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1、P 0,本资料来源,当前文档修改密码：83628 更多资料请访问.(.),PLATO ELECTRONICS INC.,DESIGN FOR MANUFACTURE,PRODUCIBILITY AND LOWER COST,CONTENTS,1. PCB MFG. FLOW CHART,P2,2. PANEL UTILIZATION ELEMENTS,P3P4,3. AVAILABLE PANEL SIZES,P5,4. ARRAY DEPANELIZATION,P6P7,5. MATERIAL COST AFFECTS BOARD COST,P8,6. BOARD THICKNESS,P9P
2、19,7. LAMINATE CONSTRUCTIONS,P20P26,8. TRANSMISSION LINE TYPES,P27P29,9. LAYER DENSITY,P30,10.SINGLE PLY LAMINATE/PREPREG CONSTRUCTION,P31P32,11.HOLE SIZE AND DESITY,P33P34,12.PAD SIZE VS. HOLE SIZE,P35,14.NOMENCLATURE,P36,15.GOLD PLATING,P37,16.T.C.P.(TAPE CARRIER PACKAGE),P38,17.BALL GRID ARRAY (B
3、GA),P39,18.ENTEK 106A,P40,18.BLIND AND BURIED VIA OPTIONS,P41P43,13.SOLDER MASK,19. BLIND AND BURIED VIA OPTIONS,P44,18.BLIND AND BURIED VIA OPTIONS,20. MINIMUM DESIGN RULE FOR Build- Ups,P45P46,21. PRODUCTION CAPABILITIES,P47,流 程 圖 PCB Mfg. FLOW CHART,UPDATED: 2001,07,06,蝕 銅,I/L ETCHING,電 測,ELECTRI
4、CAL TEST,曝 光,壓 膜/塗 佈,前 處 理,EXPOSURE,LAMINATION/ROLERCOATING,PRELIMINARY,TREATMENT,MLB,DOUBLE SIDE,ELECTRONIC LTD,P 4,PART SIZE AS IT AFFECTS BOARD COST,PANEL UTILIZATION ELEMENTS,1. PANEL BORDERS,4 LAYER,P 5,6 LAYER OR ABOVE,* SPACING BETWEEN PARTS NORMAL STEP(C) = .200 but can be reduced .118 if ne
5、eded .,P 6,AVAILABLE PANEL SIZES,STANDARD DISTRIBUTION PANEL SIZE AS FOLLOWS,1. 21.0“*24.0” 10. 16.0*20.0 2. 20.0“*24.0” 11. 16.0*18.0 3. 20.0“*22.0” 12. 15.0*20.0 4. 19.0“*22.0” 13. 14.0*24.0 5. 18.0“*24.0” 14. 14.0*19.2 6. 18.0“*20.0” 15. 14.0*16.0 7. 17.0“*22.0” 16. 13.3*24.0 8. 16.0“*24.0” 17. 1
6、3.3*20.0 9. 16.0“*21.0” 18.,P 7,ARRAY DEPANELIZATION,OPTIONS,A) ROUTED SLOTS WITH BREAKAWAY TABS,1. Typical slot sizes are .125 ,.093,.078,.059” (3.75mm,2.38mm,2.0mm,1.5mm),2. Use Diagram A for a straight, clean edge after breakaway,CENTER HOLES DRILLED AT .022 OUTSIDE HOLES DRILLED AT .042 SLOT WID
7、TH .093,P 8,ARRAY DEPANELIZATION,OPTIONS,B) PARTS ARE SCORED,1. Parts are spaced back-to-back. This allows for better part to panel utilization .,P 9,MATERIAL COST AFFECTS BOARD COST,MATERIAL COST IS A SIGNIFICANT COST OF THE PWB. (APPROXIMATELY 30-40%),PLATO UTILIZES THE FOLLOWING LAY-UPS WHICH ARE
8、 COST EFFECTIVE AND DIMENSIONALLY STABLE. (BASED ON .062THICKNESS AND 1 OZ COPPER.),P 10,6 LAYER,8 LAYER,P 11,10 LAYER,THE CALL OUT OF SPECIFIC DIELECTRIC QUIREMENTS OR THE USE OF 2 OZ. COPPER CAN INCREASE THE COST OF THE PART UP TO 20%.,P 12,BOARD THICKNESS,How thin can we go?,4 Layer,1. Finished T
9、hickness= .0196+/- 0.003 Standard material with 1 OZ. copper,2. Finished Thickness= .0182+/- 0.003” .5 oz. copper and 2 ply prepreg,0.004”1/1, FR-4,COPPER FOIL 1 OZ,COPPER FOIL 1 OZ,PREPREG 2116HR,PREPREG 2116HR,P 13,3. Absolute Thinnest= .0118+/- .003 Using 1 ply prepreg,1. Finished Thickness= .031
10、4+/- 0.003” Standard material with 1 OZ. copper,6 Layer,BOARD THICKNESS,How thin can we go?,4 Layer,P 14,2. Finished Thickness= .0225+/- 0.003” .5 oz. copper and 1 ply prepreg,3. Absolute Thinnest= .0197+/- .003” Limited Panel Size Using 1 ply prepreg Cost Impact,BOARD THICKNESS,How thin can we go?,
11、6 Layer,P 15,BOARD THICKNESS,How thin can we go?,8 Layer,1. Finished Thickness= .0432+/- 0.003” Standard material with 1 OZ. copper,P 16,8 Layer,2. Finished Thickness= .0418+/- 0.003 .5 oz. copper and 2 ply prepreg,BOARD THICKNESS,How thin can we go?,P 17,8 Layer,3. Absolute Thinnest= .0276+/- .003
12、Limited Panel Size .5 oz. copper and .004 core material Cost Impact,BOARD THICKNESS,How thin can we go?,P 18,BOARD THICKNESS,How thin can we go?,10 Layer,1. Finished Thickness= .055+/- 0.003 Standard material with 1 OZ. copper,P 19,2. Finished Thickness= .0536+/- 0.003” .5 oz. copper and 2 ply prepr
13、eg,BOARD THICKNESS,How thin can we go?,10 Layer,P 20,3. Absolute Thinnest= .0276+/- .003 Limited Panel Size .5 oz. copper and .004 core material Cost Impact,10 Layer,BOARD THICKNESS,How thin can we go?,P 21,LAMINATE CONSTRUCTIONS,P 22,LAMINATE CONSTRUCTIONS,P 23,TRANSMISSION LINE TYPES,MULTILAYER CR
14、OSS SECTION,P 24,TRANSMISSION LINE TYPES (1),* MICROSTRIP - A SIGNAL PLANE WHICH IS OUTSIDE OF POWER OR GROUND PLANES ON THESURFACE OF DIELECTRIC,P 25,TRANSMISSION LINE TYPES (2),*BURIED MICROSTRIP - A SIGNAL PLANE WHICH IS OUTSIDE OF POWER OR PLANES BUT BTRIED WITHIN DIELETRIC GROUND,P 26,TRANSMISS
15、ION LINE TYPES (3),*STRIPLINE - A SIGNAL PLANE WHICH IS BETWEEN POWER OR GROUND PLANES,P 27,TRANSMISSION LINE TYPES (4),*DUAL STRIPLINE - TWO SIGNAL PLANES ADJACENT TO EACH OTHER WHICH ARE BETWEEN POWER OR GROUND PLANES.,P 28,LAYER DENSITY, PLATO IS CURRENTLY BUILDING LIMITED PRODUCTION WITH .004/.0
16、04 ON THE INTERNAL AND EXTERNAL LAYERS., PLATO IS BUILDING VOLUME PRODUCTION WITH .005/.005 ON THE EXTERNAL AYERS.,P 29,SINGLE PLY LAMINATE/PREPREG CONSTRUCTION,TECHNICAL/COST/RELIABILITY ADVANTAGES (1),* SINGLE PLY CONSTRUCTION REDUCES BOARD COST,* REDUCES Z-AXIS EXPANSION DUE TO LOWER OVERALL RESIN CONTENT. (IMPROVED THERMAL RELIABILITY),* IMPROVED CONTROLLED IMPEDANCE CAPABILITY DUE TO REDUCED THICKNESS VARIATION.,* REDUCED WARP AND TWIST-DUE TO MORE HOMOGENOUS FABRIC STYLES.,P 30,SINGLE PLY
