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1、火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去半导体量测设备及应用介绍陈贵荣2013/09/11 E_mail : 火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去芯片凸块制程检验雷射扫瞄仍是目前凸块检测最广为使用的三维量测技术火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去Failure Analysis_1火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出
2、去Failure Analysis_2火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去Examples of solder bump defectExplain火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去高阶封装技术300mm晶圆火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去高阶封装技术WaferBump火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去
3、3DBumpInspectionusingLaserTriangulation3Dand2Dbumpinspectionisacriticalcomponentinmanufacturingofbumpedwafers.Continuousminiaturizationanduseofthroughsiliconvia(TSV)in3Dpackagesarepushingbumpsizessmallerandsmaller.Thesmallbumpsize,smallpitchandhighnumberofbumpsarechallenginginspectiontechnologies,re
4、quiringhighaccuraciesandhighthroughput.Laser triangulationisthedominanttechnologyfor3Dcharacterizationofsolderandpillarbumpsusedinconventionalpackagingtechniques.The technology is a line scan laser with the ability to collect hundreds of 3D data points along one scan line in a fraction of a second.T
5、hesedatapointscanthenbeusedtobuilda3Dmodelofthetopofthebumpandsurfaceofthewaferforlocalheightinspection.Asbumpsizeandpitchcontinuetodecreaseandbumpnumbersheadtowardstensofmillionsperwafer,thespeedandaccuracyoflasertriangulationtechnologygives3DICmanufacturerstheabilitytotightlycontrolbumpprocessesan
6、ddetectbumpdefects.火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去Basic Geometry of Laser Triangulation火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去雷射三角几何示意图此雷射三维系统之量测精度,主要受限于传感器之分辨率及投射之雷射光线宽,越细的雷射线宽及高分辨率传感器,可获得较高之量测精度。火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去雷射三角法系统架构图利
7、用程控,可以调整雷射光之线宽及扫瞄速度。此系统之组成简单稳健,适合工业环境之实际应用。火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去Slit ScannerSlitscannersareadirectionextensionofthebasictriangulation principle火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去非接触三角法探头原理火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去WaferS
8、cannerForbothstandardandflipchipwafers,theWaferScannerInspectionSeriesprovidessuperioryieldmanagementfor3D/2DbumpandRDLmetrology,bumpandRDLdefectandmacrodefectinspectionthroughoutpost-fabprocesses.Defectscreatedinthepost-fabareabetweenwaferprocessing,bumpprocessingandfinalmanufacturingcannegativelyi
9、mpactproductyieldsandtime-to-market.TheWaferScannerquicklyandreliablylocatesbumpandwaferdefects,reducingprocesscostsandimprovingyield.火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去Through-SiliconVia(TSV)Athrough-siliconvia3Dpackage(3DIC)c
10、ontainstwoormorechipsstackedvertically,withviasthroughthesiliconsubstratesreplacingedgewiringtocreateanelectricalconnectionbetweenthecircuitelementsoneachchip.TSVtechnologyprovidesadramaticincreaseinthefunctionalityofthedeviceinaverysmallfootprint.Multipletechnologiesarebeingexploredtoformviasduring
11、thewaferfabricationprocess(front-end)andtheICpackagingandassemblystage(back-end).MetrologyandinspectionoftheTSVsarecriticalforensuringtheperformanceofthe3DICsandtheprofitabilityoftheoverallmanufacturingprocess.火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去Bump Inspection SystemSP-500BThe SP-
12、500B automatically measures the heights, coplanarity, shapes and positions of the bumps on wafers or IC chips.Torays Automatic Bump Inspection System SeriesThe 3D profiling technique is based on a newly developed optical interferometry, which has the world fastest measurement speed with sub-micron a
13、ccuracy of height measurement.火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去Specifications火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去Test Results火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机
14、立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去AugustTechnologyDesignedforhigh-speedbumpandwaferinspection,thesystemincorporatestheCompanyspatent-pendingthree-dimensional(3D)RapidConfocalSensor,withproprietarytwo-dimensional(2D)bumpandactivedieinspectiontechnologiest
15、oprovidebumpmanufacturerswithhigh-speedandhighaccuracycombinedinasinglebumpinspectionsolution.火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去812Wafer高阶SolderBump检查机高Repepeatability(3):1um以下业界的最快检查能力对应812WaferFOUP自动机器提供多种多样化的讯息报告WVI-6000火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去Fal
16、con800Camtek开发的Falcon800系列先进的测量系统用于凸起封装晶圆,并保证凸点达到他们严格的公差。CTS,Camtek三角测量系统(专利申请中)应用了比已知的三角测量原理更新的方式,提高了一系列凸起技术的精度与可重复性。更宽的角度范围创造了更多种类凸起形状与材料更强和更稳定的反射,支持凸起的真3D几何重建。Falcon800更是特别设计用于最精细的金板的测量。火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去ASE火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去火灾袭来时要迅速疏散逃生,不可蜂拥而出或留恋财物,要当机立断,披上浸湿的衣服或裹上湿毛毯、湿被褥勇敢地冲出去IS-100 is high-speed inspection developed for area array bump inspectionMeasuring Method:Triangulationbylaserscanning.Inspection object:Solderbump