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1、Q/S天马微电子企业标准 Q/S0001-2007TFT工艺流程、材料、设备、生产常用中英文标准名称 版 号：1.0 总 页 数：23制定部门：制造部 生效日期：2007年4月28日 拟 制： 方永学 2007-4-3 审 核： 向传义 2007-4-3 标 准 化： 吴乃亮 2007-4-25 会 签： 颜建军 朱希玲 2007-4-20 蔡明宏 2007-4-24 凌志华 2007-4-3 批 准： 安德浩 2007-4-242007-04发布 2007-04实施 天马微电子发布更改状态更改容更改人更改日期一TFT工艺流程中英文标准名称Array Process Flow阵列段工艺流程In
2、put投料Unpacking拆包装Initial clean预备清洗Particle count尘埃粒子测试Gate栅电极层Clean before depo成膜前清洗Gate Mo/Al alloy ) Film depo栅电极成膜RS meter电阻测量Macro Inspection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry(VCD)光刻胶低压枯燥PR soft bake前烘E*pose曝光Titler E*pose/Edge E*pose打标/边缘曝光Develop显影PR hard bake坚膜ADI
3、显影后自动光学检查Mic/Mac Inspection宏微观检查CD after develop显影后关键尺寸检查Total pitch长寸测量Gate Wet etch栅电极湿刻Contact angle接触角测量PR strip光刻胶剥离CD after etch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Laser Repair激光修补Active层Clean before depo成膜前清洗Active film depoActive成膜AOI自动光学检查Macro Inspection宏观检查Thickness Measuremen
4、t厚度测量Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压枯燥PR soft bake前烘E*pose曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Mic/Mac Inspection宏微观检查Active film Dry etch & AshingActive膜干刻与灰化Thickness Measurement厚度测量PR strip光刻胶剥离AEI刻蚀后自动光学检查Mic/Macro Inspection宏微观检查S/D源/漏电极层Clean before depo成膜前清洗S/D
5、 Mo film depo源/漏电极成膜RS meter电阻测量MACRO Inspection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压枯燥PR soft bake前烘E*pose曝光Edge e*pose边缘曝光Develop显影PR hard bake坚膜ADI 显影后自动光学检查MIC/MAC Inspection宏微观检查CD after develop显影后关键尺寸检查Hard bake by oven烘炉坚膜S/D Mo Wet etch源电极/漏电极湿刻n+ a-Si Dry etchn
6、+高掺杂膜干刻PR strip光刻胶剥离Thickness Measurement厚度测量CD after etch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Clean before O/S test短路/开路测试前清洗Open/Short Test短路/开路测试Passivation保护层Clean before depo成膜前清洗Passn film depo保护膜成膜AOI自动光学检查MACRO Inspection宏观检查Thickness Measurement厚度测量Clean before PR涂胶前清洗Pre bake预烘P
7、R Coating光刻胶涂布PR vacuum dry光刻胶低压枯燥PR soft bake前烘E*pose曝光Edge e*pose边缘曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Micro/Macro Inspection宏微观检查Sin* Dry etch & ASHING氮化硅干刻与灰化PR strip光刻胶剥离AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查ITOITO层Clean before PR成膜前清洗a-ITO film depoITO成膜RS meter电阻测试Anneal煺火Macro Inspection宏观
8、检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压枯燥PR soft bake前烘E*pose曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Micro/Macro Inspection宏微观检查ITO film etchITO膜湿刻PR strip光刻胶剥离AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Final E/T最终电测Anneal煺火Array test阵列测试Array repair阵列修补TEG testTEG测试Sort分级Cell Pro
9、cess flow制盒段工艺流程CF Input彩膜投料CF Initial Clean彩膜预备清洗CF AOI彩膜自动光学检查CF Sort彩膜分级PI配向膜Clean before PI 配向膜涂布前清洗PI Print配向膜涂布Pre-cure预固化PI Inspection配向膜检查PI Thickness Measurement配向膜厚度测量Main-cure固化PI rework配向膜返工ODFCF&TFT MatchingCF&TFT匹配Rubbing配向摩擦Rubbing Inspection摩擦检查Loader & Un loader上料机/下料机Buffer缓冲器CST B
10、uffer工装栏缓冲器Rotation/Cooling Unit旋转/冷却单元Turn Align Unit旋转/对位单元Turn Over Unit翻转单元After Rubbing Cleaner摩擦后清洗Spacer Spray衬垫球散布Spacer Counter衬垫球计数Spacer rework衬垫球返工Spacer Cure衬垫球附着固化Short Dispense导电胶涂布Sealant Dispense边框胶涂布Seal Inspection边框胶检查LC Dispense液晶滴下Vacuum Assembly真空贴合UV Cure紫外线固化Mis-alignment che
11、ck错位检查Seal Oven边框胶热固化Eye Inspection目视检查Cell gap Measurement盒厚测试Cutting切割1/4(1/6)Sheet Cutting,1/4(1/6)切割Stick Cutting,切条Cell Cutting切粒Visual TestVisual 测试ECPEdge Grind磨边Dipping clean浸泡式清洗Clean before Pol 贴片前清洗Pol Attach贴片Pol Inspection贴片检查Pol rework贴片返工Auto ClaveAuto Clave消泡Laser TrimmerLaser Trimme
12、r激光切线Test测试Gross Test终检Repair修补Bin sorter分级OQC Test出货检查Store货栈Module Process Flow模块段工艺流程COGPad cleaning端子清洗IC BondingIC 邦定Microscope InspectionAOI 镜检自动光学检查Adhesive test粘接力测试FOGACF AttachingACF 粘贴FOG BondingFOG 邦定Microscope Inspection镜检Peeling strength test拉力测试ET test1电测1IC or FPC Repair修补UV glue sealing 封胶FPC reinforcement补强UV glue curingUV胶固化Assembly组装ET test2电测2anti-ultraviolet tape attaching遮光胶带粘贴protected tape attaching保护胶带粘贴Backlight assembly背光源组装Backlight soldering背光源焊接Touch panel assembly触摸屏组装Final ET test最终电测Rework返工Aging老化QC testQC检验Code printing喷码Packing
