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1、新一代高流动新一代高流动 LCP 材料材料“S475”简介简介 Introduction of next-generation high-flow LCLmaterial“S475“下面介绍本公司开发的 Vectra的新等级“S475”。S475 兼具高水平的耐热性、 流动性以及低翘曲性，特别适用于细微接插件。In this issue, we introduce a new grade of VectraR “S475“ developed by us. S475, possessing heat resistance, flowability and low warpage at a hi
2、gh level, is a grade which is suitable for application to fine pitch connectors.导言导言人们需要轻薄短小的移动设备以及面向数码家电的电子设备。作为一种注射成型用树 脂，LCP 可均衡满足这种需要，从而得到了广泛使用。 不过，电子设备的升级换代是永无止境的。一般认为，已投入使用的 LCP 中的大部分 其实在 2004 年前后就已达到了其性能极限。针对人们对日趋复杂的材料的性能要求， 本公司从 Vectra的基础聚合物中选取材料并开发出 VECTRA S475，从而满足了复杂 的市场需要。下面具体介绍 S475。S47
3、5S475 的特征的特征FPC 接插件填充压与过去为薄壁细微接插件推荐的 E473i 相比，现在只需约一半的 填充压即可成型（本公司 FPC 接 插件评价模型：在最小壁厚 0.12mm 处得出的评价结果）。平面度（低翘曲性）用 FPC 接插件进行评价后得出的 平面度的测量结果如右图所示。 由于可进行低压成型，因此变形 量也被压低。 不过，由于是一种通过薄璧产品 的低压成型来实现低翘曲化的材 料，因此像 1mmt 平板那样的璧 厚的成型品反而有可能无法发挥其性能。向超薄壁部分填充右面的图片所示的是本公司 FPC 接插件模型中最小壁厚部分为 0.05mm 的一种（用电子显微镜拍 摄）。从图片中可以
4、发现，最薄 处的厚度为 0.05mm，但填充得很 充分。填料的分散状态S475 的无机填料也具有良好的分 散状态。 右面是 X 射线 CT 图片。 由图可知，与 E473i 相比，S475 的无机填料分布得更为均匀。S475S475 的物性的物性表 1. Vectra低翘曲材料表项目试验方法单位E471iE473iS471S475E130i 弯曲强度ISO178MPa195160180180220 弯曲弹性模量ISO178MPa1350011000 12700 1250015000 弯曲应变ISO178%2.52.82.02.42.3 负荷挠曲温度（1.8MPa）ISO75-1,2265250
5、315305280燃性(0.8mm )UL94-V-0V-0V-0V-0V-0平板平面度（80mm）(*1)mm0.80.30.32.24.3 FPC 接插件模型 (*2) 最小填充压力本公司的方 法MPa11076100 140FPC 接插件模型 (*3) 最小填充压力本公司的方 法MPa不填充170 90不填充(*1) 试样 80mm 80mm 1mm、侧浇口、注射压 78MPa(*2) 0.5mm 间距、针数 30 2 列、4 腔、等长流道、1 处沉陷式浇口（0.4mm）最小壁厚 0.18mm (*3) 0.5mm 间距、针数 30 2 列、4 腔、等长流道、1 处沉陷式浇口（0.4mm
6、） 最小壁厚.12mm本公司评价用 FPC 接插件试样形状A-A 断面B 部放大In this issue, we introduce a new grade of VectraR “S475“ developed by us. S475, possessing heat resistance, flowability and low warpage at a high level, is a grade which is suitable for application to fine pitch connectors.IntroductionIntroductionLCP is now i
7、n widespread use in mobile devices and electronic devices for digital home appliances. This is because LCP meets the requirements for these devices, that is, thin walls and compactness, in a balanced manner as a injection molding resin. However, we regard it as reality that the existing LCP grades w
8、ere already being used as performance limits in most cases around 2004, since upgrades of electronic devices are endless. We developed the Vectra S475 which meets sophisticated market needs by considering material from the base polymer, in response to performance requirements for materials becoming
9、increasingly advanced every year. The characteristics and physical properties of the S475 are introduced below.CharacteristicsCharacteristics ofof S475S475FPC connector filling pressureS475 allows molding at approximately half the filling pressure of E473i recommended for thin fine- pitch connectors
10、. (Our FPC connector evaluation type: Evaluation of minimum thickness part of 0.12mm)Flatness (low warpage)The graph on the right shows the flatness measurement results evaluated with FPC connectors. Since molding at low pressure is possible, the amount of deformation can also be kept small. However
11、, non-thin moldings such as a plate of 1mm in thickness may not deliver performance since this material accomplishes low warpage by allowing low- pressure molding of thin products.Filling into super-thin partsThe photo on the right shows our FPC connector type with a minimum thickness part of 0.05mm
12、. (Photo taken using a scanning electron microscope.) The thinnest part in the photo is 0.05mm, where substantial filling can be viewed. State of filler dispersionIn S475, the state of inorganic filler dispersion is good. On the right, an X- ray CT image is shown. You can see that inorganic fillers
13、in S475 are uniformly dispersed than those in E473i.PhysicalPhysical propertiesproperties ofof S475S475Table 1 List of Low Warpage Materials of VectraItemTest MethodUnitE471iE473i S471S475E130iFlexural strengthISO178MPa195160180180220Flexural modulusISO178MPa1350011000 12700 1250015000Flexural strai
14、nISO178%2.52.82.02.42.3Temperature of deflection under load (1.8 MPa)ISO75-1,2265250315305280Flammability (0.8mm )UL94-V-0V-0V-0V-0V-0Plate flatness (80mm)(*1)mm0.80.30.32.24.3Minimum filling pressure for FPC connector type (*2) Our methodMPa11076100 140Minimum filling pressure for FPC connector typ
15、e (*3) Our methodMPaNo filling170 90No filling(*1) Test specimen 80mm 80mm 1mm, side gate, injection pressure 78 MPa (*2) 0.5mm pitch, 30 pins 2 rows, 4 cavity mold, equal-length runner, 1- point sub-marine gate(0.4mm ), minimum thickness 0.18mm (*3) 0.5mm pitch, 30 pins 2 rows, 4 cavity mold, equal-length runner, 1- point sub-marine gate(0.4mm ), minimum thickness 0.12mmShape of FPC Connector Test Specimen for Our A-A Cross SectionEvaluationEnlarged View of Part B
