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1、word工艺流程、材料、设备、生产常用中英文标准名称 版 号： 1.0 总 页 数：23 制定部门： 生效日期： 年 月 日 拟 制： 审 核： 标 准 化： 会 签： 批 准：发布 实施 更改状态更改容更改人更改日期一TFT工艺流程中英文标准名称Array Process Flow阵列段工艺流程Input投料Unpacking拆包装Initial clean预备清洗Particle count尘埃粒子测试Gate栅电极层Clean before depo成膜前清洗Gate （Mo/Al alloy ) Film depo栅电极成膜RS meter电阻测量Macro Inspection宏观检
2、查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry(VCD)光刻胶低压干燥PR soft bake前烘Expose曝光Titler Expose/Edge Expose打标/边缘曝光Develop显影PR hard bake坚膜ADI 显影后自动光学检查Mic/Mac Inspection宏微观检查CD after develop显影后关键尺寸检查Total pitch长寸测量Gate Wet etch栅电极湿刻Contact angle接触角测量PR strip光刻胶剥离CD after etch刻蚀后关键尺寸测量AEI刻蚀
3、后自动光学检查Micro/Macro Inspection宏微观检查Laser Repair激光修补Active层Clean before depo成膜前清洗Active film depoActive成膜AOI自动光学检查Macro Inspection宏观检查Thickness Measurement厚度测量Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Mic/Mac Inspection宏微观
4、检查Active film Dry etch & AshingActive膜干刻与灰化Thickness Measurement厚度测量PR strip光刻胶剥离AEI刻蚀后自动光学检查Mic/Macro Inspection宏微观检查S/D源/漏电极层Clean before depo成膜前清洗S/D Mo film depo源/漏电极成膜RS meter电阻测量MACRO Inspection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Edge expo
5、se边缘曝光Develop显影PR hard bake坚膜ADI 显影后自动光学检查MIC/MAC Inspection宏微观检查CD after develop显影后关键尺寸检查Hard bake by oven烘炉坚膜S/D Mo Wet etch源电极/漏电极湿刻n+ a-Si Dry etchn+高掺杂膜干刻PR strip光刻胶剥离Thickness Measurement厚度测量CD after etch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Clean before O/S test短路/开路测试前清洗Open/Short
6、Test短路/开路测试Passivation保护层Clean before depo成膜前清洗Passn film depo保护膜成膜AOI自动光学检查MACRO Inspection宏观检查Thickness Measurement厚度测量Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Edge expose边缘曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Micro/Macro Inspection宏微观检查SinX Dry etch &
7、 ASHING氮化硅干刻与灰化PR strip光刻胶剥离AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查ITOITO层Clean before PR成膜前清洗a-ITO film depoITO成膜RS meter电阻测试Anneal煺火Macro Inspection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Micro/Macro Inspection宏微
8、观检查ITO film etchITO膜湿刻PR strip光刻胶剥离AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Final E/T最终电测Anneal煺火Array test阵列测试Array repair阵列修补TEG testTEG测试Sort分级Cell Process flow制盒段工艺流程CF Input彩膜投料CF Initial Clean彩膜预备清洗CF AOI彩膜自动光学检查CF Sort彩膜分级PI配向膜Clean before PI 配向膜涂布前清洗PI Print配向膜涂布Pre-cure预固化PI Inspection配向膜检查PI
9、 Thickness Measurement配向膜厚度测量Main-cure固化PI rework配向膜返工ODFCF&TFT MatchingCF&TFT匹配Rubbing配向摩擦Rubbing Inspection摩擦检查Loader & Un loader上料机/下料机Buffer缓冲器CST Buffer工装栏缓冲器Rotation/Cooling Unit旋转/冷却单元Turn Align Unit旋转/对位单元Turn Over Unit翻转单元After Rubbing Cleaner摩擦后清洗Spacer Spray衬垫球散布Spacer Counter衬垫球计数Spacer
10、rework衬垫球返工Spacer Cure衬垫球附着固化Short Dispense导电胶涂布Sealant Dispense边框胶涂布Seal Inspection边框胶检查LC Dispense液晶滴下Vacuum Assembly真空贴合UV Cure紫外线固化Mis-alignment check错位检查Seal Oven边框胶热固化Eye Inspection目视检查Cell gap Measurement盒厚测试Cutting切割1/4(1/6)Sheet Cutting,1/4(1/6)切割Stick Cutting,切条Cell Cutting切粒Visual TestVis
11、ual 测试ECPEdge Grind磨边Dipping clean浸泡式清洗Clean before Pol 贴片前清洗Pol Attach贴片Pol Inspection贴片检查Pol rework贴片返工Auto ClaveAuto Clave消泡Laser TrimmerLaser Trimmer激光切线Test测试Gross Test终检Repair修补Bin sorter分级OQC Test出货检查Store货栈Module Process Flow模块段工艺流程COGPad cleaning端子清洗IC BondingIC 邦定Microscope InspectionAOI 镜
12、检自动光学检查Adhesive test粘接力测试FOGACF AttachingACF 粘贴FOG BondingFOG 邦定Microscope Inspection镜检Peeling strength test拉力测试ET test1电测1IC or FPC Repair修补UV glue sealing 封胶FPC reinforcement补强UV glue curingUV胶固化Assembly组装ET test2电测2anti-ultraviolet tape attaching遮光胶带粘贴protected tape attaching保护胶带粘贴Backlight assembly背光源组装Backlight soldering背光源焊接Touch panel assembly触摸屏组装Final ET test最终电测Rework返工Aging老化QC testQC检验Code printing喷码Packing包装OQC Test出货检验Finished good shipment合格品出货CIM name集成控制系统名称CIM计算机集成制造系统CIM System计算机集成制造系统Manufacturing Execution System(MES)制造执行系统（MES）Preventi
