一標準規範可依循，並期望所佈置電路板，在組裝時，能高效率生產，易組裝及測試，並可得到高品質，低成本之目標，而製訂此規範。This specification provides guidance to Hon Hai engineers for the design of print circuit board in all Hon Hai products. The purpose of this specifi
14、cation is to ensure that all PCBs designed by Hon Hai are able to have high yield, human friendly assembly and test. To meet customer requirements, getting high quality and low cost is the goal of this specification.2.適用範圍Scope：此規範僅適用於可攜式電腦，電源及通訊產品之電路板設計時使用。The design of notebook, power and communic
15、ation product must meet this specification.3.修改Revise：*若對規範內容有建設性之意見，請反應至製程工程單位，製程工程與相關單位討論後，進行後續修改作業。*如有變更零件設計規格時,需更新零件包裝資料庫。*此規範至少每半年更修一次。*Please inform manufacturing engineer if any department has any suggestion for this specification. Manufacturing engineer has to discuss it with relative department and then continuously revise this specification.
