《plasma原理75009》由会员分享，可在线阅读，更多相关《plasma原理75009（82页珍藏版）》请在金锄头文库上搜索。
1、等离子技术讲座: 等离子原理及其应用 PLASMA TRAINING PROGRAM,,目录 Agenda,等离子技术在高级封装工业的应用 Application of Plasma Technology in Advanced Packaging Industries. 等离子技术简介 Introduction to Plasma Technology March公司产品介绍 Products of March Plasma Systems,,等离子技术在高级封装工业的应用 Plasma Application in Advanced Packaging Industries,,综述 Ove
2、rview:,微电子工业 Microelectronic Industry Flash, EEPROM DRAM, SRAM Analog/Linear Microcontrollers, Microprocessors, Microperipherals ASIC 光电子工业 Optoelectronic Industry Laser Diodes Fiber Assembly Hermetic Packaging MEMS 印刷电路工业 Printed Circuit Industry Printed Circuit Board,,集成电路封装面临的挑战 IC Assembly and P
3、ackaging: Specific Challenges,不良的芯片粘结 Poor Die Attach Insufficient Heat Dissipation Due to Poor Die Attach 不良的导线连接强度 Poor Wire Bond Strength Contamination on Bond Pad 覆晶填料 Flip Chip Underfill Fillet Height of Underfill Void in Flip Chip Underfill 剥离 Delamination Laminate Materials Releasing Moisture
4、 Metal Leadframe Oxidation 印刷电路板孔中的残余物 Smearing in Printed Circuit Boards 打印记号 Marking,,等离子体应用 Plasma Applications,表面污染物去除 Contamination Removal Wire Bonding Encapsulation Ball Attach (Contamination Sources: Fluorine, Nickel Hydroxide, Photoresist, Epoxy Paste, Organic Solvent Residue, smear in PCB,
5、 and scum) 表面活化 Surface Activation Die Attach Encapsulation Flip Chip Underfill Marking 表面改性和刻蚀 Surface Modification and Etch Fluxless Soldering Cladding layer removal on fiber,,表面活化: 芯片粘结 Surface Activation: Die Attach,Proper Die Attach Critical Heat Dissipation Delamination Plasma Treatment of Sub
6、strate Prior to Die Attach Promotes Adhesion of Epoxy Removes Oxidation For Good Solder Reflow Better Bond Between Die and Substrate Better Heat Dissipation Minimizes Delamination,,污染物去除: 导线连接 Contamination Removal: Wire Bonding,Poor Wire Bond Strength Contamination Oxidation Smaller Bond Pad Pitche
7、s 80 mm to 25 mm Higher Ratio of Contamination to Pad and Wire Deformation Welding Inhibited By Physical Process: Contaminants Act As Physical Barrier Chemical Process: Contaminants Form Bonds With Surfaces and Minimize Adhesion Epoxy Resin Bleedout,,污染物去除: 导线连接 Contamination Removal: Wire Bonding,P
8、lasma Processing Removes Trace Contamination and Oxidation From Substrates Metal Ceramic Plastic Wire Bond Strength Significantly Increased Throughput Increased: Lower Pressure Required,,污染物去除和表面活化: 封装 Contamination Removal and Surface Activation: Encapsulation,Molding Compound Must Adhere To Differ
9、ent Compounds Substrate Material Solder Mask Die Metal Bond Pads Several Materials Bonding to One Another Delamination Can Result From Poor Surface Activity and Contamination,,Delamination Biggest Challenge For Organic Based Substrates Laminate Materials Absorb Water From Air and the Flux Residue Re
10、moval Process Trapped Moisture Released From High Temperatures: Use or Soldering Oxidation on Metal Leadframes Can Inhibit Adhesion of Frame to Mold Plasma Treatment of BGA Packages, Other Polymer Substrates, and Metal Leadframes Improves Surface Activity Achieves Good Adhesion Minimizes Delaminatio
11、n,,污染物去除和表面活化: 封装 Contamination Removal and Surface Activation: Encapsulation,表面活化: 填料 Surface Activation: Underfill,Underfill Required in Flip Chip Minimize Thermal Coefficient of Expansion (CTE) Mismatch Between Die and Substrate Challenge Void Free Wicking Speed Difficult with Large Dies and High
12、 Density Ball Placement Plasma Treatment Increases Surface Energy Promotes Adhesion Increasing Wicking Speeds Decreased Voiding,,Presence of Oxides Inhibits Wire Bonding Limits Good Die Attachment Inhibits Solder Reflow Plasma Treatment Reduces Metal Oxides Improves Wire Bond Strength Improves Die A
13、ttachment Improves Solder Reflow,,氧化物去除 Oxides Removal,印刷线路板上的残余物清除 Desmearing in PCB,Smearing in Printed Circuit Boards (PCB) Vias Mechanically or Laser Drilled Laminate Material (Epoxy Resin) Is Smeared Over Edges Of Inner Metal Conductor Lines Subsequent Plating Of The Vias Must Electrically Conn
14、ect All The Conductor Lines Smeared Resin Must Be Removed To Ensure Good Electrical Contact Plasma Treatment Removes the Epoxy Resins Producing Carbon Dioxide and Water,,集成电路封装中等离子工艺的应用 IC Assembly and Packaging: Plasma Solutions,Improves Die Attach Improved Wire Bond Strength With Minimal Process R
15、equirements Effective Encapsulation of Metal and Organic Based Packages Minimizes Voids in Flip Chip Underfill Desmearing in Printed Circuit Boards,,等离子工艺的其它应用 Other Plasma Applications,,Surface Activation of Numerous Materials: Polymers, and Metals 材料表面的活化 Thin Film Etch: Al, Si, SiO2, Si3N4, W, WSix Organic Removal去除有机污染物 Oxide Removal去除氧化物 Residual Fluorine Removal去除氟的残物 Hydrophilation Hydrophobation Plasma polymerization PECVD,关键参数 Critical Product Parameters,
