世界半导体生产机台安全设计验收标准英文版

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1、 Global Semiconductor Safety Services, LLCSEMI S2-93A Product Safety AssessmentFinal Report世界半导体生产机台安全设计验收标准Applied MaterialsChemical Mechanical Polishing System Model: Mirra TrakCMP工艺应用材料June 19, 1998Prepared for:Applied Materials3111 Coronado DriveSanta Clara, CA 95054Prepared by:Global Semiconduc

2、tor Safety Services, LLC1313 Geneva DriveSunnyvale, CA 94089GS3 Job No. GS3 Document No. F2An independent organization testing for safety and performanceAll services undertaken subject to the following general policy: Reports are submitted for exclusive use of the clients to whom they are addressed.

3、 Their significance is subject to the adequacy and representative character of the samples and to the comprehensiveness of the tests, examinations or surveys made. No quotations from reports or use of GS3 憇 name is permitted except as expressly authorized by GS3 in writing. Client - Confidential 保密合

4、约The information used to prepare this report was based on interviews with Applied Materials engineers. The information was also based on inspections of the Chemical Mechanical Polishing System, Model: Mirra Trak. This information was gathered over the period between February 2, 1998 and February 4,

5、1998, and during a re-inspection of the system on June 3, 1998. A preliminary assessment of the system was also performed on September 25, 1996 through September 26, 1996 and the results of this evaluation were also used. All observations and recommendations are based on conditions and descriptions

6、of the Chemical Mechanical Polishing System, Model: Mirra Trak, during the time of data collection and upon information made available to Global Semiconductor Safety Services. This reports significance is subject to the adequacy and representative characteristics of the Chemical Mechanical Polishing

7、 System, Model: Mirra Trak, and to the comprehensiveness of the tests, examinations and/or surveys made.Reference to Global Semiconductor Safety Services, including reproduction of Global Semiconductor Safety Services service mark, in promotional materials, is permitted only with Global Semiconducto

8、r Safety Services express written consent.The service performed has been conducted in accordance with the standards currently accepted in our profession, and at the high level of skill and care exercised by Global Semiconductor Safety Services staff.Lastly, this report has been prepared as a Client-

9、Confidential document, intended for the exclusive use of Applied Materials and for the purpose of documentation to SEMI S2-93A. Therefore, no outside distribution will occur unless written authorization is provided by the client.Doc. No. F / June 19, 19988fee9e6b966edfaa87bfdd8ab7e1a663.pdf/ Page 94

10、Copyright 1997 by GS3, LLC. All rights reserved.Applied Materials, Model: Mirra TrakSEMI S2-93A Product Safety AssessmentTable of ContentsTABLE OF CONTENTS目录Section Page No.Section 1.0 MANAGEMENT SUMMARY(管理摘要)Section 2.0 SCOPE(范围)Section 3.0 SYSTEM DESCRIPTION(系统描述)Section 4.0 ASSESSMENT & TESTING M

11、ETHODOLOGIES(试验方法)Section 5.0 SAFETY ASSESSMENT(安全评估)5.1 PURPOSE(目的)5.2 SCOPE(适用范围)5.3 SAFETY PHILOSOPHY(安全体系)5.4 GENERAL GUIDELINES(指导方针)5.5 SAFETY-RELATED INTERLOCKS(安全互锁)5.6 CHEMICALS(化学品)5.7 IONIZING RADIATION5.8 NON-IONIZING RADIATION5.9 NOISE(噪音)5.10 VENTILATION AND EXHAUST(通风与排凤)5.11 ELECTRIC

12、AL5.12 EMERGENCY SHUTDOWN(紧急停机)5.13 HEATED CHEMICAL BATHS5.14 HUMAN FACTORS ENGINEERING5.15 ROBOTIC AUTOMATION5.16 HAZARD WARNING(危险警告)5.17 EARTHQUAKE PROTECTION(地震警告)5.18 DOCUMENTATION(文件)5.19 FIRE PROTECTION(消防保护)5.20 ENVIRONMENTAL GUIDELINES(环境方针)Section 6.0 RECOMMENDATIONSSection 7.0 - ILLUSTRAT

13、IONSILLUSTRATION 1 - Mirra Trak System LayoutATTACHMENT ONE - SURFACE LEAKAGE CURRENT TEST(泄漏测试)ATTACHMENT TWO - GROUNDING RESISTANCE TEST (接地电阻测试)ATTACHMENT THREE - VERIFICATION OF EMO(紧急按钮确认)ATTACHMENT FOUR - SOUND PRESSURE LEVEL SURVEY(声压测试)ATTACHMENT FIVE - ERGONOMIC CHECKLIST(人体功力检查表)ATTACHMENT

14、 SIX - MANUAL HANDLING LIFT ANALYSIS(手动操作分析)ATTACHMENT SEVEN - 揥HAT-IF?” HAZARD ANALYSIS(危险分析)ATTACHMENT EIGHT - SEMI S10-1296 RISK ASSESSMENT GUIDELINE METHODOLOGYCONCLUSIONApplied Materials, Model: Mirra TrakSEMI S2-93A Product Safety AssessmentSection 1.0 Section 1.0 MANAGEMENT SUMMARY A follow-u

15、p safety assessment of the Applied Materials Chemical Mechanical Polishing System, Model: Mirra Trak (hereafter referred to as the Mirra Trak), was performed from February 2, 1998 through February 4, 1998. A further re-inspection of the system was performed on June 3, 1998. A preliminary evaluation of the system was also performed on September 25, 1996 through September 26, 1996, and the results of this evaluation were also u

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