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1、TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.认识认识Mask以及简要以及简要的制作流程的制作流程TMTMThis document is strictly confidential and proprietary of SMIC. It
2、must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.The Role of Mask in IC Industry DESIGNMASKWAFERTESTINGASSEMBLYTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anyp
3、urpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.How Does Mask Work in Wafer FAB -StepperTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not
4、be liable or responsible for any reliance.How Does Mask Work in Wafer FAB -ScannerTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Raw Material of
5、 Mask BlankBIM (binary mask)PSM (phase shift mask) A. KRF-PSM B. ARF-PSMTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Size of Blank 5inch 90mil
6、(5009) 5inch 180mil(5018)6inch 120mil(6012) 6inch 250mil(6025)7inch 250mil(7015)What kind of mask SMIC FABs use?TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible fo
7、r any reliance.Blank Component Binary BlankPSM BlankPhoto Resist(3K,4K,4650A)CrO&Chrome(1050A,700A)QuartzPhoto Resist(2K,3K,4KA)CrO&Chrome(1000,550A)QuartzMoSi FilmPhoto Resist Opaque Metal FilmSubstratePhoto ResistOpaque Metal Film Phase Shift Layer SubstrateTMThis document is strictly confidential
8、 and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Blank Qz Characteristic RigidityHeat Expansion(ppm/oC)MaterialSodaliteSilicon-BorideQuartzRigidity540657615MaterialSoda limeSilicon-Borid
9、eQuartzCoefficient9.43.70.5TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Blank Qz Characteristic Optics CharacterTransmission ( % ) 20030040002
10、0406080100QuartzSilicon-BorideSoda LimeWave Length(nm)Thats why we choose Quartz as the substrate of blankTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any
11、reliance.How to Transfer Design to Mask? WriterProcessMetrologyVis-InspectClean/MountAIMSRepair1st InspectThr-InspectSTARlightShippingDevelopStripEtchTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC
12、 shall not be liable or responsible for any reliance.Front-end Process Blank configurationPhoto-resistCr filmQuartzExposurePhoto-resist developWet etchPhoto-resist stripAEIASIRe-Etch ?AEI: After Etch CD measureASI: After Strip CD measureStep1Step2Step3Step4Step6Step5Step7TMThis document is strictly
13、confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Front-end Process Dry process ResistCrQzH+H+H+H+H+H+H+EBEBEBH+H+H+H+H+H+H+Exposure(EB1,EB2,EB3DUV,LB5,LB6)PEB(Post Exposure B
14、ake)SFB2500,APB5500PAGAcid generationAcid diffusionDeprotection reactionDevelopment(SFD2500,ASP5500)H+Dry Etch(Gen3,Gen4)AEI, Re-etchStrip, ASITMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall
15、not be liable or responsible for any reliance.Pellicle Component Pellicle MembraneMaterialWave LengthN.C.365nm (I-line)C.E.365, 248nm (I-line, DUV)F.C.193nm (ArF)Frame(Aluminum Alloy)Adhesive TapePellicle Membrane (25 um)Pellicle FrameDouble SideAdhesive TapeCrGlassTMThis document is strictly confid
16、ential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.What Pellicle Do? Top ContaminantObject PlanePellicle FilmBottom ContaminantContaminant on Pattern PlaneLen SystemUnfocused Top Con
17、taminant ImageUnfocused Bottom Contaminant ImageImage PlaneFocused Contaminant Image on WaferMask PatternWafer SurfaceLightTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or res
18、ponsible for any reliance.Particle Immunity Control Particle size (D) V.S. Minimum Stand-off (T)T = (4M/N.A.)DT = (4M/N.A.)DM - MagnificationN.A.- Numerical Aperture of the LensFor glass side particle, T = 2.3mmD1T1T2D2TMThis document is strictly confidential and proprietary of SMIC. It must not be
19、copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Mask Quality Control C.D.DefectRegistrationTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference
20、 only, and SMIC shall not be liable or responsible for any reliance.CD (critical dimension) measurementTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any rel
21、iance.Defect TypeOpaque spotParticleProtrusionIntrusionContaminationPinholeMissing ARGlass fractureBreakGlass seedBridgeSolvent spotHard DefectSoft DefectMiss SizeTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference o
22、nly, and SMIC shall not be liable or responsible for any reliance.How to Do Mask Defect Inspect TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.M
23、ask Layout Exemplification Normal S S +FiducialTest KeyTest LineMain PatternScribe LineGlobal MarkQA CellBarcodeMulti-Chip +FiducialTest KeyTest LineScribe LineGlobal MarkQA Cell+A ChipB ChipC ChipD Chip+TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used
24、for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.The Principle of STARlight InspectThe Model in SMIC Mask Shop(SL3UV) can only detect pattern sideSTAR: Synchronous Trans. And ReflectedTMThis document is strictly confidential and proprietary o
25、f SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.What is Registration TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for referenc
26、e only, and SMIC shall not be liable or responsible for any reliance.Registration Result Exemplification Mask:6”, t=0.25”QuartzMeasurement Area:67.2*92.2mmArray:8*10Variation Quantity: nmMaxminX7.20.0Y22.00.2TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or u
27、sed for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.How Does OPC Work? comparisondesign/maskWith OPCwaferTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference
28、only, and SMIC shall not be liable or responsible for any reliance.OPC Pattern on Mask 0.64 um Line Pattern0.25 um Serif for 0.6 um Contact0.57 Line Pattern0.27 um assistant bar for 0.72 um LineTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Over-all flowCustomerFTPNote: Yellow box is activities customer involvedTape outMask Shop data CEJob ViewCEMask Shop data Mfg(next page)ShippingTooling informationCustomer approves JDVPIE approves JDV
