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1、晶片双面精密研磨机设计摘 要：本研磨机是一台是能够对 4 英寸的晶片进行双面精密研磨的机器，所加工的晶片是光电子领域使用的人工晶体基片(如蓝宝石、水晶、硅、碳化硅等)。设计的主要任务是进行晶片双面精密研磨机的总体设计、传动系统设计和加载系统设计。加载方式采用气缸加载，加载压力的变化过程呈斜线式上升。在开始和结束时压力都要尽量减小，从而降低了上研磨盘的振动对工件造成的不良影响。为了使研磨过程中晶片运动轨迹复杂化，晶片放在保持架内，保持架成为由中心齿轮和齿圈所构成的差动轮系中的行星齿轮。使晶片的运动是行星运动和自转运动的合成运动。通过改变中心轴和空心轴的运动参数，即可获得不同的行星轮的运动轨迹。为
2、使晶片研磨有较高的研磨效率，研磨盘表面加工有深 3 的十字形槽。此外，根据研磨机的工作原理，设计了它的控制系统。m将气动控制系统与电气控制系统联合控制，实现了研磨压力的精确控制，且工作效率高，安全可靠。通过研究双面研磨的加工机理，分析了双面研磨的运动过程，并运用计算机模拟了研磨运动轨迹，使研磨运动轨迹能达到研磨痕迹均匀并且不重叠。因此，加工后的晶体有很高的平面度，且两端面有较高的平行度。关键词：双面研磨；研磨机设计；晶片；计算机仿真本设计来自：完美毕业设计网 http:/登陆网站联系客服远程截图或者远程控观看完整全套论文图纸设计客服 QQ：8191040The Design of Double
3、-Side Wafer PrecisionLapping Machine Abstract: The lapping machine is a double-side precision lapping machine, which is able to double-sided lapping 4 inches of wafers. The processing wafers are artificial crystal substrates, which are used in the area of photoelectron, such as sapphire, quartz, sil
4、icon, silicon carbide and other artificial crystal. The major task of this design is to achieve the overall design, the transmission system design and the loading system design for double-side wafer precision lapping machine. Loading mode used air cylinder to load. The change of the loading pressure
5、s process was rose as oblique line expression. At the beginning and the end, the loading pressure must be minimized. Thereby, the vibration on the lapping plate will be reduced. And the impact on the work piece will be reduced. To realize the wafers complicated movement tracks, wafers are put on the
6、 cage inside. Cage becomes the planetary gear, which consists of the center gear and ring gear that constitute the differential gear train. So the movement of wafer is consisted of planetary motion and spin motion. As long as changing the motion parameters of the center axis and the hollow axis, the
7、 different movement tracks of the cage will appear. To enable wafers have a high lapping efficiency, there are cruciform grooves which deep are 3mm on the surface of the lapping plate.Further, the control system have been designed based on the operational principle of the lapping machine. By combina
8、tion of the pneumatic control system and the electronic control system, the precisely control for pressure is realized. So the lapping machine is high in working efficiency and working on the safe side.Through study the processing mechanism and the motion process of double-side lapping, the lapping
9、movement tracks are simulated by computer. So lapping movement tracks can achieve uniformity and are not the same. Therefore, the processed crystal has a high degree of planar and parallel on the two sides. Key words: Double-side lapping; Lapping Machine; Wafer; Computer Simulation目 录1 前 言 12 晶片 双面精
10、密研磨机的总体设计 32.1 制定晶片双面精密研磨机的工艺分析 32.1.1 单面研磨方式 32.1.2 双面研磨方式 32.1.3 晶片双面精密研磨机的工艺分析 42.2 确定晶片双面精密研磨机的总体结构方案 43 晶 片双面精密研磨机的传动系统设计 53.1 传动系统的选择 53.2 传动系统零件设计 53.2.1 电动机的选择 53.2.2 带传动的设计计算 53.2.3 减速 器的选择 83.2.4 齿轮传动的设计 83.2.5 链传动的选择 83.2.6 轴 承的选择 103.3 传动系统设计计算和校核 103.3.1 轴的设计计算和强度刚度校核 103.3.2 齿轮的强度计算和校核 144 晶片双面精 密研磨机的加载系统设计 184.1 加载形式的选择
