英文版芯片封装

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1、IC PACKAGINGPREPARED BY : SS SENG/24FEB2004IC PACKAGINGPREPARED BY : SS SENG/24FEB2004SEMICONDUCTOR MFG (BACK-END/PACKAGING)SMT PLASTIC PACKAGE : WAFER SAW/DICING DIE ATTACH/MOUNT WIRE BONDING MOLDING/ENCAPSULATION CROPPING/TRIM&FORM SOLDER DIPPING TESTING PACKING & SHIPPINGPREPARED BY : SS SENG/24F

2、EB2004SEMICONDUCTOR MFG (BACK-END/PACKAGING)BGA : WAFER SAW/ DICING DIE ATTACH/ MOUNT WIRE BONDING MOLDING/ ENCAPSULATION SAWING SOLDER BALL ATTACH TESTING PACKING & SHIPPINGPREPARED BY : SS SENG/24FEB2004WAFER SAW/DICINGPREPARED BY : SS SENG/24FEB2004WAFER SAW/DICINGPREPARED BY : SS SENG/24FEB2004W

3、AFER SAW/DICINGSingulation of individual die : Mounting tape & frame Saw blades Washing Tape CuringPREPARED BY : SS SENG/24FEB2004DIE ATTACH/MOUNTPREPARED BY : SS SENG/24FEB2004DIE ATTACH/MOUNTAttach die to leadframe/substrate : Epoxy glue dispensing unto leadframe Die attach Epoxy glue curingPREPAR

4、ED BY : SS SENG/24FEB2004WIRE BONDINGPREPARED BY : SS SENG/24FEB2004WIRE BONDINGConnect die to external leads : Wires Au/Cu/Al Thermo sonic bonding 1st Bond Ball bond 2nd Bond Stitch bondPREPARED BY : SS SENG/24FEB2004MOLD/ENCAPSULATIONPREPARED BY : SS SENG/24FEB2004MOLD/ENCAPSULATIONProtect interna

5、l circuit from external environment : Transfer molding Mold curingPREPARED BY : SS SENG/24FEB2004CROPPING/TRIM&FORMPREPARED BY : SS SENG/24FEB2004CROPPING/TRIM&FORM/MARKINGSingulation of individual IC unit (end product) : Cut dambars and unwanted leadframe Form leads per specification Marking : Lase

6、r marking PrintPREPARED BY : SS SENG/24FEB2004SOLDER DIPPINGPREPARED BY : SS SENG/24FEB2004SOLDER DIPPINGLead finishing with coated solder : Flux Solder dipPREPARED BY : SS SENG/24FEB2004TESTINGPREPARED BY : SS SENG/24FEB2004TESTING100% testing of all units : Continuity failure Functional failure Pa

7、rametric failurePREPARED BY : SS SENG/24FEB2004PACKING & SHIPPINGPREPARED BY : SS SENG/24FEB2004PACKING & SHIPPINGPacking & shipping of parts to customers : Reels, trays, tubes Dry-pack LabellingsPREPARED BY : SS SENG/24FEB2004PACKING & SHIPPINGNew Traceability Code : PPYWWLLL (June Dec 2003) - PP = Traceability production area code - Y = Year - WW = Work Week - LLL = Alphanumeric charactersPREPARED BY : SS SENG/24FEB2004HT = Korean subcon A 4 = Year 2004 WW = WW08

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