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1、IntroducingSilver Through HoleTechnology9/23/20241What is Silver Through Hole?To conduct both sides of circuits, Silver Paste replaced traditional copper as the conductive material through holes.銀膠，代替了傳統的銅箔，作為通孔中的導體導通兩面線路。Unlike traditional PTH, advance Silver-through-hole deploy precise silk screen
2、 printing instead of heavy metal electro-plating process.不同于傳統的PTH，先進的銀膠貫孔采用精確的絲印工序而非重金屬電鍍工序。9/23/20242Advantages of using STH 使用使用STHSTH的優勢的優勢Cost Saving (20%-25%)節省成本(20%-25%)Less Expensive Laminate板料價格更便宜Environmental Friendly 100% Lead-free環保，100%無鉛O.S.P. finish ensure flat pads for SMTOSP表面處理為S
3、MT保証平整的焊盤Compatible to all soldering processes適用于所有焊接過程Wide application for consumer appliances廣泛應用于消費器具中。9/23/20243Production Process制程Issue of MaterialCircuitSolder MaskCNC DrillingPunchingCarbon PrintOver Coat MarkSTHE-TestingO.S.PFQCPackageOutgoing9/23/20244End-products Application 終端產品應用終端產品應用C
4、omputer Peripherals (DVD-ROM)電腦周邊Mobile Communications移動通信Medical Electronics醫學電子RF Remote Controls無線遙控Hand-held Electronic devices手持式電子器件Security & Access Controls安全及訪問控制Air-condition Console空調控制板Automobile Dashboard汽車儀表板Other Consumer Electronic Appliances其它消費電子器具9/23/20245Comparison betweenSTH an
5、d PTHPCB STH STH 與與PTHPTHPCBPCB對照對照STH - Silver Through HolePTH - Plating Through Hole9/23/20246Cross Sections for STH & PTH 切片對照切片對照Silver Through HolePlating through hole9/23/20247Laminates applicationLaminateSTHPTHFR-1OK適用N/A不適用CEM-1OK適用N/A不適用CEM-3OK適用OK適用FR-4OK適用OK適用9/23/20248Processing Differen
6、cesProcessSTHPTHPattern線路Wet FilmDry FilmSolder Resist阻焊油UV InkPhoto Sensitive Ink 感光油墨Hole conduction 孔導通Silver Paste銀膠Electro-plating電鍍Legend Printing文字印刷UV InkThermal adhesive InkRemarks備注Green Product綠色產品Heavy Metal重金屬9/23/20249Design ParametersMeasurement (minimum)測量測量(最小值最小值)STHPTHLine Width線寬
7、0.15 mm0.10 mmLine Space線距0.15 mm0.10 mmThrough Hole Size通孔尺寸0.50 mm0.30 mmThrough Hole Pitch通孔間距1.50 mm0.75 mmSpace between Copper Land and Trace焊盤與線路的間距0.25 mm0.15 mm9/23/202410Less expensive laminate板料更便宜Green Process綠色制程Save higher cost from Electro-plating節省了電鍍所需的高成本Much more savings for Mass Production大量生產中可節約更多成本Can save cost up to 20% to 25%.成本節約率可達20%，25%。Costing Analysis9/23/202411ConclusionMature application in similar end-products成熟應用于同類終端產品Cost Saving節約成本Environment Friendly環保Ease of modification易于修正Can support Lead-free Soldering能支持無鉛焊9/23/202412謝謝讀閱！9/23/202413
