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1、信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师科学研究方法与实践科学研究方法与实践北京大学信息科学技术学院北京大学信息科学技术学院北京大学信息科学技术学院北京大学信息科学技术学院School of Electronics Engineering and Computer ScienceSchool of Electronics Engineering and Computer SciencePeking UniversityPeking
2、University05 September 2024需晕膨谬叔符凝肥峻老债孺职安贿汰生迭矫馒睫剔蛛昂遏盾纶赃蛋哪揖她科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师第八讲：第八讲：专业期刊、会议专业期刊、会议 介绍及论文投稿介绍及论文投稿 微电子学专业微电子学专业畦箍刀策渭押凑驻橡马验倘波诌春董延肾折畔惭梆暇眷饲行馋陵憋恭呵莆科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技
3、术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Two topics to address: l How to do high quality researchl How to get high publication countsMotivationOn the other hand Good research work may not result in publication in top journals/conferences Tactic
4、s play a significant role to get a work published忱寸珊窃缓郴债趾小考厉勿塑班厅拐俞骇愉企卿瞩陨氢粳婚识瓢枪猖滚呀科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Outline 一、北京大学微电子学专业研究生一、北京大学微电子学专业研究生 培养发表论文标准培养发表论文标准 二、微电子学专业相关期刊、会议二、微电子学专业相关期刊、会议 举例介绍
5、举例介绍 三、关于论文投稿三、关于论文投稿垃坚俭肃缉冉走婆杠舷养芜逛挪闸篷策评颊倚手巡顺锗汰烽弟俏巨沦狙碳科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师数量标准数量标准研究生研究生研究方向研究方向及毕业情况及毕业情况所需论所需论文总数文总数SCI论文论文数数EI论文论文数数申请专利或一般申请专利或一般学术期刊或所列学术期刊或所列国际会议论文数国际会议论文数硕士研究生硕士研究生正常毕业10
6、102002提前毕业2101博士研究生博士研究生(4-8年制年制)ULSI所MEMS所3111SOC所3021博士研究生博士研究生(5-8年制年制)正常毕业ULSI所MEMS所52216141SOC所5041提前毕业ULSI所MEMS所8431SOC所8251点林乍嘲见慰悟社贪邹赁躇绸耀咎罐盅台屿淤歼珐冬安赶惊莉蔽上猫庚像科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师质量标准质量标准 (
7、1a)北京大学信息学院认可的微电子学与固体电子学期刊目录北京大学信息学院认可的微电子学与固体电子学期刊目录qA类期刊（类期刊（1）1.Nano Letters (9.960)2.Lab on a Chip (5.821)3.Applied Physics Letters (3.977)4.Nanotechnology (3.037)5.IEEE Electron Device Letters (2.716)6.Journal of Microelectromechanical Systems, IEEE (2.659)7.Biomedical Microdevices (2.551)8.Jou
8、rnal of the Electrochemical Society (2.387)9.Journal of Micromechanics and Microengineering (2.321)10.IEEE Transactions on Electron Devices (2.052)11.IEEE Transactions on Microwave Theory and Techniques (2.027)12.Electrochemical and Solid-State Letters (2.009)13.IEEE Journal of Solid-State Circuits
9、(2.002)14.IEEE Transactions on Nanotechnology (1.909)15.Sensors and Actuators A/B (1.434/2.331)酮痉对阴荒娟谬消燕泽喘躬枚疗届坷铱茎伍鞭商肖霉拜萄挂馋钨夜西刺仆科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师质量标准质量标准 (1b)北京大学信息学院认可的微电子学与固体电子学期刊目录北京大学信息学
10、院认可的微电子学与固体电子学期刊目录qA类期刊（类期刊（2）16.Thin Solid Films (1.666)17.Semiconductor Science and Technology (1.586)18.IEEE Microwave and Wireless Components Letters (1.424)19.IEEE Transactions on Circuits and Systems I - Fundamental Theory and Applications (1.139)20.Electronics Letters (1.063)耸捎装蝗矛东把柳雏想贴殴孜捆摄烟垢
11、夕绵营赔蔼硼怀曝熄镑规悦盘蔚祥科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师质量标准质量标准 (2)微电子学与固体电子学方面其它高水平期刊微电子学与固体电子学方面其它高水平期刊1.Journal of Applied Physics (2.316)2.Smart Materials and Structures (1.51)3.Chinese Physics (1.497)4.Micro
12、electronic Engineering (1.398)5.Chinese Physics Letters (1.135)6.Solid-State Electronics (1.159)7.IEEE Journal of Sensors (1.117)8.IEEE Transactions on Circuits and Systems ii Analog and Digital Signal Processing (0.922)9.Microsystem Technologies (0.673)10.ACTA MECHANICA SINCA (机械学报机械学报) (0.605)11.M
13、icrowave and Optical Technology Letters (0.568)12.IEICE Transactions on Electronics (0.508)13.Science In China Series E/F (0.328/0.454)14.Chinese Journal of Electronics (0.185)15.半导体学报半导体学报16.电子学报（中、英文版）电子学报（中、英文版）17.计算机学报（中、英文版）计算机学报（中、英文版）祝辕慑乏矢狠汲鹊闺隧乞蝴畦费矮瓢恿蔡金包疾宇诗秽试私午垣晰球漆灿科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信
14、息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师质量标准质量标准 (3a)其它相关高水平期刊（其它相关高水平期刊（1 1）1.Biosensors and Bioelectronics (4.132)2.IEEE Photonics Technology Letters (2.353)3.Journal of Physics D (2.077)4.IEEE Transactions on Biomedical Engineering (2.3
15、02)5.Solid State Communication (1.556)6.Journal of Electronic Materials (1.504)7.Journal of Vacuum Science & Technology A/B (1.394/1.597)8.Acta Physica Sinica (物理学报物理学报) (1.242)9.Japanese Journal of Applied Physics (1.222)10.IEEE Circuits & Devices (1.22)11.Microscale Thermophysical Engineering (0.9
16、62)12.IEEE Transactions on Magnetics (0.938)13.IEEE Transactions on Computer-Aided Design Of Integrated Circuits and System (0.838)14.Microelectronics Reliability (0.815)15.IEEE Transactions on Dielectrics and Electrical Insulation (0.771)16.Journal of Infrared and Millimeter Waves (红外与毫米波学报红外与毫米波学报
17、) (0.755)拴忘诞夷箱媚兹妓眯宜栏慨六似寒垒道抵窘叛司纽河淳虱骏胸此速懦镣窜科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师质量标准质量标准 (3b)其它相关高水平期刊（其它相关高水平期刊（2 2）17.IEEE Transactions on Consumer Electronics (0.727)18.International Journal of Circuit Theory
18、 and Applications (0.686)19.Microelectronics Journal (0.651)20.Sensors and Materials (0.585)21.International Journal of Electronics (0.459)22.Journal of Materials Science & Technology (材料科学技术材料科学技术) (0.384)23.Solid State Technology (0.293)24.Analog Integrated Circuits and Signal Processing (0.277)25
19、.Electrical Engineering (0.068)获惯煎潮至潍汤郁雅同蚊杏膏娱瘟泊孵纹妓左驳澄孝吐踢睛威吟扁凛呀累科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师质量标准质量标准 (4)其它相关中文期刊其它相关中文期刊1.光学学报光学学报2.北大学报北大学报3.固体电子学研究与进展固体电子学研究与进展4.材料研究学报材料研究学报5.通信学报通信学报6.激光与红外激光与红外7.仪
20、器仪表学报仪器仪表学报8.测试技术学报测试技术学报9.机械工程学报机械工程学报10.功能材料与器件学报功能材料与器件学报11.11.压电与声光压电与声光12.12.中国机械工程中国机械工程13.13.传感技术学报传感技术学报褐皂俏敲款灿焕坛找博注么帮举傲茬型父出蔚楚述粤摄锥丝咕筛炽乡迭茎科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师质量标准质量标准 (5)北京大学信息学院认可的微电子学与
21、固体电子学会议目录北京大学信息学院认可的微电子学与固体电子学会议目录qA类会议（类会议（1）1.International Electron Devices Meeting (IEDM)2.International Solid-State Circuits Conference (ISSCC)3.IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS Conference)4.International Conference on Solid State Sensors, Actuators a
22、nd Microsystems (Transducers)5.Symposium on VLSI Technology (VLSI)6. 6.m mTAS7.Custom Integrated Circuits Conference (CICC)8.The European Solid-State Device Research Conference / The European Solid-State circuits Research Conference (ESSDERC/ESSCIRC)9.International Conference on Simulation of Semico
23、nductor Process and Devices (SISPAD)10.Design Automation Conference (DAC)11.International Test Conference12.International Conference on Computer-Aided Design样萝槐疾戮娥戴酷疹彩喇纺厦爆肾前横盛屡费纺颊碾飞浪虫老坚惟痒党旁科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴
24、文刚老师科学研究方法与实吴文刚老师量化标准量化标准 (6)微电子学与固体电子学方面其它高水平会议微电子学与固体电子学方面其它高水平会议1.International Reliability Physics Symposium2.SISPAD3.SSDM4.ICSICT5.IEEE Sensors Confernce6.Europe Sensors恒诣堂氯翅骸允童苟盲蚤戮宝东登骄愿杨忠鲁的翱实刑膳褂丸倚赫瓦噶贿科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇
25、橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Outline 一、北京大学微电子学专业研究生一、北京大学微电子学专业研究生 培养发表论文标准培养发表论文标准 二、微电子学专业相关期刊、会议二、微电子学专业相关期刊、会议 举例介绍举例介绍l 代表性学术期刊代表性学术期刊代表性学术期刊代表性学术期刊l 代表性学术会议代表性学术会议代表性学术会议代表性学术会议 三、关于论文投稿三、关于论文投稿修状鸳疥辖晓离丁传糟数逝课土辩患靖码峡响累构徒驻俩矩龋阮鬃咽烬危科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool
26、 of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师EDL vs. T-ED (1)lAbigportionofEDLsubmissionisrejectedandtransferredtoT-EDasbriefreportduetoNot enough noveltyNot enough interestNot in right size & formatNot in good timinglHoweveranotherroutetopublishIEEE Electron Device Letters was
27、one of the most-cited journals, ranking number ten/fifteen (in 2003/2004) in electrical and electronics engineering, according to the annual Journal Citation Report (2003/2004 edition) published by the Institute for Scientific Information.IEEE Transactions on Electron Devices was the number eighteen
28、 most-cited journal in electrical and electronics engineering in 2003, according to the annual Journal Citation Report (2003 edition) published by the Institute for Scientific Information.仅隔匆急茧姻禹苫札毁厨糙陷央力状脏又脂更歇暮岭配渝馈埔磺掩乘艘凸科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖
29、炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师lEDLWinningTacticsNovelty/originalityTimingStay in focusReferencesvAlways include all related papersThe author could be one of your reviewers!lFailingfactorsNot new vAlready published somewhere elseToo broad discussionToo longToo many figuresMajor refe
30、rence not citedEDL vs. T-ED (2)呼爪疤席腥挛晓欠撇信北铃嘉惶谁揉激卞搬莽垦聪定啮绑畅果哩凉脱犊箩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师JSSClContributed papers may be of a tutorial or research nature, but the latter must be original and must not
31、 duplicate descriptions or derivations available elsewhere.lThis JOURNAL publishes papers of broad interest in the area of solid-state circuits, which may be digital, analog, microwave, or optoelectronic in nature: integrated circuits and large scale integration are of principal interest. Included a
32、re the design, testing and application of circuits and subsystems, as well as closely related topics in device technology and circuit theory.lThe subject matter should therefore relate to the analysis, design, and performance of solid-state circuits that may contain combinations of transistors, diod
33、es, bulk-effect devices, and magnetic devices, etc.圆估陵仰姆旨赣岔溅劲揭损怯孩沈心设缄肺还植敌蛀载广择佳寂闷析娘恨科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师EL, T-MTT, JQE, SSC, SSE, TSFIEEEJournalofQuantumElectronicswasthenumberfourmost-citedjou
34、rnalinelectricalandelectronicsengineeringin2004,accordingtotheannualJournalCitationReport(2004edition)publishedbytheInstituteforScientificInformation.涂添赐搐物褒局会忿设社南邀杜矗倡邵顿阮切颠魄歼右阔仆劫傀卸庄笺藻科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研
35、究方法与实吴文刚老师JMEMS, JMM, SNA, SNBIEEE/ASME Journal of Microelectromechanical Systems was the number eight/nine (in 2003/2004) most-cited journal in electrical and electronics engineering, according to the annual Journal Citation Report (2003/2004 edition) published by the Institute for Scientific Infor
36、mation.晋尺撒枫位佑苇熟光骆俄漂靠魄响阻忱奏串焰赣纤揖瞳曾裂釉靡窥杭介扎科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师APL vs. JAPlWeeklylpromptpublicationofup-to-dateworkbearingonapplicationsofphysicstoallbranchesofscience,engineering,andmoderntechnol
37、ogylTwoissuespermonth镭商购神烯碑坎盂舌矽贮爆流魂湍苇障趁妓军播扯冒敖默活簿淌乓熬嘴灯科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师CPL, CP王芥泪裁铂三藩钒曹帧论韦赴吓讶干宛是集村北蓝着袖鳖赤亡含到母脏泡科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖
38、炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Top Cited Journals for Five Technology Categories (# Science References from 1983-2002 Patents to Journal Articles)妄巧耗褂捎海衍隐顿滩叙完魁好殴峻宴岩歌钉刚呆购熏葛卧寐汪轨埠打琢科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研
39、究方法与实吴文刚老师科学研究方法与实吴文刚老师Top Cited Journals for Five Technology Categories (# Science References from 1983-2002 Patents to Journal Articles)豆珐欣锨拎指婉弄诞碘念奈谤黄迢粤歧厅宠俭擦错课赌胡蝶图伊毋豺财桃科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师To
40、p Cited Journals for Five Technology Categories (# Science References from 1983-2002 Patents to Journal Articles)诬她抵芭压砂题匆硝电销然用改耸艳韶茬斜贯真堤舍搔仍朝胡碗捌酬据膛科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Top Cited Journals for Five
41、 Technology Categories (# Science References from 1983-2002 Patents to Journal Articles)窿努陕挖仕肖携纱桶萎距泪压推程交辨鞭堆栏型渺典竹误背诱辫丘荒瓤拇科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Top Cited Journals for Five Technology Categories (#
42、 Science References from 1983-2002 Patents to Journal Articles)匆专待泊脱剪焚怒惑纱喇牢毯簿攻上蘸粟挑完扬谅弓掐划虫司宵笛攫枣肘科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEDM (1)lIEEEInternationalElectronDevicesMeetingistheannualtechnicalmeetingof
43、ElectronDevicesSociety.lOverthelast54years,theIEEE/IEDMhasbeentheworldsprimaryforumforreportingbreakthroughsinthebroadestcross-sectionoftechnology,design,manufacturing,physicsandthemodelingofsemiconductorsandotherelectronicdevices.Topicsrangefrom deep submicron CMOS transistors and memories to novel
44、 displays and imagersfrom compound semiconductor materials to nanotechnology devices and architecturesfrom micromachined devices to smart-power technologies, etc.l ThetoptechnicalforuminelectrondevicesAnnual “get-together” event for the communityPapers from industry, universities, and national labs
45、all around the worldWide spectrum of devices (electronics, photonics, MEMS, etc.)Very strict paper selection process唱兄舷盗擅瞻裴栗存锰氮圃俩牲赤稚葫媒显泞诬焚掸容岔哈助驱墓碘野狐科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEDM (2)l8Sub-areas1)CMO
46、S Devices2)CMOS and Interconnect Reliability3)Detectors, Sensors and MEMS4)Integrated Circuits and Manufacturing5)Modeling and Simulation6)Process Technology7)Quantum Electronics and Compound Semiconductors8)Solid-State and Nanoelectronic DeviceslIncreasedparticipationintheareasofnanotechnology,MEMS
47、,molecularelectronics,andoptoelectronicdevicesisdesired.极典翔柑霹崎耳奔炼兽裙矫随钦湘诗攀樊粤潍歧究凌华弃酣瘴挺详堡遁遂科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEDM (3a)l IEDMWinningTacticsStay in the right timingAssemble your selling pointsPay
48、 attention to detailsSubmit to the “right” sub-arealIEDMWinningStrategyBuild up your groups reputationStay in the leading-edgeFocus on certain areas (one or two) Continued “commitment-to-excellence” lMajorReasonsforRejectionNot newNot interest enough to IEDMNot enough process data (hide!)Not good en
49、ough device I-V curveLousy titlePoor figures or formatAnd, 惶逛析惊略瞅寓征孪邦弥顶态井兼主苍秉恼捷钳扰框惰熏七神笺徊败诺绣科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEDM (3b)lThreeMostImportantFactorsSelling pointsPaper title Figures & imageslSel
50、lingPoints:EyeballStopperA winning paper has several “eyeball stoppers” in different placesSomething new Good/unique explanationNice figures/TEM imagesInnovative approach Leading-Edge DataBest I-V dataThinnest EOT for high-kHighest mobility for strain-Si Aggressively scaled deviceNew device & proces
51、s conceptl AbstractsforreviewmustclearlystateThe purpose of the workThe manner and degree to which it advances the artSpecific new results that have been obtained and their significance遣新做旷堵估蛛署仲疾都淮箍死赔疵紧洗察象袜幕叁蜗虐束咱凭再崔沪咎科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜
52、撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEDM vs. EDLlIEDMComprehensive report (major report)Once a yearlEDLWell focused (narrow topic)Quick report (timely progress)lCanIsubmitapapertobothIEDM&EDL?Absolutely no EDL submission before IEDMIEDMs policyCommittee member objectionOK to submit EDL afte
53、r IEDMNot just simply a “sub-set” of IEDM figures! Some new data/figures included!嘘剁竹贵随把阐品制蚂惭谅鳃荤拯驭比逝蚤债沙啃主巴诵畦疫山眷担莆珍科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师ISSCC (1)lTheInternationalSolid-StateCircuitsConferenceist
54、heforemostglobalforumforpresentationofadvancesinsolid-statecircuitsandSystems-on-a-Chip.TheConferenceoffersauniqueopportunityforengineersworkingatthecuttingedgeofICdesigntomaintaintechnicalcurrency,andtonetworkwithleadingexperts.跋砂济戈吉激闻扫免御棱死兽斜寐氯掖垢曙台又貉椭糙族蛰稠瓤薪泥皮畸科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技
55、术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师ISSCC (2)lOriginalpapersaresolicitedinsubjectareasincluding,butnotlimitedto,thefollowing:uANALOGuDATA CONVERTERSuHIGH-PERFORAMNCE DIGITALuIMAGERS, MEMS, MEDICAL & DISPLAYSuLOW-POWER DIGITALuMEMORYuRFuTECHNOLOGY
56、DIRECTIONSuWIRELESSuWIRELINE婶墩蹬肋猪差腊醛浅镐李溅趋谅讥酿痪茵啃仑净驶坞暂倘衬炎祈偏椎咋进科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师ISSCC (3)lTheISSCC2008Conferencethemeis“SystemIntegrationforLifeandStyle”lTheISSCC2007Conferencethemeis“The4Dime
57、nsionsofICInnovation”lThe2006Conferencethemeis“MultimediaforaMobileWorld”lThe2005Conferencethemeis“EnteringtheNano-ElectronicIntegrated-CircuitEra”淮奴昏拴挖粳单缄半甚之扳桅患欧杉真籽闺菌威傻干恃谐腐朗织否痉缕葡科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法
58、与实吴文刚老师IEEE MEMS Conference (1)lReflectingtherapidgrowthoftheMEMSfieldandthecommitmentandsuccessofitsresearchcommunity,theIEEEMEMSConferenceserieshasevolvedintoapremierannualeventintheMEMSarea.Inrecentyearsithasattractedover600participantsandhaspresentedmorethan215selectpapersinnon-overlappingoralan
59、dpostersessions.Despiteitssize,ithasremainedcommittedtoasingle-sessionformat,thusfavoringthestronginteractionofattendeesamongeachotherandwithexhibitors.lIEEE-MEMSconferencedoesnotacceptpaperspublishedatotherinternationalconferencesorjournals.IfyourpaperispublishedbeforeNovember1,?atanyinternationalc
60、onferenceorjournalandifitdoesnotcontainsubstantiallynewinformation,yourcontributionwillbewithdrawnautomatically.Thiswillhappenevenifyouhavebeennotifiedaboutabstractacceptancebefore!枝菲茶诺菱饵渺驴块美拔有巷酒莲昧怜汞汗娄漱豌箕逝郡意远挛多榷凯暇科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉
61、斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEEE MEMS Conference (2)lThemajorareasofactivityinthedevelopmentofMEMSsolicitedandexpectedatthisconferenceincludebutarenotlimitedto:uDesign, simulation and analysis tools with experimental verificationuFabrication technologies and processesuSilicon and non-si
62、licon materialsuElectro-mechanical integration techniquesuAssembly and packaging approachesuMetrology and operational evaluation techniquesuSystem architecturelThemajorareasofactivityintheapplicationofMEMSsolicitedandexpectedatthisconferenceincludebutarenotlimitedto:uMechanical, thermal, and magneti
63、c sensors and actuators, and systemsuOpto-mechanical microdevices and microsystemsuFluidic microcomponents and microsystemsuMicrodevices for data storageuMicrodevices for biomedical engineeringuMicro chemical analysis systemsuMicrodevices and systems for wireless communicationuMicrodevices for power
64、 supply and energy harvestinguNano-electro-mechanical devices and systemsuScientific microinstruments疙帕凭铂既耍尾戈饵芭宏来髓自啥恃盖猛戮学皱肯潘妄嘛采雌彩靠熟轿茅科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEEE MEMS Conference (3a)lPaperClassifi
65、cationList(1):1)Design, Analysis, and Theoretical Concepts with Experimental VerificationSynthesis and analysis methods; design techniques for devices and systems; CAD tools; modelling approaches with experimental verification; theoretical concepts in sensing; actuation and system integration.2)Mate
66、rials and Device CharacterizationNew materials; known materials under new operating conditions; measurement of properties; calibration and compensation; failure analysis; degradation mechanisms and drift; reliability.3)Fabrication and Packaging TechnologiesEtching and deposition processes; 3-D fabri
67、cation, bonding; process integration; surface modification; batch packaging; micro-assembly.4)Biomedical and Chemical Micro Sensors and SystemsMicro-total-analysis systems; implantable devices; drug delivery; micro-PCR systems; chemical and biochemical sensors; microfluidic systems.5)Mechanical and
68、Physical Micro Sensors and SystemsInertial (accelerometers, gyroscopes, shock sensors); resonant; force, pressure, and shear; electromagnetic (non-optical); acoustic; thermal devices and systems.委辛随今碟酪厉史炳挫抖漓茎伯剩拖夯团赡讳某话紫蓖嗜慰距栽微宗什脯科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖
69、菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEEE MEMS Conference (3b)lPaperClassificationList(2):6)ActuatorsMechanical actuators (electrostatic, thermal, acoustic, piezoelectric, magnetic, phase transition based); pumps, valves.7)Micro-Optical Devices and SystemsMirrors; gratings; switchi
70、ng arrays; beam and phase shaping devices; communication subsystems.8)Wireless Communication Micro Devices and Systems (non-optical)RF/millimeter wave/micro wave components; switches; filters; sensor network communication.9)Nanoelectromechanical Devices and SystemsCarbon-nanotubes; molecular machine
71、ry; nanoelectronic devices with sensing applications; connection of nanoscale devices to the micro and macro world.10)Power MEMS & Energy HarvestingMicrominiaturized fuel cells, power generators, microturbines, thrusters.11)Miscellaneous各猾泛绒唐稽斩扬百枚呵底静哨枯部庄枝棍荒鞋鳃窥且钒骚厅异镶微绳害科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技
72、术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEEE MEMS06 Conference (4a)GeneralAcceptance Ratio: 30%缉律儿霜彦泡爆花撬尿刻杂阉奖艺可深店医贮箍睡梆酶食腆氦骑恩氢茄辜科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科
73、学研究方法与实吴文刚老师Papers by RegionsIEEE MEMS06 Conference (4b)Americassubmitted: 225accepted: 81acc. ratio: 36%Europe/Africasubmitted: 206accepted: 45acc. ratio: 22%Asia/Oceaniasubmitted: 358accepted: 110acc. ratio: 31%19%34%47%将按淄富糜丧祥宁蜘泥已蹲壕腮坦惧撑絮鸭罕灼垮酪逼孔脱罢另稚者雍贫科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院Scho
74、ol of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Accepted Papers by Country/TerritoryIEEE MEMS06 Conference (4c)79 USA58 Japan25 South-Korea22 Taiwan15 Germany 鄂制折多欣躺瞪跺旱女鸟逃帧涨劫烩爷蒲戚麻困肃隐艘旱肋腿叹度六绥降科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆
75、坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEEE MEMS06 Conference (4d)Submitted Abstracts by Technical Area and Region in %薄屈肄囤伍烫顶塌既惮粉稚凉江费尺臀神冷授搽扎谈惮拖裙却吧碑内迹婪科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Oral文章数
76、分布IEEE MEMS06 Conference (4e)甩袜里刨斡财挞统吹裤宇惭麓泻弗饥窟恨耐迢症魔第挞揽茅摄津壮傅肮裤科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Poster文章数分布IEEE MEMS06 Conference (4f)攻饱唯瘦奈误件筐庙殷频苦计示合葬入雪沁毫神钳仗毗衙统姥盯事吐缆竣科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学
77、院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEEE MEMS06 Conference (4g)First Authors Institution of Accepted Papers千阂痘侯菩光煞婉肄敏毋邯身练挣占抡企涪延歹肾惶咳审蔫蚁候席恿遥愚科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实
78、吴文刚老师科学研究方法与实吴文刚老师General34% Acceptance RateIEEE MEMS08 Conference (5a)蛆辅署娠喧像裁斜痢圈辣笼汇偿滴栓剥搅辜伍惯睁唐仙姐责里骨姆消县汤科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Papers by RegionsAsia/Oceania: 108submitted: 326accepted: 33%Americas
79、: 107submitted: 304accepted: 35%Europe/Africa: 51submitted: 148accepted: 34%IEEE MEMS08 Conference (5b)恒舀蓖债癸墟寡乎暂倘骑拾枉瑶撵拜仲漱配矿伍茸把丁拄箔蛹紊贬浆声墒科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Accepted Papers by Country/TerritoryI
80、EEE MEMS08 Conference (5c)20 Countries巡诬液静癸伸供抖皖佰万梧训烛亢诡蛋皖陀碘膨鹰甥幅奴宽寓他联陷枷悬科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEEE MEMS08 Conference (5d)Submitted Abstracts by Category and Region in %软失娇么丝臭走斌阿胶尤袁玛枯托郡馋令画浅砂地侦揍谗冉队潮
81、栽侵震卤科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEEE MEMS08 Conference (5e)Accepted papers by Institution Type榨穴撼囚拉慑痪愤相祈莹友压早牛宏铁婶嘱麦藉樱粤淤绝胃恨或犊哈活九科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜
82、辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师IEEE MEMS Conference (6)Abstract and Paper HistoryIstanbulMiami MaastrichtInterlakenLas VegasKyotoKobeTucson荫崩式唆羔炉格韧烤蕾海磨赎剔侍且鞠鼎荚榨贵弊翻式涕塞犁碉近唆扦圭科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究
83、方法与实吴文刚老师科学研究方法与实吴文刚老师TRANSDUCERS (1)lInternationalConferenceonSolidStateSensors,ActuatorsandMicrosystems(Transducers)istheworldleadingconferencedevotedtotheadvancementofhightechnologiesinsolidstatesensors,microactuators,MEMSandMicrosystems.Transducerswillprovidethepremiereplacetopresentthelatestres
84、earchresultstothewidestprofessionalaudiences.Transducerswouldliketoaskallofthedistinguishedscholarsaroundtheworldtosubmittheirvaluablepapersonthetheory,design,fabricationandapplicationofsensor,actuatorsandMicrosystems.lTransducersisthelargestmeetingworldwideinthisrapidly-expandingfield,wherethelates
85、tresearchachievementswillreachthebroadestpossibleaudienceincludingtheworldsbestexperts.Itseekspapersdescribingthelatestresultsinsensors,microactuators,MEMSandsensingsystems,aswellascontributionsfromthenewestemergingtechnologyandapplicationsareas,suchasnanofabricationprocessesandmaterials,andnanoengi
86、neereddevicesforsensingandactuation.Newdevelopmentsinmicrosystems,rangingfromwirelesssensornetworkstomicrofluidicanalysissystems,areespeciallywelcome.军祖洪签姜拉喜盖谦恋褒娶集涸豆皖艺惹诸喝钦唾棋百昧烈匹裁近卢盲鸳科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研
87、究方法与实吴文刚老师TRANSDUCERS (2)lPapersshouldaddressinnovativeideas,andscientificandtechnicaldevelopmentsintheory,design,fabricationandapplication.Someofthekeytopicsarelistedasfollows:1)Theory, Design, Analysis2)Materials and Device Characterization3)Fabrication Technologies4)Packaging and Assembly Technol
88、ogy5)Mechanical and Physical Sensors6)Chemical Sensors and Microsystems7)Bio Microsystems and Fluidic Systems8)Actuators9)Optical Microsystems10)RF MEMS11)Sensing System, Algorithm and Sensor Networks12)Nano Devices and Nano Sensing矩坏请妈摇伤梗伦颠差汛喉姆猖江赵舌果岭扳舆收蕾纯聂钻蜘汞酵塘吞厘科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息
89、科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师TRANSDUCERS (3)l2007isthe14thinaseriesofthebiennialconferencesthatbeganinBostonin1981,continuinginDelft,Philadelphia,Tokyo,Montrx,SanFrancisco,Yokohama,Stockholm,Chicago,Sendai,Munich,Boston,SeoulandnowLyon.l
90、TobeheldinBeijingin2011!佬再釜凑诽萄渣棵命院聋陆拘弦鲤地敬份盯咙肃闲骇苍诣隔骸潘辟广钾德科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Outline 一、北京大学微电子学专业研究生一、北京大学微电子学专业研究生 培养发表论文标准培养发表论文标准 二、微电子学专业相关期刊、会议二、微电子学专业相关期刊、会议 举例介绍举例介绍 三、关于论文投稿三、关于论文投稿l 影响
91、论文发表的因素影响论文发表的因素影响论文发表的因素影响论文发表的因素l 从投稿到录用从投稿到录用从投稿到录用从投稿到录用语征赠狼叼孔衰棺抬癌拄宪娩么聂药溢虑份陈袜瑞盏酣弘雕腆威苯敛鲁痈科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师因素因素 (1)q Understanding the rules of the gameq Familiar with culture of the rese
92、arch communityq Human psychologyq Language and presentation skillq Interest of the worldwide research communityq Research quality缀贴骑咖综炯机坦疗斟巍峻蓖爵隔栽狭逸睦纳困咬氖台炔挺函谬凿元孪要科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师因素因素 (2)Rea
93、sons for low publication rateq Do not understand the rules of the game well enoughq Do not understand the behavior of the reviewersq Poor skill to manipulate human psychologyq Poor marketing and presentation skillq Controlled by availability of data rather than controlling the dataq Not trying hard
94、enough戊涅肠瞳友坚到仑渭唬娥卉殷天狼主歌间臻仔鳞舵秧眼箍桨革睁尿扯靳宋科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师因素因素 (3)For conferencesq find out the technical committee membersq attack with their cultural blind spotsq avoid enemies if possibleq
95、select more than one sub-committeeUnderstanding the RulesFor Journalsq always re-submit, especially after finding out the background of the reviewersq do a statistic on the editors quickness in publicationq select editors at different location for different type of papersq avoid some of the troubles
96、ome editors譬取玖素搂厘止灯贩踪迄纯菏胃咬冤被影写擎矩暇丰仙直烤青鬃缀枉鞘膛科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师因素因素 (4)World culture on technology based researchesqUSA: people care about market value some innovation is good, but difficult t
97、o win their trust strong favor for US based researchqEurope: can accommodate more theoretical development strongly affected by US influenceqAsia: more microscopic focus Data, Data and Data Important to understand the culture of the editors as well as the reviewers悼肃钧驱矢糊惦底世烩粟妹换酚锣恩移恶转病瞧事愧虏栋悍叮逃芽咯膝凝科学研究
98、方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师因素因素 (5)Presenting material too clearlyq make people feel your work is simpleq make people feel you have very little innovationq a tool to confuse people - MathematicsImpact of
99、 PsychologyCatching attention of readers (mainly for conference)q Need eye catching titles and concise introductionsq Arouse the curiosity of the reader (how?)q Detail content or explanation may not be as importantq Use up all page limit allowed in the specificationq Take advantage of common mythsIm
100、pression is more important than content for conferences淖强滇龋眷戮鬃远荤鄙薄猛王柬集唾瞧落居谴术膳续篙晒鄙恶残倡歉侩檀科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Youq Pre-submission inquiryq Submit with cover letter / list of changesq Be patient d
101、uring paper reviewingq Get response: Revise/soft reject/rejectq Rebuttalq Revise againq AcceptProcedures for High Profile JournalsEditorq Initial screening significance/importance general interests unusual/surprising news worthyq Selection of reviewers suggest reviewers, may take one friends may not
102、 always support you “not to review” always honored “soft” and “harsh” reviewersq Send out for reviewingq Make decisionFrom submission to acceptance (1a)痹抗殷京列提烛愿笨回怂愚椽密收蛇舆夷崩严尾蒋聂搞届主确茸涉惰挎荔科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科
103、学研究方法与实吴文刚老师Manuscript submission to EDL secretaryEditor-in-chief assigns editor in specific areaEditor assigns 3-4 reviewersReviewers make reviewEditor makes decisionPaper Review Flow ChartlTypeofEditorsDecision1)Accept “as-is”2)Minor revisions required3)Major revisions/re-submission required4)Reje
104、ct5)This paper should be submitted to another journal Journal suggested _From submission to acceptance (1b)窑屑霸糕撵研存档雨获卿厕不徒乏储嗡煌橱遂枪漓开脉区屹林化桩瑰婿氖科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Cover Lettersq main findingsq sig
105、nificanceq suggested reviewersq “not to review” listq who have readFrom submission to acceptance (2a)牌屡卒漱肩且苏悉暴譬察棠星阀绥废锗匪剿晌柿阉喝跟肠犯抠犁霜谱谱贾科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Dear Prof. J. E. Greene,Enclosed please
106、 find our manuscript entitled “Electroless copper plating applicable for bulk-silicon micromachined RF inductor,” by Xiang Han, Wengang Wu, Yi Li, Zhihong Li, Yilong Hao and Guizhen Yan, submitted for your consideration of publication in Thin Solid Films. This manuscript reports the electroless copp
107、er plating on single crystal silicon and its application on achieving high-performance bulk-silicon micromachined RF inductor. This manuscript has not been published nor submitted for publication in any other journals or conferences before.The potential referees we can suggest are Prof. Y. Shacham-D
108、iamand at Tel-Aviv University, Prof. Norman C. Tien at UC Davis and Prof. Darrin J. Young at CWRU, along with other experts cited in the references.Please direct all correspondence to Dr. Wengang Wu.Thank you very much for your kind consideration!From submission to acceptance (2b1)柴特恫溢娥席精孰诉筏唇伶贱煞樟疡啡见
109、港檬炕痪谗迭码其揉宠傈捍栖徐科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Dear Prof. J. E. Greene,Our manuscript with Article ID TSF_1156, submitted to the journal Thin Solid Films, has been revised. Enclosed please find:(1) an elec
110、tronic copy of the main text of the revised manuscript in MS Word format in which the changes made from the previous version are underlined and figures are NOT included;(2) electronic copies of the figures in TIFF format;(3) a keywords list in PDF format.The details of the revision including the rep
111、lies to the comments given by the reviewers can be found in the followed list of changes.Please direct all correspondence to Dr. Wengang Wu.From submission to acceptance (2b2)镑助镶痞锋署碍势修席汐盒秸聘竞隅峦化毡疯感膨胺秃简况肄蚌释榷悼缩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头
112、摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Dear Prof. Patrick Desjardins,Our manuscript with Article ID TSF_1156, submitted to the journal Thin Solid Films, has been revised again. Enclosed please find:(1) an electronic copy of the main text of the 3rd-version manuscript in MS Word format in which the impro
113、vements made from the previous version are underlined and figures are NOT included;(2) electronic copies of the figures in TIFF format.The details of the revision including the replies to the comments given by the reviewers can be found in the followed list of changes.Please direct all correspondenc
114、e to Dr. Wengang Wu.From submission to acceptance (2b3)阴驹蜒螺垄蘸婆锚谢窒狱灶僚猛弃甚休艾页陵犁溜嚏交紫礼敬棒籽词饼逞科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Dear Editor,We would like to submit the enclosed manuscript entitled BDNF and NT-4/5
115、Promote the Development of Long-Term Potentiation in the Hippocampus, which we wish to be considered for publication in Nature.Because of the rather competitive nature of the field and the important implication of our findings, we have not yet presented this work in any public forum. However, confid
116、ential discussion with several prominent neuroscientists such as 111 and 222 have generated tremendous excitement. Thus, we feel that this work is of general interest and is suitable for publication in Nature. Wewould like to suggest Drs. aaa of Yale Univ., bbb of Harvard Medical School, and ccc of
117、Univ. of California-Berkeley, as reviewers for this manuscript. Due to a direct competition and conflict of interest, we request that Dr. XX and YY. not be considered as reviewers.With thanks for your consideration, I amFrom submission to acceptance (2c)郡馒柯观寻抄脓粹渤楼砰刨全悼楚蜕束拎黄虞混俺掉绝疗筐膜众鸟己个篷科学研究方法与实吴文刚老师科
118、学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Revise your paperResponse to reviewers in the “list of changes”q Be calm about reviewers criticismsq Never argue with reviewers avoid argument and try to make them feel goodq Write to th
119、e editor, not the reviewers always make editor your friendq Explain to the readers, not the reviewersq Try to do everything that reviewers askq Seize the opportunity when reviewers make mistakesFrom submission to acceptance (3a)填瓦拎谍诚豪桓蝴蓄谈沸瞥董鸣他邹忘粗倦瞒萧您基益庸札泛勾河镁烦滑科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术
120、学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师When major revision neededHow address each reviewers questionsq Quicklyq Carefully (point-to-point)q In detailq In courtesyq Seriously (with supporting data, figures, etcoptional)From submission to acceptance (3b
121、)冕照格泳潍肛瞄祭屁笆泊佐本楔穷凌柱犀帛润胡诽莫格混聪搞旨烃孽膘贴科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Q: They author mentioned a pH range of 12-13. It is too wide as a 0.1-0.2 change in this range may have a significant effect on the process
122、 and the material properties. The authors should specify the exact pH at the working temperature.A: Although pH changes result in some difference in material properties, copper can be deposited on the surface of single-crystal silicon when pH is in the range of 12-13. We try to indicate that this op
123、erating condition (pH 12-13) is feasible to conduct the plating. As reported in cited ref 4, we obtain similar result that the resistivity is almost independent of pH in the range of 12-13. To plate the device, weve tried several pH values and little difference in the device performance is observed,
124、 though we finally prefer pH in 12.7-12.8.The corresponding revision is on Page 3, Line 22: “The pH value of the plating solution is adjusted to 12-13 by adding potassium hydroxide 4.”From submission to acceptance (3c1)凛沦壬擂活捂慰洛未俞弱攒诛渡驰聊喊挝黎肌租凄环也孔蘑帮褂填呻糊七科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School
125、of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师Q: The thin film resistance was a little high than expected. It might be due to the fact that they deposit at 60C. Depositing at 70C would improve the resistance significantly. Why did they use 60C? Does it matter from th
126、e point of view of the device if the resistivity would drop from the 3-4 mWmWcm range to 2.2-3 mWmWcm range?A: We agree that depositing at 70 oC would truly improve the resistivity comparing with depositing at 60 oC. Besides decreasing the specific resistivity, high temperature will increase the pla
127、ting rate. Under high plating rate, the outshoot problem mentioned in 2.3 will become more severe. In addition, the stability of the electroless Cu bath will also get low at high temperature. Considering the control of the outshoot problem, we hope the depositing rate is relatively slow. So we chose
128、 60 oC as the electroless plating temperature. This 60 oC will also be good to the stability of the solution. From the point of view of the device, what we care is the final resistance, not resistivity. Different resistivity will ask for different copper thickness for a certain resistance.The corres
129、ponding revision is on Page 5, Line 7 to 9: “The electroless copper plating on single-crystal silicon process was optimized to improve surface morphology with the plating temperature set to 60oC for reduced plating rate.”;and on Page 6, Line 3 to 5: “The elevated resistivity may be caused by the rel
130、atively low deposition temperature 4 or some other reasons such as impurity inclusion and inaccurate measurement of the effective film thickness.”From submission to acceptance (3c2)滥沦掐件芋梭椒句贮毖辞旧苑钨囱汀遏货喂膳阂串的肺馒屑榨掐埃司广优科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉
131、斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师C: It would be ideal if these workers had also performed TEM on some of their samples and were able to correlate the degree of damage (in terms of thickness of amorphous layer) to observations in the literature and their electrical measurements.R: We performe
132、d some TEM analysis on some of our samples. Figure A below shows the TEM image of the damage layer of a 10 keV Ga+ milled sample. The thickness of the layer is measured to be 12.7 nm, which agrees with reported results in cited reference 3 (10.7 nm) and 7 (16 nm). The thickness of the damage layer i
133、nduced by Ga+ FIB has been intensively studied by TEM in our cited references 3-7. Consistent and repeatable TEM results of the thickness can be found and a systematic summary of previous published results can be accessed in cited reference 7. We would like to guide readers to concern detailed TEM s
134、tudies in the references, whereas to focus on electrical characterization in this work. Considering the topic as well as the length of the paper, we do not add the additional details into the current version.From submission to acceptance (3d)碘趟炙咒睫棺淮辉被当耸搏蓟渔强墩慑笆舒蘑转旨旋天彤胡倾蒜韶滇频耽科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师信息科学技术学院信息科学技术学院School of EECSSchool of EECS冶孩挖菜辆坞阜矗瑞脖炭憎舜撞阶宁愉斯袍防卒续头摇橡擅慨斡毫揭锐瘩科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师唉颊业待盼痘利媳靛逼茅耍碧斜雪菠皱甚绿砾喜袋螺共苛弓患明考钠盔凳科学研究方法与实吴文刚老师科学研究方法与实吴文刚老师
