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1、 什麼是 WIRE BOND L/FDIE鋁墊銲金線一. W/B 銲線基本理論 :二. BONDING (固態銲接)的四大基本要素 :要如何才能得到最佳的銲接，主要要素如下A. 壓力。(BOND FORCE)B. 振盪功率。(BOND POWER)C. 銲接時間。(BOND TIME)D. 銲接溫度。(TEMPERATURE)1. 目前我們電子產品銲接是採用固態銲接，所謂固態銲接，就是金屬在未達熔解溫度下之銲接。決定固態銲接的要素有那些？1. 鋁墊之構造:a. 最上層為少量水氣與雜質b. 第二層為氧化鋁c. 第三層才是純鋁d. 第四層是二氧化鋁e. 最下層就是矽層 2. 最佳之銲接，就是金球與
2、純鋁密切結合。故如何運用四大基本要素，掌控最佳配合時機為學習要旨。如壓力、振盪過大會造成缺鋁或矽崩過小昨則無法有效排除第一、二層與純鋁層作密切接合銲接。三. 金球與鋁墊之最佳銲接 :溫度溫度金球二氧化矽層矽層純鋁玻璃層水氣及雜質氧化鋁壓力 (FORCE)振盪 (POWER)金球與鋁墊的銲接模式鋁墊SEM側視圖BONDING 時銲針位置之時序圖RESET 位置LOOP HEIGHTTO RESET加速度REVERSE LOOP留線尾燒一個金球 等速度逆打 等速度1 ST BOND TIMEKINK HEIGHT 2 ND BOND TIME銲 針 高 度TIME時間L/FDIE鋁墊銲金線* WI
3、RE BOND *padpadleadleadFree air ball is captured Free air ball is captured in the chamferin the chamferFree air ball is capturedFree air ball is capturedin the chamfer in the chamferpadpadleadleadFree air ball is captured Free air ball is captured in the chamferin the chamferpadpadleadleadFree air b
4、all is capturedFree air ball is capturedin the chamfer in the chamferpadpadleadleadFree air ball is capturedFree air ball is capturedin the chamfer in the chamferpadpadleadleadFormation of a first bondFormation of a first bondpadpadleadleadFormation of a first bondFormation of a first bondpadpadlead
5、leadFormation of a first bondFormation of a first bondpadpadleadleadheatheatPRESSUREPRESSUREUltrasonic Ultrasonic VibrationVibrationFormation of a first bondFormation of a first bondpadpadleadleadUltra Ultra Sonic Sonic VibrationVibrationheatheatPRESSUREPRESSURECapillary rises to loop Capillary rise
6、s to loop height positionheight positionpadpadleadleadCapillary rises to loop Capillary rises to loop height positionheight positionpadpadleadleadCapillary rises to loop Capillary rises to loop height positionheight positionpadpadleadleadCapillary rises to loop Capillary rises to loop height positio
7、nheight positionpadpadleadleadCapillary rises to loopCapillary rises to loopheight position height positionpadpadleadleadFormation of a loopFormation of a looppadpadleadleadFormation of a loopFormation of a looppadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpa
8、dleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadFormation of a second bondFormation of a second bondpadpadleadleadheatheatFormation of a second bondFormation of a second bondpadpadleadleadheatheathea
9、theatpadpadleadleadheatheatheatheatpadpadleadleadheatheatheatheatpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadDisconnection of the tailDisconnection of the tailpadpadleadleadDisconnection of the tailDisconnection of the tailpadpadleadleadFormation of a new free air ballFormation of a new free air ballWire Bonded Wire Bonded padpad leadlead Die
