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1、ConfidentialSOP ASSEMBLY PROCESS SOP ASSEMBLY PROCESS FLOW & QUALITY CONTROL FLOW & QUALITY CONTROL INSTRUCTIONINSTRUCTIONConfidentialContentsContents1.Package Instruction2.Process Flow3.Quality ControlConfidentialPackage InstructionPackage Instruction1. SOP2. SSOP3. TSSOP4. MFPASEASEConfidentialPac
2、kage InstructionPackage InstructionConfidentialASY process flowWafer SawWafer SawDie AttachDie Attach Wire BondWire Bond Wafer MountWafer MountWafer GrindingWafer GrindingEpoxy CureEpoxy Cure MoldingMoldingP Post ost MMold old C CureurePlatingPlatingTrim/FormTrim/FormPackingPacking & Shipping & Ship
3、pingDe-junkDe-junkLaser MarkingLaser Marking前段制程后段制程WaferDie (chip)Die on Lead frameEpoxyLead FrameBeforeAfterLaser MarkingLaser MarkingLaser MarkingLaser MarkingConfidentialWafer GrindingWafer GrindingLOADUNLOADGRINGINGPurpose:Grinding the wafer to Customer required thicknessWafer GrindingWafer Gri
4、nding晶圓 (未研磨)研磨機晶圓 (研磨後)Confidential晶元背面Wafer backsideFrameMount TapePurpose: Combine the wafer with Dicing tape onto the frame for die sawingWafer mount MachineWafer MountWafer MountFrameConfidentialPurpose: To separate dies from each other for die attachMonitorLoad/UnloadSawingCleaningMachineWafer
5、 SawWafer SawConfidentialBefore wafer saw:Before wafer saw:After wafer saw:After wafer saw:Wafer SawWafer SawConfidentialPurpose:Attach the dies with epoxy on substrate for the following processDie AttachDie AttachOutputDie bondSubstrate load bondConfidentialWorking flow:Die AttachDie AttachRobber t
6、ipLead-frameEpoxyConfidentialPurpose: Solidify the epoxy after D/AInsideOvenEpoxy CureEpoxy CureConfidentialPurpose: Connecting the chip and the exterior circuitinputinputoutputBond locationTheory: Use ultrasonic, thermal, force to form the intermetallic between golden wire and joint metal (Al, Au,
7、Ag)Wire BondWire BondGold wireleadDieAl padCapillaryConfidentialMold MachineMoldingMoldingPurpose: Seal the product with EMC to prevent die, gold wire from being damaged, contaminated and oxygenic.ConfidentialMoldingMoldingMoldingTop chaseAir vent Bottom chase Cavity Leadframe Plunger PotGate insert
8、Runner CompoundBottom cull blockTop cull blockConfidentialMoldingMoldingMoldingTop chaseAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockTop cull blockPlunger ConfidentialMoldingMoldingMoldingTop chaseAir vent Bottom chase Cavity Leadframe PotGate insertRunner Com
9、poundBottom cull blockTop cull blockPlunger ConfidentialMoldingMoldingAfter MoldMoldingTop chaseAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockTop cull blockPlunger EpoxyLead FrameConfidentialPurpose： Use laser light irradiated by CO2 or YAG to vapour the EMC to
10、 show content on the package，such as date, schedule, place of production and so on.Laser MarkingLaser MarkinglaserEMC vapouredBeforeAfterLaser markingConfidentialOvenInsidePurpose: To let EMC react completely so that products can be protected more effectively.Post mold curePost mold cureConfidential
11、De-junkDe-junkPurpose： Remove the dem-bar of leadframe.Working areaBeforeAfterLaser MarkingLaser MarkingConfidentialPlatingPlatingPurpose: To plating Sn on the lead which will mount on board pad.loadunloadPlating lineConfidentialPlatingPlatingAfterBefore投料區電解去膠高壓噴洗酸洗收料區活化槽電鍍槽中和槽熱D. I.水烘 乾 SOLDER PLA
12、TING (S/P 區)ELECTRO DEFLASH (E/D區 )面板操作ConfidentialPurpose: Remove the tie-bar and lead-frame and form products to units from strips, fill them into tubes and then pass to next process.Trim FormTrim FormSaw work areaunloadWorking areaunloadLaser markingConfidentialTrim FormTrim FormWorking areaLaser
13、 markingunloadunloadLead CutFormingConfidentialQuality ControlQuality ControlDie Saw切偏Chipping外观检查划片宽度量测RejRejConfidentialLead FrameEpoxyDieQuality ControlQuality ControlDie ShearEpoxy Void CheckDie AttachConfidentialQuality ControlQuality ControlEpoxy Thickness & Fillet HeightDie AttachDie Location
14、RejConfidentialQuality ControlQuality ControlWire Bond外观检查第二焊点重叠RejRejRejRej第二焊点偏移线弧不良RejRejConfidentialDieQuality ControlQuality Control推球测试拉力测试Wire BondConfidentialQuality ControlQuality ControlWire Bond验证级工程确认IMC CoverageIMC ThicknessCrater Test1st bond1st bond2nd bondLoopingConfidentialQuality ControlQuality ControlMoldLooping外观检查上下错位孔洞缺角溢胶内部气泡冲线值量测RejRejRejRejRejConfidentialPlating外观检查Solderability test镀层厚度量测Quality ControlQuality Control170C烘烤8小时，9095C蒸汽老化10小时。锡覆盖率95%RejRejRejConfidentialQuality ControlQuality ControlTirm/Form毛刺脚偏漏底材长短脚脚弯异物附着外观检查外形尺寸量测超声波扫描RejRejRejRejRejRej
