《flex缺陷》由会员分享，可在线阅读，更多相关《flex缺陷（76页珍藏版）》请在金锄头文库上搜索。
1、AB (Air bubble) 空汽泡,Acc.,Rej.,BH (Block hole) 堵孔,Acc.,Rej.,BVH (Broken via hole)小孔孔偏,Acc.,Rej.,BT (Broken tab)微连接点断开,Acc.,Rej.,BU (Burr) 毛刺,Acc.,Rej.,CNO (Cover lay no opening) 覆盖膜冲形不完全,Acc.,Rej.,GC (Gold crack) 金裂,Acc.,Rej.,IL (islands)铜屑/残铜,Acc.,Rej.,MK (Marker)记号笔印,Acc.,Rej.,OE (Over etch)过蚀,Acc.
2、,Rej.,SMP(Solder mask peeling)油墨掉落,Acc.,Rej.,TR (Tearing)板撕裂,Acc.,Rej.,TS(Thinck solder)厚锡/聚锡,USM (Uneven solder mask)油墨不均,Acc.,Rej.,WR (Wrinkle)板面起皱,Acc.,Rej.,SC (Short circuit) 短路,Acc.,Rej.,OC (Open circuit)开路,Acc.,Rej.,PH (Pin hole) 针孔,Acc.,Rej.,NI (Nick) 缺口,Acc.,Rej.,PR (Projection)线边突出,Acc.,Rej
3、.,SW (Solder wicking)锡渗透,GW (Gold wicking)金渗透,Acc.,Rej.,SOG (Solder on gold)金面有锡,Acc.,Rej.,EC (Expose copper) 露铜/锡面露铜,Acc.,Rej.,GP (Gold peeling)掉金,Acc.,Rej.,ECG (Expose copper on gold)金面露铜,Acc.,Rej.,CON (Contamination)板面脏物,Acc.,Rej.,EFM (Embedded foreign material)板内脏物,Acc.,Rej.,RG (Rough gold)金面粗糙,
4、Acc.,Rej.,RP （Rough plating)镀面粗糙,Acc.,Rej.,DG (Dull gold)镀金不光亮,Acc.,Rej.,DIS (Discolor)镀面变色,Acc.,Rej.,COC (Cut into circuit)线条切入 / PS ( Punch shifted)冲板偏移,Acc.,Rej.,INP (Incomplete punch)不完整的冲板,Acc.,Rej.,INL (Incomplete legend)不完整字符,Acc.,Rej.,LNC (Legend not clear)字符不清,Acc.,Rej.,DT (Dent)凹痕,Acc.,Rej
5、.,ST (Scratch)划痕/刮伤,Acc.,Rej.,PT(Pitting)深坑,Acc.,Rej.,FP (Finger print)手指印,Acc.,Rej.,BS (Brown stain)棕色斑点,Acc.,Rej.,EXFR4 (Excess FR4)多余的FR4,Acc.,Rej.,EXST (Excess stiffener)多余的补强板,Acc.,Rej.,EXCO (Excess coverlay)多余的覆盖膜,Acc.,Rej.,EXC (Excess copper)多余的铜,Acc.,Rej.,EXSLV (Excess silver film)多余的银片,Acc.
6、,Rej.,EXL (Excess legend)多余的字符,Acc.,Rej.,SLVS (Silver paste shifted)水银片偏移,Acc.,Rej.,SS (Stiffener shifted)补强板偏移,Acc.,Rej.,FRS (FR4 shifited) FR4偏移,Acc.,Rej.,SMS (Solder mask shifted)油墨偏移,Acc.,Rej.,PSAS (PSA shifted) PSA偏移,Acc.,Rej.,LGS (Legend shifted)字符偏移,Acc.,Rej.,CS (Coverlay shifted)覆盖膜偏移,Acc.,R
7、ej.,MSS (Metal stiffener shifted)手工补强板偏移,Acc.,Rej.,FRL (FR4 lifted) FR4翘起,Acc.,Rej.,STL (Stiffener lifted)补强板翘起,Acc.,Rej.,PSAL (PSA lifted) PSA翘起,Acc.,Rej.,FL (Finger lifted)手指翘起,CTL (Circuit lifted)线条翘起,Acc.,Rej.,MSTL (Metal stiffener lifted)手工补强板翘起,CLL (Coverlay lifted)覆盖膜翘起,Acc.,Rej.,MPSA(Missing
8、 PSA)遗漏 PSA,Acc.,Rej.,MFR(Missing FR4)遗漏 FR4,Acc.,Rej.,MST(Missing stifted)遗漏补强板,Acc.,Rej.,MCL (Missing cover lay)遗漏覆盖膜,Acc.,Rej.,MMST(Missing metal stiffener)遗漏手工补强板,Acc.,Rej.,MSLV(Missing silver film)遗漏银片,Acc.,Rej.,MLG(Shifted legend)遗漏字符,Acc.,Rej.,SLVD(Silver shield damage)银粉剂损坏,Acc.,Rej.,FRD(FR4 damage)FR4损坏,Acc.,Rej.,PSAD(PSA damage) PSA损坏,STD(Stiffener damage)补强板损坏,Acc.,Rej.,SMD(Solder mark damage)油墨破损/损坏,Acc.,Rej.,CD(Coverlay damage)覆盖膜损坏,Acc.,Rej.,DEL(Delamination)层分裂,Acc.,Rej.,
