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1、索卡科技电子有限公司PROCESS WORK INSTRUCTIONS程序工作指导书DOCUMENT NO.：文 件 编 号SKL-SOP-100EFFECTIVE DATE：生 效 日 期2006/3/10VERSION：版 次A0PAGE：页 次1 OF 8SUBJECT：主 题敏感组件之温湿度控制Moisture Sensitive Device ControlORIGINATOR：起 草 人 APPROVED BY：核 准 人 DCN版次新版生效日期内容(变更叙述)A0 2006/3/10初版PAGE NO.1234567891011121314151617181920VERSIONA
2、1A1A1A1A1A1A1A1DATE01/0501/0501/0501/0501/0501/0501/0501/05 金舜数码科技有限公司SUBJECT：主题DOC. NO.SKL-SOP-100敏感组件之温湿度控制Moisture Sensitive Device ControlPAGE NO.2 OF 8VERSIONA0DATE2006/3/101.0 目的 Purpose : 为避免敏感组件受潮,影响焊锡品质,而作此规范储存之环境温度,湿度控制. To prevent and reduce the negative impact of moisture related failure
3、s in the manufacturing process.2.0 适用范围 Scope : 适用于公司所有温湿度敏感的电子组件. Apply to all Moisture Sensitive Devices used in Liteon.3.0 定义 Definition :IQC,电子仓库,生产线必须依规定储存于适当容器及环境内.All MSD components in IQC, Warehouse, and production lines must be stored in the appropriate storage environment.4.0 设备 Equipment
4、: 4.1 大型防潮箱(20%RH) Large size Dry Storage Cabinet. (=60%RH or Components floor life has expired, and the baking will complied follow form. 注意：Package Body Thickness:指组件封装厚度 Level：即MSL(湿度敏感等级 一般组件标签上有注明) RH:指相对湿度，例如30摄氏度/85%RH表示在30摄氏度时所含的水分为饱和时所含水分的85% 温湿度敏感组件：指的是组件在规定的温湿度范围之外存储将会其功能曲线和焊接的正常，甚至会损坏组件。
5、6.1 烘烤事件必需记录于烘烤记录表中,如项目10.0 Baking event should be record in “Baking Oven Record” as item 10.0 7.0 烘烤后必须依5.0之储存条件,否则必须依6.0作烘烤作业. After baking, the materials must be stored according to condition 5.0, or else should follow the baking condition stated in 6.0. 8.0 敏感组件之使用管制 MSD Usage Control : 8.1 未开封之
6、材料储存必须填写“组件储存卡(bin card)”如12.0 进行管制. Sealed materials storage must be controlled by Material Storage Control Card金舜数码科技有限公司SUBJECT：主题DOC. NO.SKL-SOP-100敏感组件之温湿度控制Moisture Sensitive Device ControlPAGE NO.4 OF 8VERSIONA0DATE2006/3/10. 8.2 有开封之材料储存必须填写“组件储存使用记录标签”进行管制. Unsealed materials must be contro
7、lled by Material Usage Control Record. 8.3 材料拆封后,应立即在“组件储存使用记录标签”上填写“拆封日期”, “拆封时间”及 签名等并将标签贴于敏感组件之外包装上. After the package is unsealed, operator must record the seal-off date, time, quantity, etc on the Material Usage Control Record, and paste it on the package. 8.4 拆封后未上线使用之组件必须入库保存,并在“组件储存使用记录标签”上填
8、写“入库日期”,“入库时间”, “累计暴露时间”及“入库数量”等相关项目. Unsealed materials that have not been used, must be resealed for storage, and record the storage date, time, cumulative exposure time, and quantity etc, on the Material Usage Control Record. 8.5 拆封后上线使用之组件需填写“组件使用暴露时间记录标贴”(9.2),且记录使用 暴露时间并签名, 直至组件使用完,累计暴露时间超过72小时未使用完之组件 依6.0烘烤作业. “组件使用暴露时间记录标贴”贴于IC TRAY盘侧面. Unsealed materials for manufacturing process should fill in the Material Baking & Exposure Control Record (9.2), and record the seal-off time and floor life of the materials until the production completes. If the cumulative exposure t
