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1、WIRE BONDPROCESS INTRODUCTIONCONTENTS ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT封裝簡介晶片Die金線 Gold Wire導線架Lead framWafer GrindingDie BondingWafer SawtoasterWire BondingDie Surface CoatingMolding Laser MarkSolder BallPlacementSingulationP
2、acking封裝流程Dejunk TRIMSolder PlatingSolder PlatingDejunk TRIMTRIM/ FORMINGBGASURFACEMOUNTPKGTHROUGHHOLE PKGWire Bond 原理padpadleadleadGold wireGold wireBall BondBall Bond( 1st Bond )( 1st Bond )Wedge BondWedge Bond( 2nd Bond )( 2nd Bond )GLASSCONTAMINATIONCONTAMINATIONVIBRATIONVIBRATIONSiO2SiGOLD BALL
3、PRESSUREPRESSUREMOISTURE MOISTURE AL2O3AL2O3AlAlB.PRINCIPLE銲接條件 HARD WELDING Pressure (Force) Amplify 或著一個Die上出現不同Pad大小那就是以兩個Pad中心距 離為BPP,但是一般我們要取一個Die上最小的BPPBond Pad PitchBond Pad OpenBond Pad OpenBall SizeBall ThicknessBall Size Ball Size = y; Area = (y/2) x/(y/2) = z g/milCBall bondTest specimenS
4、pecimen clampShearing ramWireBond shoulderInterfacial contact ball bond weld areaBonding padh(A) UnshearedCLCBall bondCLTest specimenSpecimen clampBonding padFull ball attached to wire-except for regions of intermetallic voidingBall separated at bonding pad- Ball interface-residual intermetallic (an
5、d sometimes portion of unalloyed ball and metal) on pad in bond interaction area(D) Ball bond-bonding pad interfaceseparation (typical Au to Al)CTest specimenSpecimen clampShearing ramWireMinor fragment of ball attached to wireBonding padCLBall sheared too high (off line, etc.)only a portion of shou
6、lder and ball top removedInterfacial contact ball bond weld area(B) Wire (ball top and/or side) shearCBall bond CLTest specimenSpecimen clampShearing ramBonding padMajor portion of ball attached to wireInterfacial contact- ball bond weld area intact(C) Below center line shear, ball sheared through (
7、typically Au to Au)CBall bond CLTest specimenSpecimen clampBonding padPad metallization separates from underlying surfaceResidual pad on ball ball-pad interface remains intact(E) Bond pad liftsTest specimenSpecimen clampCBall bond CLBonding padBonding pad lifts, taking portion of underlying substrat
8、e material with it(F) CrateringResidual pad and substrate attached to ball,ball-pad interface remains intactShear Failure ModesCrater TestCalculate (I)UP Time =(Total Actual Production Times Total Repair Time )Total Actual Production TimeDOWN TIME RATE= Total Repair Time Total Actual Production Time
9、sTotal Operator Actual Repair Time Total Operator Repair Frequency StoppagesTotal Actual Production Times Total Operator Repair Time Total Operator Repair Frequency StoppagesTotal Technical Actual Repair Times Total Technical Repair Frequency StoppagesMTTS (MEAN TIME TO STOP ) =MTBS (MEAN TIME BETWE
10、EN STOP)=MTTA (MEAN TIME TO ASSISTANCE ) =Calculate (II)MTBA (Mean Time Between Assistance) = Total Actual Production Times Total Technican Repair Times Total Technical Repair Frequency StoppagesMTBF(Mean Time Between Failure)= Total Actual Production Times Total Technician Repair Time Total Change
11、Parts Repair Frequency Stoppage規格寬度 製程寬度 規格上限 - 規格下限 6 ( 公差) (上限 or 下限 ) - 平均值 三個公差 CP ( 製程能力指標) = CPK = =Quality 正常品 Material Problem 1st Bond issue (Peeling , Ball Lift , Off Center) 2nd Bond issue (滑針，縫點脫，short tail ) Looping Fail (wire snake wire，sweep wire loop base bent )正常品Material ProblemWit
12、h BallWir ePad SizeMissing BallWire BrokenBonding Ball Inspection Ball Detection Ball Size Pad CenterBall CenterBall Placement (X,Y)Ball Off Pad Bonding Ball Inspection (cont.) Ball MeasurementPeeling1st Bond Fail ( I )Ball Lift1st Bond Fail (II)Ball LiftNeck Crack1st Bond Fail ( III )Off Center1st
13、Bond Fail (IV)Off Center Ball1st Bond Fail (V) Smash BallSmash BallWith WeldWireCapillary MarkMissing WeldWire BrokenLeadBonding Weld Inspection Weld Detection 2nd Bond Fail ( I )滑針2nd Bond Fail ( II )縫點脫落縫點脫落Looping Fail(Wire Short I)Wire SweepWire ShortLooping Fail(Wire Short II)Loop Base BendWire ShortLooping Fail(Wire Short III)Excessive Loop Wire ShortTHE END
