《LED工艺制程培训教材课件》由会员分享，可在线阅读，更多相关《LED工艺制程培训教材课件（35页珍藏版）》请在金锄头文库上搜索。
1、LED工艺简介,LED 发光二极管形成过程,Sapphire蓝宝石 2-inch,衬底片,氮化物LED发光管的器件结构及发光机理,electrons,电子空穴复合发光,P 欧姆接触,N 欧姆接触,蓝宝石或碳化硅,MOCVD外延,芯片前工艺：第一步 清洗,有机物,金属离子,第二步n区光刻,刻蚀,去胶,p电极蒸发,P电极光刻,P电极腐蚀,KI+I2,去胶,丙酮+酒精,P电极合金,O2,N电极光刻,N电极蒸发,N剥离,N退火,N2,P压焊点光刻,P压焊点蒸发,P压焊点剥离,钝化层沉积,气体，功率,钝化层光刻,钝化层刻蚀,钝化层去胶,丙酮,中道终测检验,芯片后工艺：减薄,划片,裂片,扩膜,划片,裂片工
2、作流程图,划片前晶片背面,划片后背面,划片后,侧视图,裂片后,侧视图,扩膜后,正视图,测试分检,LED:Whats inside?,electrodes,semiconductor chip,epoxy dome,bond wires,“silver cup” reflector,Design Growth Processing Packaging Characterization,A packaged LED,Different parts of an LED,Process flow:,Photometry is just like radiometry except that everything is weighted by the spectral response of the eye,光学知识,Solid angle: sr = 2 (1 - cos(/2),立体角:,如何理解光通量(Lumen)和发光强度(Mcd),470nm LED: 3000mcd (20mA),P*62.139(lm)/Sr(15Deg)=3cd,P*62.139/0.0537=3cd,P=0.00259W=2.58mW,市场上:,
