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1、精品Siliconingot硅锭Wafer晶片Mirrorwafer镜面晶圆Patter晶圆片FAB：fabrication制造FabricationFacility制造wafer生产工厂Probetest探针测试Probecard探针板Contact连接ProbeTip探头端部ChipFunction功能EPM：ElectricalParameterMonitoringSummary总结R&D：ResearchandDevelopment研究和开发MCP：MultiChipPackage多芯片封装POP：PackageonPackagee-MMC：embeddedMultiMediacard
2、嵌入式多媒体卡WLP：WaferLevelPackage晶圆级封装SDP一层DDP两层QDP四层感谢下载载ODP八层PadoutBackGrind背研磨WaferGrindBackGrind磨片Overview概述TPM：TotalProfitManagementSKTPMOperation操作Erase消除KeyPara.：Keyparameter关键参数Cycling写入次数、循环次数Retention保留时间Non-VolatilememoryVolatilememoryRead读Write写Refresh更新Speed速度、速率、转速Restore修复、恢复ElectricalSign
3、al电信号WFBI：WaferBurn-InPT1H：ProbeTest1HotTestPT1C：ProbeTest1ColdTestL/Rep：LaserRepairPurpose目的Substrate基片Trend趋势SmallSize小体积HighDensity高集成HighSpeed高速度Roadmap路标TSOP：Thinsmalloutlinepackage薄型小尺寸封装FBGA：(FineBallGridArray)package细间距球栅阵列(一种封装模式)FlipChipPackage：在wafer的chip上形成bump直接在substrate或PCB基板上填充形态，使I/
4、O最高密度化的填充方式。Stack堆叠stackpackageB/G：BackGrind背研磨W/S：WaferSawD/A：DieAttachW/B：WireBondM/D：MoldM/K：MarkingSBM：SolderBallMountS/G：SingulationEMS：EpoxyMoldingCompound环氧树脂Assembly装配、集会、集合PreLoardTDBI：TestDuringBurnInEarlyfailure初期不良率Constantfail-rate稳定的fail分布Wear-out磨损PDA：PercentageDefectAllowanceBurn-In后
5、Device的可靠性check的基准Burn-In高温加速老化试验MVP：MarkingVisualPackingM/S:Markingstore按speed分类Laser激光Server服务器FB-DIMM：FullyBufferedDualIn-lineMemoryModule全缓存双线内存模组So-DIMM：SmalloutlineDIMM笔记本内存Application应用程序Shipping产品出口PCB：PrintCircuitBoard印刷电路板MLCC：MultiLayerCeramicCapacitor多层陶瓷电容器A/R：ArrayResister数组电阻器ChipResi
6、ster片状电阻器EEPROM：ElectricallyErasableProgrammableReadOnlyMemory电可擦只读储存器PrintPCBPad上涂抹SolderPasteSolder焊接ChipMount往PCB上Mount附件Reflow用Reflow用产生的热来使附件和PCB进行连接AutoOpticalInspection通过光学检查附件的Joint状态LabelAttach用Auto在Module上贴LabelRouter分割连在一起的PCBAOQ：AverageOutgoingQuality平均出货品质T/B：TestBankLOAD：LoadingU/L：Unl
7、oadingLIS：LeadInspectionSystemFVI：FinalVisualInspection最后外观检查EFR：EarlyFailureRateQPE：QAPackageElectricalQPV：QAPackageVisualIPK：InnerBoxPackingQPP：QAPackagePackingQFS：QAFinishedGoodsStoreFGS：FinishedGoodsStoreTAT：TurnAroundTimeLithography光刻Microlithography显微光刻Expose曝光Coat涂层Bake烘烤Develop显影Thickness层、浓
8、度Temp临时雇员、做临时工作Energy精神、能量、活力focus焦距、清晰illumination景深overlay覆盖物、镀lens透镜、镜头、给摄影alignment队列、校准、结盟oxide绝缘体、氧化物polymer聚合物WetEtching湿法刻蚀DryEtching干法刻蚀chamber房间、室、腔pump用抽水机抽、泵、打气筒plasma等离子体effect产生、作用、效果inhibitor抗化剂pattern模仿、样品hole穴、洞、孔content内容、目录化学气相沉积物理气相沉积等离子增强化学气象沉积高密度等离子化学气相沉积Deposit存款、使沉积、沉淀物CVD：Ch
9、emicalVaporDepositionPVD：PhysicalVaporDepositionPECVD：PlasmaEnhancedCVDHDPCVD：HighDensityPlasmarare速度、责骂temperature温度Range偏差、排、山脉Uniformity均匀度Sigma标准差DriverTorqueWrenchWrenchLongNoseplierNipperSolderingFileWireStripperMonkeySpannerOpenspannerLevelMeterPipeWrenchSnapRingPlireMircoMeterStepCoverage台阶覆
10、盖率AspectRatio深宽比Metal金属Particle颗粒杂质Stress应力Reflectance反射系数Dielectric介电质RefractiveIndex折射系数Dopant参杂浓度Tensile拉应力Compressive压应力Incidentlight入射光Application应用Conformity共形性Overhang悬突LPCVD：LowPressureChemicalVaporDeposition低压化学气相沉积CMP：ChemicalMechanicalPlanarization化学机械平坦化Analysis分析Synthesis综合Convergent集中性
11、Divergent发散性Vertical垂直性Latercal水平性Skills技术Techniques方法、技巧、技术LogicTree逻辑树Brainstorming头脑风暴Visualization形象化Solution解决方案Thinking思考SPC：StatisticalProcessControlCPK：CapabilityIndexIQC：IncomingQualityControlCAR：correctiveActionRequestCleanRoomPurging去除产生的微粒子Prohibiting防止微粒子的产生Preventing防止微粒子的侵入Providing维持
12、必要的温度、湿度SupplyunitReturnunitAirshowerBondheadBondingtimeCodingtimeMCP：MultiChipPackageVacuum真空吸尘器Ventury喷嘴Cassette片匣TDBI：TestDuringBurnIn进行rest中，进行BurnIn的工程B/I：BurnInSORTER:向bib进行Load/Unload作业的device设备SYSTEM:进行B/I&test装载Device的BIB设备BIB：BurnInBoardSYSREM设备中为了DeviceTest按Socket个别装载Device的BoardBIN：按照Dev
13、iceTest结果值以Category来区分BS：Burn-infailsplit在SYSTEM设备DeviceTest结果中发生Fail的BIN用语O/S：Open/ShortDeviceTest结果中发生Fail的BIN用语BC：B/Ifailcombine1次BIfailcombineBCC：B/Ifailcombine2次BIfailcombineINS/REM：Insent/Remove进行load/Unload作业Device向BIBSocketCapa-UpAlign排列Renaissance复活、复兴、新生Wearasmock穿防尘服Wearamask戴口罩Wearasmock
14、cap带防尘帽Putyourshoeson/Finish穿防尘鞋/完毕Cleanmat去出异物用垫ESD：ElectroStaticDischarge静电Conductive导电性StaticDissipative消散性Insulator绝缘体Antistatic带电防止性EOS电过载ElectrostaticShield屏蔽静电Ground接地Ionizer防静电装置Neutralization中和TriboelectricCharging摩擦带电InductionCharging引导带电SprayCharging喷出带电4M：Man、Machine、Material、MethodEPA：ESDProtectAreaESD保护区域PCN：ProcessChangeNotificationProcess装置标RAM：ReturnedMaterialAnalysis/AuthorizationEOP：EquipmentEngineer设备、Operator工作者、Engineer工程EPSC：EquipmentProcessStandardizationCommittee准化横展开Frontline一般用纸Whiteboard粉板Filler填充剂MSDS：MaterialSafetyDataSheet物质安全保健资
