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1、CELLCELL设计设计 APR plate design Robbing design Seal and Ag-point design LTPS scribe design Panel size design FPC design(1)Substrate: (12 panel 8 panel) O(0 ,0 )(2)APR size: 525000m 400000m Fig 2Fig 1HIJKH=K= 16400m I =J = 12200m 1212O283456789101134567APR Plate Design(I)A=24800 B=6500 C=5128 (Pitch=31
2、300)D=32640 E=3260 F=G (Pitch=35900)Unit : m GFABCEDFig 2 APR Plate Design(II)APR Plate Design(II)COGFPC Six oclock directionPanel Viewing angle Direction Robbing Design(I)Sub Rubbing Direction 45 degreeArray CFRed line : array glass side downBlue line : CF glass side down Robbing Design(II)AU_LTPS_
3、1.5” seal position (array glass side down)P1(16700,30900) P2(16228,30428)P3(2031,30428) P4(1130,29527)P5(1130,5554) P6(2056,4628)P7(33844,4628) P8(34770,5554)P9(34770,29527) P10(33869,30428)P11(19672,30428) P12(19200,30900)O(0,0).substrate centerE(26910,990) seal markAU_LTPS_1.5” Ag positionA(800,30
4、500)B(35100,30500)C(35100,4600)D(800,4600)12A2345678910111BCDEOSeal and Ag-point DesignScribe Mark for TFT substrateOTFT Scribe markABCO(0,0) : glass centerA(35900,0)B(35900,31300)C(0,31300)OTFT glass side down400mm320 mmLTPS Scribe Design(I)Scribe Mark for CF substrateCF Scribe markABCDEOO(0,0) : g
5、lass centerA(35900,0)B(35900,3800)C(35900,31300)D(0,31300)E(0,3800)OCF glass side up320 mm400mmLTPS Scribe Design(II)31.3 mm0.3mmBM(Panel-BM=500um)COGFPCACFActive area22.8mm30.622mm 35.9 mm2.372 mm2.328 mm3.028 mm2.639 mm2.639 mm3.8 mm9.99mm9.99mm15.92mmFPC Mark0.99 mm1mm0.3mm10mm2mm2mm10.95mm10.95mm0.3mm0.6 +/- 0.3mm12mm17. 95mmPanel Size design .22011701247100320330(10480,1500)(9990,990)(25910,990)(25420,1500)Unit :mFPC Design谢谢 谢！谢！
