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1、电子技术词典电子技术词典 1 1湿热后绝缘电阻=insulation resistance anter exposure to moisture环氧纸质覆铜箔板=epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 环氧玻璃布玻璃纤维复合覆铜箔板=epoxide non woven/woven glass reinforced copper-clad laminates 环氧玻璃布纸复合覆铜箔板=epoxide cellulose paper core, glass cloth surfaces copper-clad
2、laminates 刚性印制板=flex-rigid printed board, rigid-flex printed board 环氧合成纤维布覆铜箔板=epoxide synthetic fiber fabric copper-clad laminates 双马来酰亚胺三嗪环氧玻璃布覆铜箔板=bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 聚全氟乙烯丙烯薄膜=perfluorinated ethylene-propylene copolymer film (FEP) 刚性多层印制板=flex-r
3、igid multilayer printed board, rigid-flex multilayer printed board 聚四乙烯玻璃纤维覆铜箔板=teflon/fiber glass copper-clad laminates 聚酰亚胺玻璃布覆铜箔板=polyimide woven glass fabric copper-clad laminates 酚醛纸质覆铜箔板=phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 刚性双面印制板=flex-rigid double-sided printed
4、board, rigid-flex double-sided printed 环氧玻璃布基覆铜箔板=epoxide woven glass fabric copper-clad laminates 聚酯玻璃布覆铜箔板=ployester woven glass fabric copper-clad laminates自熄性=self-extinguishing自顶向下设计=top-down design 自底向上设计=bottom-up design 子线网=subnet 子弹形盘=bullet pad 子板=daughter board 紫外线阻挡型覆铜箔板=UV blocking copp
5、er-clad laminates 灼热燃烧=glowing combu啄层= peck drilling准尺寸孔=dimensioned hole 准表面间镀覆孔=quasi-interfacing plated-through hole 锥口孔=flare装配图=assembly drawing 装联件=packaging and interconnecting assembly装联构件=packaging and interconnecting structure注尺寸孔=dimensioned hole主面=primary side皱褶=wrinkle轴向引线=axial lead重合
6、度=registration重氮底片=diazo film重布=rerouting 中心距=center to center spacing中间文件=intermediate file 中间孔=interstitial hole 质量一致性检验电路=quality conformance test circuit质量保证条款=quality assurance provisions制作工艺=manufacturing technology制造文件=manufacturing documentation 直角板边连接器=right-angle edge connector织物组织=weave s
7、tructure 织物经纬密度=thread count 支撑面=supporting plane支撑孔=supported hole 支撑孔=supported hole正性抗蚀剂=positive-actiong resist正向=right reading正像图形=positive pattern正像=positive整平剂=leveling agent整板电镀=panel plating阵列=array 针孔=pinhole针孔=pin hole真空吸锡法=pulse vacum tin removal折弯引线=clinched lead折痕=crease 遮光剂=opaquer 照相
8、原版=original production master照相缩小尺寸=photographic reduction dimesion照相底图=artwork master照相底片=photographic film照相底版=artwork粘性时间=tack time粘结增强处理=bond enhancing treatment粘结片=bonding sheet 粘结膜=film adhesive 粘结剂=binder粘结层=bonding layer 粘接增强处理(目检)=bond enhancement treament(visual)粘合强度=bond strength粘合力增强处理=a
9、dhesion promotion摘要=abstract增塑剂=plasticizers 增强材料=reinforcing material 增强板材=stiffener material 增强板=stiffener 脏污=stain在制板=panel在线测试=in-line test在连接盘中导通孔=via-in-pad 再流焊=reflow soldering载芯片板=chip on board (COB) 载体箔=carrier foil 载流量=current-carrying capacity杂讯=noise晕圈=haloing运输=shipment云织=waviness 圆形盘=r
10、ound pad 原始光洁面=plate finish原理图=shematic diagram 原理图=schematic diagram元件引线=component lead元件面=component side元件密度=component density元件露出端=lead extension元件孔=component hole元件插脚=component pin元件安置=component positioning 预制内层覆箔板=mass lamination panel预浸粘结片=preimpregnated bonding sheer 预浸材料固化厚度=prepreg cured th
11、ickness预浸材料=prepreg 预防性的=preventive鱼眼=fish eye 余隙孔=access hole有引线塑料芯片栽体=PLCC(Plastic Leaded Chip Carrier)有焰燃烧=flaming combustion有机污染=organic contamination优质焊点=preferred solder connection优化(设计)=optimization (design) 用途=application永久性保护层=permanent resist印制元件=printed component 印制线路布设=printed wiring lay
12、our印制线路布设=printed wire layout 印制线路板=printed wiring board(PWB) 印制线路=printed wiring 印制接点=printed contact印制脚(贴装焊盘)=foot print印制电路=printed circuit 印制插头=edge board contact印制板组装图=printed board assembly drawing 印制板组装件=printed board assembly印制板总厚度=total board thickness印制板装配=printed board assembly 印制板计算机辅助设计
13、=printed board computer-aided design印制板厚度=printed board thickness印制板电路=printed circuit board (PCB) 印制板尺寸=board dimensions印制板=printed board 印制=printing引线伸出长度=lead projection引导孔=pilot hole 银盐底片=silver film殷瓦=invar 异物=inclusion抑制行动=containment action仪器检验=equipment calibration移位焊点=disturbed医药=medicine一级
14、封装(集成电路)=IC packaging液体光致阻焊剂=liquid photorseneitive solder resist液体光致抗蚀剂=liquid photoresist氧指数=oxygen index(OI)验收态表面绝缘电阻=insulation resistance as rec.验收态=as received掩蔽法=tenting压制周期=moulding cycle压延退火铜箔=rolled annealed copper foil (RA copper foil) 压延铜箔=rolled copper foil压配合接触件=press-fit contact压痕=den
15、t压垫材料=cushion压板间距=daylight压板=press platen讯号完整性=signal integrity巡回售货员问题=traveling salesman problem 雪人盘=snowman pad 虚焊点=cold solder connection修整=tuching up修复=repairing修复=repair信号层=signal plane芯吸作用=wicking芯吸=wicking芯片直装=chip-on-board(COB)芯片载体=chip carrier芯片尺度级封装品=CSP芯带拆焊=solder wicking芯板=core斜孔=splay小外
16、形封装=SOP(Small Out-Line Package)消除应力=stress relief相对坐标=incremental相比起痕指数=comparative tracking index线网=net 显微剖切技术=microsection technology显微剖切=mircosectioning显布纹=weave texture洗孔=hole cleaning稀松织物=woven scrim锡珠=solder plugs吸水高度=height of capillay rise吸水高度=height of capillary rise 无支撑粘剂膜=unsupported adhesive fil
