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1、资料内容仅供您学习参考，如有不当之处，请联系改正或者删除。* Process Module 说明 : A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料发料 (Panel)(Shear material to Size) B. 钻孔 (Drilling) b-1 内钻 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射钻孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔
2、(Blind & Buried Hole Drilling) C. 乾膜制程 ( Photo Process(D/F) c-1 前处理 (Pretreatment) c-2 压 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 显 影 (Developing) c-5 蚀铜 (Etching) c-6 去膜 (Stripping) c-7 初检 ( Touch-up) c-8 化学前处理,化学研磨 ( Chemical Milling ) c-9 选择性浸金压膜 (Selective Gold Dry Film Lamination) c-10 显
3、影(Developing ) c-11 去膜(Stripping ) D. 压 合 Lamination d-1 黑 化 (Black Oxide Treatment) d-2 微 蚀 (Microetching) d-3 铆钉组合 (eyelet ) d-4 叠板 (Lay up) d-5 压 合 (Lamination) d-6 后处理 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 铣靶 (spot face) d-9 去溢胶 (resin flush removal)E. 减铜 (Copper Reduction) e-1 薄化
4、铜(Copper Reduction) F. 电镀 (Horizontal Electrolytic Plating) f-1 水平电镀 (Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀 ( Tin-Lead Plating ) (Pattern Plating) f-3 低於 1 mil ( Less than 1 mil Thickness ) f-4 高於 1 mil ( More than 1 mil Thickness) f-5 砂带研磨 (Belt Sanding) f-6 剥锡铅 ( Tin-Lead Stripping)
5、 f-7 微切片 ( Microsection) G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 预烤 (Precure) g-3 表面刷磨 (Scrub) g-4 后烘烤 (Postcure) H. 防焊(绿漆): (Solder Mask) h-1 C面印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 静电喷涂 (Spray Coating) h-4 前处理 (Pretreatment) h-5 预烤 (Precure) h-6 曝光 (Exposure) h-7 显影 (Develo
6、p) h-8 后烘烤 (Postcure) h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 喷砂 ( Pumice)(Wet Blasting) h-12 印可剥离防焊 (Peelable Solder Mask) I . 镀金 Gold plating i-1 金手指镀镍金 ( Gold Finger ) i-2 电镀软金 (Soft Ni/Au Plating) i-3 浸镍金 ( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡 (Hot Air Solder Leveling) j-1
7、 水平喷锡 (Horizontal Hot Air Solder Leveling) j-2 垂直喷锡 ( Vertical Hot Air Solder Leveling) j-3 超级焊锡 (Super Solder ) j-4. 印焊锡突点 (Solder Bump) K. 成型 (Profile)(Form) k-1 捞型 (N/C Routing ) (Milling) k-2 模具冲 (Punch) k-3 板面清洗烘烤 (Cleaning & Backing) k-4 V型槽 ( V-Cut)(V-Scoring) k-5 金手指斜边 ( Beveling of G/F) L.
8、短断路测试 (Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查 ( AOI Inspection) l-2 VRS 目检 (Verified & Repaired) l-3 泛用型治具测试 (Universal Tester) l-4 专用治具测试 (Dedicated Tester) l-5 飞针测试 (Flying Probe) M. 终检 ( Final Visual Inspection) m-1 压板翘 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-
9、3 包装 及出货 (Packing & shipping) Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验).Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscop
10、e (AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光.Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Ai
11、r Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号.Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anod
12、e Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准.Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Ax
13、ial-lead轴心引脚.Azeotrope共沸混合液. *B*Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则 Be=145-(145Sp.Gr)凡液体比重比水轻则 Be=140(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对纯水1g/c
