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1、印 制 电 路 板（Printed Circuit Boards ） IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly印制板制造和组装的故障排除IPC-MB-380 Guidelines for Molded Interconnection Devices 模压互连器件导则IPC
2、-D-326A Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies印制板制造和其它电子组装的信息要求规范IPC-6010 Series IPC-6010 Qualification and Performance SeriesIPC-6010 印制电路板质量标准和性能规范系列手册IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范IPC-6012B Qualifi
3、cation and Performance Specification for Rigid Printed Boards刚性板的合格和性能规范要求IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范IPC-6016 Qualification & Performance Specification for High Density Interconnec
4、t (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试 IPC-A-600G Acceptability of Printed Boards 印制板验收条件IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价IPC-PWB-EVAL-CH Printed Circuit Board Defect Evaluation Chart印制板缺陷评估图
5、表IPC-HM-860 Specification for Multilayer Hybrid Circuits多层混合电路规范IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards聚合物厚膜印制板的鉴定与性能IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范IPC-
6、TR-481 Results of Multilayer Tests Program Round Robin多层印制板联合试验计划结果IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性
7、评价联合试验IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/沉金规范IPC-DR-572 Drilling Guidelines for Printed Boards 印制板钻孔导则IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias印制板通孔机加工方案的改进和优选手册IPC-NC-349 Computer Numerical Co
8、ntrol Formatting for Drillers and Routers钻床和铣床用计算机数字控制格式IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines施加阻焊前及施加后清洗导则IPC-HDI-1 High Density Interconnect Microvia Technology Compendium高密度(HDI)互连微通孔技术纲要IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materi
9、als高密度互连(HDI)及微导通孔材料规范IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection 积层/高密度互连的术语和定义、试验方法与设计例IPC-DD-1
10、35 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I, Round 1高密度印制板微通孔评价指标手册, 第一期第一版IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2高密度印制板微通孔评价指标手
11、册, 第一期第二版IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3高密度印制板微通孔评价指标手册, 第一期第三版IT-98123 Microvia Manufacturing Technology Cost Analysis Report微通孔制作技术成本核算报告IPC-2141A Controlled Impedance Circuit Boards & High Speed Logic Design控制阻抗电路板与高速逻辑设计IPC-2251 Design Guide for the Packaging of H
12、igh Speed Electronic Circuits高速电子电路封装的设计指南IPC-2252 Design Guide for RF/Microwave Circuit Boards 射频/微波电路板设计指南IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范IPC-6018A Microwave End Product Board Inspection and Test 微波成品印制板的检验和测试IPC-D-317A Design Guideline
13、s for Electronic Packaging Utilizing High Speed Techniques采用高速技术电子封装设计导则IPC-M-102 Flexible Circuits Compendium 挠性电路纲要IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry挠性印制线路用挠性绝缘基底材料IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry
14、 and Flexible Adhesive Bonding Films 挠性印制线路覆盖层用涂粘接剂绝缘薄膜IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry挠性金属箔去电应用于柔性电路组装IPC-6013A Qualification & Performance Specification for Flexible Printed Boards挠性印制板的鉴定与性能规范IPC/JPCA-6202 IPC/JPCA Performance Guide Man
15、ual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA 单双面挠性印制板性能手册IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits单面和双面挠性电路组装导则IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范IPC-M-107 Standards for Printed Bo
16、ard Materials Manual 印制板材料标准手册IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards刚性及多层印制板用基材规范IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则IPC-4562 Metal Foil for Printed Wiring Applications 印制线路用金属箔IPC-CF-148A Resin Coated Metal for Printed Boards 印制板用涂树脂金属箔IPC-CF-152B Composite Metallic Materials Specification for
