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1、金相样品制备与组织显示中术语的对应翻译-基于BUEHLER SUM-MET - The Science Behind Materials Preparation一书上传试验序号1.2.Polishing抛光3.Mechanical Polishing4.disturbed metal干扰金属5.pitting坑洞6.dragging out of inclusions, “comet tailing”夹杂脱出，彗星拖尾7.staining着色8.or relief (heightdifferences between different constituents, or betweenhole
2、s and constituents或浮雕(不同相的高度不同或孔和组织高度不同，9.Edge Retention10.Sampling . 7Goals of Specimen Preparation . 9Method Development . 9Sectioning . 10Abrasive Wheel Cutting . 10Precision Saws . 12Mounting of Specimens . 14Clamp Mounting . 14Compression Mounting . 14Castable Resins for Mounting . 15Edge Prese
3、rvation . 17Grinding . 20Grinding Media . 20Grinding Equipment . 22Polishing . 23Mechanical Polishing . 24Electrolytic Polishing . 24Manual “Hand” Polishing . 24Automatic Polishing . 25Polishing Clothes . 25Polishing Abrasives . 27Examples of Preparation Procedure . 29The Traditional Method . 29Cont
4、emporary Methods . 29Procedures for Specific Materials . 32Periodic Table of Elements . 33Light Metals: Al, Mg and Be . 34Aluminum . 34Magnesium . 36Beryllium . 37Low Melting Point Metals:Sb, Bi, Cd, Pb, Sn and Zn . 38Refractory Metals: Ti, Zr, Hf, Cr, Mo,Nb, Re, Ta, V and W . 40Titanium . 40Zirconi
5、um and Hafnium . 41Other Refractory Metals: Cr, Mo, Nb,Re, Ta, V and W . 43Ferrous Metals . 45Copper, Nickel & Cobalt . 48Copper . 45Nickel . 49Cobalt . 50Precious Metals . 51Thermally-Spray Coated Specimens . 53Sintered Carbides . 55Ceramics. 57Composites . 59Printed Circuit Boards . 61Eletronic Ma
6、terials . 62Polymers . 65Etching . 67Etching Procedures . 67Selective Etching . 68Electrolytic Etching and Anodizing . 71Heat Tinting . 71Interference Layer Method . 72Commonly Used Etchants forMetals and Alloys . 73Light Optical Microscopy . 78The Light Microscope . 79Microscope Components . 79Reso
7、lution . 82Depth of Field . 83Imaging Modes . 83Microindentation Hardness Testing . 87The Vickers Test . 87The Knoop Test . 88Factors Affecting Accuracy, Precisionand Bias . 89Automation . 91Image Capture & Analysis . 93Acquisition . 93Clarification . 96Operator Interactive Measurements . 96Automated Measurements . 96Thresholding . 96Binary Operations . 98Common Applications . 99Laboratory Safety . 101
