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1、表面处理工艺SurfaceTreatmentsProcesses20-Apr-09常用表面处理工艺1.水镀 NormalPlating2.真空电镀 PVDPhysicalVaporDeposition3.电泳 Electrophoresis4.电铸 Electroform5.抛光 Polishing6.蚀刻 Etched7.镭雕 LaserCarved8.氧化 Oxidation9.喷砂 Sandblast10.批花 (一般对logo进行处理)ShinyLogo11.拉丝 Drawbench12.CD纹 CDline13.其他 Other14.R&D相关产品工艺 R&DRelativeProd
2、uctProcess1. 水镀 Normal Plating电镀原理：指借助外界直流电的作用，在溶液中进行电解反应，使导电体（例如金属）的表面沉积金属或合金层。电镀分类： BarrelPlating滚镀，RackPlating水镀。机械整平机械整平上挂上挂检验Process:超声波超声波除腊除腊热侵除油侵除油电解除油解除油酸活化酸活化预镀碱碱铜镀焦焦铜镀酸酸铜镀白白铜锡过沥架架1. 水镀 Normal Plating滚镀生产线水镀生产线除腊除腊后上挂除油酸活化镀焦铜酸清洗镀酸铜镀白铜锡1. 水镀 Normal Plating水镀常见问题：麻点：胚料表面不平整或电镀液有杂质。气泡：电镀层里有空气
3、或聚集着电镀液，一般以小面积形状出现。电镀层附着力不足，脱落；（EseriesDawnStrapmetalpieceplatinglayerpeeloff)。电镀层与胚料之间或镀层彼此之间的附着力不够，一般以较大面积出现 。烧焦：在镀件尾部和边缘一带产生了粗糙或其它不满意的镀层，颜色暗或灰白。水渍：电镀后工件藏水，当水烘干后在工件会出现一些花痕，不易擦去。1. 水镀 Normal Plating水镀常用颜色：无叻叻色 （“无镍白铜锡”-”NonickelandwhiteCopperTin”）；枪色（GunMetalColor）；金色（GoldenColor）；珍珠银、珍珠白 （PearlSil
4、ver/white）；1. 水镀 Normal Plating一、吊镀价格（仅供参考，以时价为准）序号镀种镀层厚度（微米）计量单位单价：元1锌8-15平方分米0.402镍8-15平方分米1.003光亮镍8-15平方分米1.254铜锌合金6-8平方分米0.605铜锡合金6-8平方分米0.606金0.1-0.5平方分米40.007银6-8平方分米4.008铜10-20平方分米0.559锡8-10平方分米1.20二、原材、型材镀锌价格：11.5元/KgCustomerhasreleasedcriticalrequirementtocontrolNi/Cosubstanceinmetalpartpla
5、ting.NOKIA-bannedplatingNi/Coinmetalpartsurface.SE-bannedplatingNiinmetalpartsurface.Motorola-bannedplatingNiinmetalpartsurface.客户提出禁止产品电镀层中含有镍/钴成分。Influenceforourproducts:Silvercolorpart:wecannotuseNiasundercoatinglayeranymore.Gunmetalcolorpart:wecannotuseCototunecolorofplatingsurface.对我们产品的影响：银色不能
6、用镍成分，枪色不能用钴进行调色。Objective:NeedtosearchnewprocessformetalpartplatingtoavoidusingNi/Cosubstance.目标：寻求新的电镀工艺：避免使用镍/钴。1. 水镀 NormalPlatingNormalNickelplatingprocess:“Cu+Ni+Cr”.Itisamatureprocess,itcanpasswearingvibrationtestsmoothly.Aimatitwillcauseallergenicofskin,customerhasbannedtouseit.常规银色镍电镀可以通过耐磨测
7、试，但由于其会引起皮肤过敏，客户已经要求禁止使用。Replaceplatingprocess:“NonickelandwhiteCopperTin”.Topasswearingvibrationtest,Snthicknessshouldbecontrolledatabout0.71.0um.Requiretocoatharderorganicfilm.Remark:Surfacerigidityof“NonickelandwhiteCopperTin”processcannotreachthesamelevelof“Cu+Ni+Cr”process.改善后的银色电镀电镀用锡代替镍。Plant
8、ostudyotherprocessestoachievesilvercolor:UsestainlesssteelmaterialtoreplaceZincmaterial,usePVDtoreplacenormalplatingtoachievesilvercolor.Usestainlesssteelinherentcolorafterpolished(neednotanyotherplating).Useplasticpartreplacemetalpart,usePVDtogetsilvercolor.Remarks:PVD-PhysicalVaporDeposition.其他工艺：
9、使用不锈钢进行真空电镀，使用不锈钢原色等。OrganicFilmCr(Cr+3process)NiCuBaseSubstrateZincOrganicFilmSnCuBaseSubstrateZinc“Cu + Ni + Cr” Process“No nickel and white Copper Tin” Process1. 水镀 NormalPlating“PVD” Process 2OrganicFilmCo+SnSnCuBaseSubstrateZincOrganicFilmPVDTiCr(Cr+3)BaseSubstrateZincNormalgummetalcolorplating
10、process:“Cu+Sn+Co”.Itisamatureprocess,Coelementisusedtotoneguncolor,itcanpasswearingvibrationtest.Aimatitwillcauseallergenicofskintoo,customerhasbannedtouseit.常规枪色电镀，用钴进行调色，但由于其会引起皮肤过敏，客户已经要求禁止使用。Plantostudyotherprocessestoachievegunmetalcolor:“PVD”process1:platingoneCrlayeratbasesubstrateZinc,thena
11、rrangethepartforPVD.Defectrateofthisprocesswillbehigherthansingleplatingprocess.“PVD”process2:usestainlesssteelmaterialtoreplaceZincmaterial,usePVDtoreplacenormalplatingtoachievegunmetalcolor.Useplasticpartreplacemetalpart,usePVDtogetgunmetalcolor.改善建议：1、锌合金用水镀真空电镀避免使用钴；2、不锈钢真空电镀部门使用钴；3、用塑胶代替五金件。“Cu
12、 + Sn + Co” Process“PVD” Process 1OrganicFilmPVDTiBaseSubstrateStainlessSteel1. 水镀 NormalPlating2. 真空电镀 PVD真空电镀：PVD（PhysicalVaporDeposition物理气相沉积），是指在真空条件下，采用低电压、大电流的电弧放电技术，利用气体放电使靶材蒸发并使被蒸发物质与气体都发生电离，利用电场的加速作用，使被蒸发物质及其反应产物沉积在工件上。 真空电镀分类：真空蒸镀、真空溅镀、真空离子镀。NCVM真空溅镀： Non-ConductiveVacuumMetallization真空溅镀
13、原理主要利用辉光放电(glowdischarge)将氩气(Ar)离子撞击靶材(target)表面,靶材的原子被弹出而堆积在基板表面形成薄膜。真空溅镀薄膜的性质、均匀度比蒸镀薄膜好,但是镀膜速度比蒸镀慢。涂层类型： TiN，ALTIN，TiALN，CrN，CrCN，TiCN和 ZrN,复合涂层包括 TiALYN或 H/DLC。工艺温度：PVD涂层加工温度在 250450之间，在有些情况下依据应用领域和涂层的质量，PVD涂层温度可低于 70或高于 600进行涂层。 涂层厚度一般 0.51um，有些情况下，涂层薄至 0.3um,厚至 15um。涂层种类和厚度决定工艺时间，一般工艺时间为 36小时。2
14、. 真空电镀 PVD真空蒸镀、真空溅镀、真空离子镀对比ItemComparedVacuumEvaporationCoating蒸镀VacuumSputteringCoating溅镀VacuumIonCoating(PVDCoating)离子镀Pressure(Torr)10-5-10-60.15-0.020.02-0.005EnergyofParticleNeuter0.1-1eV1-10eV0.1-1eVIonHundredstoThousandsDepositionRate(m/min)0.1-700.01-0.50.1-50Turnaroundpropertynotgoodgoodbet
15、terAdherencepowernotgoodgoodbetterCompactnessofcoatingslowdensityhighdensityhighdensityAirholeinthecoatingmorelesslessInternalStresstensilestresscompressivestresscompressivestressBesidesnormalzincalloygunmetalplating(contain:Co),thereareanothertwoPVDmethodstoavoidusingCoforgunmetalcolor.避免使用钴的真空电镀方式
16、：A.PVDmethodA:UsestainlesssteeltoreplaceZincalloy,usePVDtoreplacenormalplatingtoachievegunmetalcolor.-PVDplatingquotationisabout20%40%higherthannormalplating.Defectrateisabout2%5%(normalplatingdefectrateisabout3%8%).Priceofstainlesssteelisabout30%200%higherthanzincalloy.方式A：使用不锈钢，用真空电镀代替水镀（钴）。但费用会比锌
17、合金水镀贵。B.PVDmethodB:platingoneCrorSnlayeratbasesubstrateZinc,thenarrangethepartforPVD.-AsmethodBneednormalplating+PVD,platingquotationis80%100%higherthannormalplating.Defectratewillbeincreasedto10%20%.方式B：使用锌合金，先水镀再做真空电镀。但费用会比单独水镀贵。PVD Method AOrganicFilmPVDTiCr(Cr+3)orSnBaseSubstrateZincPVD Method B
18、OrganicFilmPVDTiBaseSubstrateStainlessSteel2. 真空电镀 PVDAdvantage:优点MorecolorcanbechosenwithPVDplatingprocess.真空电镀颜色选择多。PVDismorefriendlyforenvironment.真空电镀更环保。PVDcoatingisstronger,andthePVDcoatingismoreharder.ThePVDcoatingalsohasbetterwearresistance,bettercorrosionresistanceandbetterchemicalstability
19、.真空电镀镀层硬度及强度较水镀高，耐磨性好，具有更稳定的化学性能。Disadvantage:缺点Toachievedifferenttestingrequirement,priceofPVDplatingwillbedoubleortripleofnormalplating.为满足不同的测试要求，电镀费用是水镀的两倍以上。UsingPVDmethodAforgunmetalcolor,unitpricewillbeincreaseabout50%100%,ormore.使用真空电镀实现枪色，产品单价会增加50%100%。UsingPVDmethodBforgunmetalcolor,defec
20、tratewillbecomeabottleneck.水镀真空电镀工艺，不良率将是一个显著问题。UsingPVDmethodBforsampling,leadtimehastoextendabout23days.水镀真空电镀工艺，打样周期将会增加23天。2. 真空电镀 PVD水镀与PVD对比-Frank.Long电泳工艺：分为阳极电泳和阴极电泳。若涂料粒子带负电，工件为阳极，涂料粒子在电场力作用下在工件沉积成膜称为阳极电泳；反之，若涂料粒子带正电，工件为阴极，涂料粒子在工件上沉积成膜称为阴极电泳。阳极电泳一般工艺流程为：工件前处理（除油热水洗除锈冷水洗磷化热水洗钝化）阳极电泳工件后处理（清水洗
21、烘干）。1、除油：溶液一般为热碱性化学除油液，温度为60（蒸汽加热），时间为20min左右。2、热水洗：温度60（蒸汽加热），时间2min。3、除锈：用H2SO4或HCl，加清洗剂1.5%；室温下洗1020min。4、冷水洗：流动中冷水洗1min。5、磷化：用中温磷化（60时磷化10min）。6、钝化：用与磷化液配套的药品，室温下12min即可。7、阳极电泳：电解液成分：H08-1黑色电泳漆，固体分质量分数9%12%，蒸馏水质量分数88%91%。电压：（7010）V；时间：22.5min；漆液温度：1535。8、清水洗：流动冷水中洗。9、烘干：在烘箱中于（1655）温度下烘4060min即可。
22、Die Casting压铸Polishing抛光抛光Process:ElectropHoresis电泳泳3.电泳Electrophoresis3.电泳Electrophoresis操作条件及物理性质电泳电镀被涂物极性阴极/阳极阴极电压20-400volt2-10volt电流密度20-150A/m250-500A/m2时间0.5-3min2-60min耗电量1-10Kwh/kg3-50kwh/kg槽内浓度5-20%solid10-50%solid电导率200-2000s/cm 5000s/cm pH4.0-7.5(阳离子)6.5-9.5(阴离子)0.4-12温度15-30oC10-80oC槽液组
23、成树脂、颜料、溶剂等各种盐类及助剂补充料同上金属板及盐类助剂粒子大小10-610-4cm10-8 cm 电泳与电镀之比较表3.电泳Electrophoresis阴极电泳漆之优点原漆色浆细度5m以下、电泳槽不易产生沉淀而造成水平降、易搅拌、涂膜较平坦细致槽液性能pH值6.0-6.6槽液之稳定性较佳沉淀性24小时静置槽液不分颜料沉淀5ml/L、易搅拌、不易造成沉淀、水平而不易有水平沉淀泳透率90%、内层之防锈之增强、内外之膜厚较平均再溶性6%因种种因素停产时，再溶于电泳槽之涂膜量较小，产生颗料量较少筛余物5mg/L、水平沉淀之机会减少、增长滤袋之寿命涂膜性能膜厚20-30m厚膜型柔轫性1mm 延展
24、性及耐曲性强杯突性9.2mm延展性及耐曲性强耐盐雾性1200hr防蚀能力特强4.电铸Electroform1清洗不锈钢底板2凉干不锈钢底板3涂感光材料4曝光5清洗曝光后底板6进行电铸7清洗产品轮廓以外感光涂层8凉干电铸成品9品质全检10复膜、换离形纸11背胶1、电铸层厚度：0.030.12mm，常用厚度：0.050.08mm；2、背胶厚度：0.010.02mm；3、基层材料：镍、铜；4、表层材料：铬、金、钴、锳等；Stamping冲冲压Polishing抛光抛光Process:Plating电镀The sample is made by stainless steel, after high
25、quality polishing, then arrange vacuum plating.1/. Polish requirement: mirror polish, any scratch and dent can not be accepted, so the yield rate is low (about 80% at polish process). 需要需要镜面抛光，不良率面抛光，不良率较高。高。2/. Big and flat part is suitable for mirror polish, one small round will be made after poli
26、shed (R0.2 R0.3mm). So the edge will not be too sharp.3/. After polished, arrange PVD to make different color what we want.此此样板的材板的材质为不不锈钢，高，高质量的抛光后，再安排真空量的抛光后，再安排真空电镀以以实现不同的不同的颜色。色。5.抛光Polishing5. 抛光 PolishingDesign:Surfaceisnotflat,thereisapositivecurveatthesurfaceofcastingpart.(Figure1)此形状的部件，抛光不
27、会影响产品功能。Version:therearetwoversions-silverandgunmetalcolor.Afterpolishingandplating(Figure2):Polishing:asthecurveispositive,polishingthicknesscanbekeptconsistent,whichwillnoaffectassembly.Plating:usenormalplatingmethodcanachievesilverandgunmetalcolor.Afterstamping:aspolishingandplatinghavenotaffecte
28、dstampingprocess,surfacequalityisgood.(Figure3&4)CastingPartAfterPolishingandplatingAfterStampingPositiveCurveFigure1Figure2Figure3SurfaceEffectFigure4CastingPartAfterPolishingandplatingAfterStampingNegativeCurveFigure1Figure2Figure3SurfaceEffectFigure4Figure5Design:Surfacerequireflat,thereisanegati
29、vecurveatthesurfaceofcastingpart.(Figure1)此形状的部件，抛光后会影响产品功能。Version:therearethreeversions-silver,gunmetalcolor,topazbrown.Afterpolishingandplating(Figure2):Polishing:asthecurveisnegative,polishingthicknesscannotbekeptconsistent,middlethickness(5.45mm)isbiggerthantheend(5.35mm),whichwillaffectassembl
30、y.Plating:usenormalplatingmethodforsilverandgunmetalcolor,usenormalplating+PVDfortopazbrown.Afterstamping:Silverandgunmetalcolor:aspolishingwillaffectstampingprocess,surfacewillhaveaslightmarkingatthemiddleofpart.(Figure3&4)Topazbrown:asPVDlayerisbrittle,onesmallcrackcanbeseenafterstamping.(Figure5)
31、5.35mm5.45mmSurfaceCrack5.抛光Polishing5.抛光PolishingNOKIASonja存在问题点5.3mm5.6mm1、产品中间的位置厚度较大，压合后中间比两头要大0.20.3mm。（图1）2、由于表面不平整，压合后，正、反表面都有一道压痕（图2），影响外观。5.3mm图1图25.抛光Polishing不能抛光区域Figure2Figure1粗糙区域针对抛光不到位的区域，如果我们需要消除其粗糙的表面，需要额外增加工序，如：细抛、手工抛，增加夹制具，导致相应的费用也会增加。Stamping冲冲压Polishing抛光抛光Process:Etching蚀刻刻Pla
32、ting电镀Etching process is frequently used at stainless steel, aluminum, copper, glass material. It has been a mature process.1/. Special figure or regular pattern can be achieved at surface of part.2/. The size is not limitative.3/. The cost is base on the etching requirement, the size of etching, th
33、e difficulty of etching.蚀刻工刻工艺可以可以应用在：不用在：不锈钢、铝材、材、铜材、材、玻璃等材料上。玻璃等材料上。6.蚀刻EtchedStamping冲冲压Polishing抛光抛光Process:Plating电镀Laser雷射雷射Laser Carved process is using laser to remove surface material of part.雷射工雷射工艺是使用激光将部件表是使用激光将部件表层材料去除后，到达需要的材料去除后，到达需要的图案或案或Logo。1/. THe process can be achieve at stainle
34、ss steel, Zinc, Copper, Aluminum, etc.2/. The size is not limitative.3/. The cost is base on the logo size and depth.7.雷射LaserCarvedStamping冲冲压Polishing抛光抛光Process:Oxidation & Dyeing氧化氧化The color sample is made by aluminum, through oxidation and dyeing disposal to achieve different color.1/. The col
35、or can be adjusted, but can not achieve gradual change effect at one surface.2/. Currently, oxidation process can pass salt spray test, but no all the parts can pass wearing vibration test.3/. This process can be used for logo tage which is wanted to achieve different color.4/. Yield rate will be re
36、duced if we want to make differenct color at one part, for instance: first round oxidation yield is 95%, after second round oxidation yield rate will be reduced to 90% or below.氧化的氧化的颜色色选择性很性很强，可以在一个部件上，可以在一个部件上实现不同的不同的颜色，色，但相但相应的不良率会增加。的不良率会增加。8.氧化OxidationStamping冲冲压Sand Blasting喷沙沙Process:Oxidati
37、on & Dyeing氧化氧化Sand blast process is using one sand gun to spray small sand at part surface, to achieve smatt surface.1/. Part can not too soft.2/. There is special sand blast machine.喷沙是使用沙沙是使用沙枪在在产品表面品表面喷上一上一层细沙，从而使沙，从而使产品表面形品表面形成磨沙感。成磨沙感。9.喷砂SandblastEtched蚀刻刻Process:Oxidation & Dyeing氧化氧化Shiny L
38、ogo批花批花Shiny logo process will be arranged after plating or oxidation, use milling cutter to remove the plating or oxidation surface and show inherent metal color.1/. One fixture is required to fix the part which planed to mill.2/. Different milling directions can be achieved.3/. Use etching or stam
39、ping process to make emboss Logo. Aluminum material is easier to achieve this process than stainless steel. 批花使用批花使用铣刀切除部件表面的刀切除部件表面的电镀或氧化或氧化层，使部件局部爆裂原材料的加工工，使部件局部爆裂原材料的加工工艺。10.批花ShinyLogoLogoPolishingStamping冲冲压Process:Polishing抛光抛光Draw Bench拉拉丝Drawbench process will be arranged after polished, use
40、 sandbag or flax to polish part surface at one direction.1/. Need one simple drawbench machine.2/. Different directions can be achieved.3/. Stainless steel, Zinc, Copper, Aluminum can arrange this process after polished.拉拉丝是使用砂是使用砂轮或麻或麻轮对产品表面在固定的方向上品表面在固定的方向上进行行滚磨，使磨，使产品表面形成一定品表面形成一定纹路的加路的加工工工工艺。11.
41、拉丝DrawbenchStamping冲冲压Polishing抛光抛光Process:Cutting切割切割Oxidation氧化氧化Use cutting machine to form regular line, arc, circle on metal surface, this process is called CD line cutting.1/. The process is easier to achieve at aluminum material than stainless steel. Rigid cutter is required if we want to cut
42、ting at stainless steel.2/. This process can dispose curve surface, normally method is: cutting at flat surface, then forming the metal part to special shape, to achieve curve surface.3/. One fixture is required to fix the part which planed to cut.CD纹是使用切刀在是使用切刀在产品表面形成品表面形成规则的的线，弧，弧线，圆等的加工工等的加工工艺。12
43、.CD纹CDLine1.喷丸：消除产品塑性变形。2.达克罗：锌铬涂层，是一种高耐蚀涂层，生产过程对环境基本无污染。13.其他Other14. R&D相关产品工艺A. CWM Identifier - N seriesProcess:stampingpolishingoxidationaluminumsurfaceprintinglogoprinting.工艺：冲压抛光铝材氧化表面丝印丝印Logo。B. NOKIA Sonja Strap Metal PieceProcess:castingpolishingplatinglasercarved.工艺：压铸抛光电镀雷射Logo。C. NOKIA Light SaberProcess:Metalpiece:lathepolishingplatinglasercarved.Plasticpart:injectionpolishing.工艺:五金件：车屑抛光电镀雷射Logo。塑胶件：注塑抛光。D. Canon Ruby Finger StrapProcess:castingpolishingplatinglasercarved.工艺：压铸抛光电镀雷射Logo.
