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1、导热绝缘超薄胶片的研制虞锦洪 杨高潮 韦 春 吕 建 陆绍荣桂林工学院 材料与化学工程系 广西桂林 541004; 随着信息产业的飞速发展,对电子产品的要求越来越高,要求其小体积、高容量。这就促使了大规模、高密度集成电路板及微封装技术的迅速发展,使得电子产品中的元器件的密度变得愈来愈高,单位体积的功率突增,因此高绝缘性和高导热性的材料成为研究热点1.3。1.1生胶的选择我们选择了可以高填充的三元乙丙橡胶(EPDM)为基体胶料,它可与填料进行高掺量的混合(最高可达800phr)而其物理机械性能下降不大2。图1是加入硅橡胶后对其高温下的拉伸作用做的测试: Fig.1 The elongation
2、at break of silicone, Fig2.The effection of different granularityEPDM and the blend of EPDM and silicone distributing on the thermal coefficient1.2导热绝缘填料的选择图2是同时加入大粒径ZnO和小粒径Al2O3的胶料与只加小粒径Al2O3的导热性能的比较。表1是对两种粒径的填料进行配比实验,测得不同配比数据如下:Tab.1 Thermal conductive property of samples with different proportion
3、 of ZnO and Al2O3不同配比的试样样1样2样3样4样5ZnO的重量分数 Al2O3的重量分数 导热系数(w/mk)3001000.702501500.622002000.551502500.531003000.581.3阻燃填料的选择表2是Sb2O3与ZR-10配比试验数据,从表2中可看出,当ZR-10与Sb2O3为50:15时就可达到UL94 V-1阻燃级别。Tab.2 Fire-resistance of samples with different proportion of ZR-10 and Sb2O3试样样1样2样3样4ZR10的重量份数Sb2O3的重量份数是否达到U
4、L94 V-1阻燃级别505否5010否5015是5020是2 结论(1)经过对三元乙丙橡胶、硅橡胶和丁腈橡胶综合性能的比较,再经过试验的测定,最后选择了:以三元乙丙橡胶为基体,用硅橡胶与之共混,当二者的比例为100:20时大幅度提高了三元乙丙橡胶的高温应用性能,并解决了不能对硅橡胶高份量填充的问题,且降低了制品的成本,从而获得了综合性能较好的基胶。(2)导热绝缘填料选择了绝缘性能优良的ZnO和Al2O3作为绝缘剂,并用较大粒径的ZnO和较小粒径的Al2O3进行互补配合使用,填充比例为100:300时获得了优良绝缘性的同时还拥有较好的物理机械性能。(3)阻燃填料则选用了十溴二苯醚作为主阻燃剂,
5、并以三氧化二锑与之组成协效阻燃体系,在比例为50:15时取得了较好的阻燃效果。参考文献1.马传国等. 导热高分子复合材料的研究应用. 材料工程, 2002, 7:402.姜蔚等. 耐热三元乙丙橡胶胶料. 橡胶参考资料, 2003, 3:303.王铁如. 导热绝缘胶-型的研制. 绝缘材料通讯, 1996, 2:25Development of the Ultrathin Rubber Slice with High Thermal Conductivity and Electricity insulator PropertiesJinhong Yu Gaochao Yang Chun Wei J
6、ian Lv Shaorong LuDepartment of Materials and Chemistry Engineering, Guilin University of Technology, Guilin 541004Abstract: The article gives a demonstration on research and manufacture process of the rubber slice which owns thermal conductivity, electricity insulator and fire-resistance properties
7、. Moreover , we has made a deep study on the thermal conductivity which increased through the silicone rubber and ethylene-propylene-diene-terpolymer (EPDM) blending. Besides, we select the big granularity ZnO filler and small granularity Al2O3 filler to increase the slices thermal conductivity. And
8、 a detail discussion is posted on the thermal conducting mechanism and how to improve the filler function of thermal conductivity and electricity insulated. Then we combine the usage of ZR-10 and Sb2O3 to enhance the blends fire-resistance.Keywords: Ethylene-propylene-diene-terpolyme(EPDM); Thermal Conductivity; Electricity insulator; Silicone;