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1、学习资料收集于网络，仅供参考PCBX程部专业英文词汇词汇1 .板料:material2 .最低限度：minimum或者min.3 .最大限度：maximum或者max.4 .基准点（零点）datumpoint5 .周期Datecode6 .V-cut余厚V-cutremainthickness7 .抢电铜皮（假铜）dummycopper8 .实物板actualboard9 .外形及尺寸错误dimensionerror10 .异常情形errordatafile11 .焊锡面与零件面对位偏差misregistration12 .孔塞plughole13 .要求requirement14 .缺少mi
2、ss15 .偏公差uneventolerance16 .补偿compensation17 .表面处理surfacetreatment18 .无铅喷锡LeadfreeHAL19 .金手指斜边bevelofG/F20 .制程能力processcapability21 .建议，暗示suggest22 .确保ensure23 .满足，达到meet24 .为了inorderto25 .交货期deliverydate26 .绿油桥soldermaskbridge或者soldermaskdam27 .根据accordingto28 .单边3milperside3mil29 .直径diameter30 .半径
3、radius31 .小于3millessthan3mil32 .高于3milmorethan3mil33 .压合结构stackingstructure或者stack_up34 .附件：attachedfile35 .样品：sample36 .文档：Document37 .答复：answer;reply38 .规格：spec39 .与.同样的：thesameas40 .前版本：previousversion(oldversion)41 .生产：production42 .确认：confirm43 .再次确认：confirmagain44 .工程问题：engineeringquery(EQ)45
4、.尽快：assoonaspossible46 .生产文件：productionGerber47 .联系某人：contactsomebody48 .提交样板：submitsample49 .交货期:deliverydate50 .电测成本：ET(electricaltest)cost51 .通断测试：Openandshorttesting52 .参考：referto53 .IPC标准：IPCstandard54 IPC二级：IPCclass255 .可接受的：acceptable56 .允许：permit学习资料收集于网络，仅供参考57 .制造：manufacture或者fabricate58
5、.修改：revision59 .公差：tolerance60 .忽略：ignore61 .工具孔：toolinghole62 .安装孔：mountinghole63 .元件孔：componenthole64 .槽孔：slothole65 .由B票孑L：snapoffhole或者stamphole66 .导通孔：viahole67 .盲孑L：blindviahole68 .埋孔：buriedviahole69 .金属化孔：PTH(platedthroughhole)70 .非金属化孔：NPTH(noplatedthroughhole)71 .孔位：holelocation72 .避免：avoid
6、73 .原设计：originaldesign74 .修改：modify75 .按原设计：followuporiginaldesign76 .附边：wastetab,wastearea或者breakawaytab77 .铜条：copperstrip78 .拼板：paneldrawing79 .板厚：boardthickness80 .删除：remove(delete)81 .肖U铜：shavethecopper82 .露铜：copperexposure或者exposedcopper83 .光标点：fiducialmark84 .不同：bedifferentfrom(differfrom)85 .
7、内弧：insideradius86 .焊环：annularring87 .单板尺寸：singlesize88 .拼板尺寸：panelsize89 .铳，锣：routing90 .铳刀：router或者Routingbit91 .楔形掏槽V-cut或者Vscoring92 .哑光：matt93 .光亮的：glossy94 .锡珠：solderball(solderplugs)95 .阻焊：soldermask(solderresist)96 .阻焊开窗：soldermaskopening97 .单面开窗：singlesidemaskopening98 .补油：touchupsoldermask9
8、9 .补线：trackwelds100 .毛刺：burrs101 .去毛刺：deburr102 .镀层厚度：platingthickness103 .清洁度：cleanliness104 .离子污染：ioniccontamination105 .阻燃性等级：flammabilityretardantrating106 .黑化：blackoxidation107 .棕化：brownoxidation108 .红化：redoxidation109 .可焊性不良：poorsolderability110 .焊料：solder111 .包装：packaging112 .角标：cornermark113
9、 .特性阻抗：characteristicimpedance114 .正像：positive115 .负片：negative116 .镜像：mirror学习资料收集于网络，仅供参考117 .线宽：linewidth或者tracewidth118 .线距：linespacing或者tracespacing119 .做样：buildsample120 .按照：accordingto121 .成品：finished122 .做变更：makethechange123 .相类似：similarto124 .规格：specification125 .下移：shiftdown126 .垂直地：vertica
10、lly127 .水平的：horizontally128 .增大：increase129 .缩小：decrease130 .表面处理：SurfaceFinishing131 .波峰焊：wavesolder132 .钻孔数据：drillingdata133 .标记：Logo134 .UI标t己：ULlogo,或者UIMarking135 .蚀刻标记：etchedmarking136 .周期：datecode137 .翘曲：bowandtwist138 .外层：outerlayer或者externallayer139 .内层：innerlayer或者internallayer140 .顶层：topl
11、ayer141 .底层：bottomlayer142 .元件面：componentside143 .焊接面：solderside144 .阻焊层：soldermasklayer145 .字符层：legendlayer(silkscreenlayeroroverlayer)146 .兰胶层：peelableSMlayer147 .贴片层：pastemasklayer148 .碳油层：carbonlayer149 .外形层：outlinelayer(profilelayer)150 .白油：whiteink151 .绿油：greenink152 .喷锡:hotairleveling(HAL)153
12、 .电金,水金：flashgold154 .插头镀金：platedgoldedge-boardcontacts155 .金手指：Gold-finger156,防氧化：Entek(OSP)157 .沉金：Immersiongold(chem.Gold)158 .沉锡：ImmersionTin(chem.Tin)159 .沉银：ImmersionSilver(chem.silver)160 .单面板：singlesidedboard161 .双面板：doublesidedboard162 .多层板：multilayerboard163 .刚性板：rigidboard164 .挠性板：flexibl
13、eboard165,刚挠板：flex-rigidboard166 .铳：CNC(m川，routing)167 .冲：punching168 .倒角：beveling169 .斜面：chamfer170 .倒圆角：fillet171 .尺寸：dimension172 .材料：material173 .介电常数：Dielectricconstant174 .菲林：film175 .成像：Imaging176 .板镀：PanelPlating学习资料收集于网络，仅供参考177 .图镀：PatternPlating178 .后清洗：FinalCleaning179 .叠层：stackingstruct
14、ure(stack-up)180 .污染焊盘：contaminatepad181 .分孔图：drillchart或者drillmap182 .度数：degree183 .被覆盖：becoveredwith184 .负公差：minustolerance185 .标靶盘：targetpad186 .外形公差：routingtolerance187 .芯板：core188 .半固化片Prepreg189 .阻抗线：impedancetrace190 .评估estimate191 .玻纤显露FiberExposure192 .底铜basecopper193 .工作搞workingGerber194 .
15、原稿originalartwork195 .放宽relax196 .挖空blanking或者cut-out197 .一般性阻焊油墨generalresistink198 .孑L位错误misholelocation199 .压合周期presscycle200 .毛边serratededges201 .跳印skipprinting202 .气泡blistering203 .隔离焊盘isolatedpad204 .泪滴teardrops205 .箭头arrows206 .力口大Enlarge207 .压合周期presscycle208 .毛边serratededges209 .跳印，漏印skipprinting210 .宽度与厚度的比值width-to-thicknessratio211 .调整adjust212 .铜箔
