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1、半导体集成电路IC常用术语园片：硅片芯片(Chip, Die)：6、8 ：硅（园）片直径：1 25.4mm6150mm; 8200mm; 12300mm; 亚微米1m的设计规范深亚微米=0.5 m的设计规范0.5 m 、 0.35 m 设计规范（最小特征尺寸）布线层数：金属（掺杂多晶硅）连线的层数。集成度：每个芯片上集成的晶体管数IC工艺常用术语净化级别：Class 1, Class 10, Class 10,000每立方米空气中含灰尘的个数去离子水氧化扩散注入光刻.最小线宽变化生产工厂简介PSIFab Two was completed January 2, 1996 and is a “S
2、tate of the Art“ facility. This 2,200 square foot facility was constructed using all the latest materials and technologies. In this set of cleanrooms we change the air 390 times per hour, if you do the math with ULPA filtration this is a Class One facility. We have had it tested and it does meet Cla
3、ss One parameters (without any people working in it). Since we are not making microprocessors here and we dont want to wear “space suits“, we run it as a class 10 fab. Even though it consistently runs well below Class Ten. Here in the Fab Two Photolithography area we see one of our 200mm .35 micron
4、I-Line Steppers. this stepper can image and align both 6 & 8 inch wafers. Another view of one of the Fab Two Photolithography areas. Here we see a technician loading 300mm wafers into the SemiTool. The wafers are in a 13 wafer Teflon cassette co- designed by Process Specialties and SemiTool in 1995.
5、 Again these are the worlds first 300mm wet process cassettes (that can be spin rinse dried). As we look in this window we see the Worlds First true 300mm production furnace. Our development and design of this tool began in 1992, it was installed in December of 1995 and became fully operational in J
6、anuary of 1996. Here we can see the loading of 300mm wafers onto the Paddle. Process Specialties has developed the worlds first production 300mm Nitride system! We began processing 300mm LPCVD Silicon Nitride in May of 1997. 2,500 additional square feet of “State of the Art“ Class One Cleanroom is c
7、urrently processing wafers! With increased 300mm & 200mm processing capabilities including more PVD Metalization, 300mm Wet processing / Cleaning capabilities and full wafer 300mm .35um Photolithography, all in a Class One enviroment.Currently our PS300A and PS300B diffusion tools are capable of run
8、ning both 200mm & 300mm wafers. We can even process the two sizes in the same furnace load without suffering any uniformity problems! (Thermal Oxide Only)Accuracy in metrology is never an issue at Process Specialties. We use the most advanced robotic laser ellipsometers and other calibrated tools fo
9、r precision thin film, resistivity, CD and step height measurement. Including our new Nanometrics 8300 full wafer 300mm thin film measurement and mapping tool. We also use outside laboratories and our excellent working relationships with our Metrology tool customers, for additional correlation and c
10、alibration. One of two SEM Labs located in our facility. In this one we are using a field emission tool for everything from looking at photoresist profiles and measuring CDs to double checking metal deposition thicknesses. At the helm, another one of our process engineers you may have spoken with Ma
11、rk Hinkle. Here we are looking at the Incoming material disposition racks Above you are looking at a couple of views of the facilities on the west side of Fab One. Here you can see one of our 18.5 Meg/Ohm DI water systems and one of four 10,000 CFM air systems feeding this fab (left picture), as wel
12、l as one of our waste air scrubber units (right picture). Both are inside the building for easier maintenance, longer life and better control. 集成电路（Integrated Circuit, IC）：半导体IC，膜IC，混合IC半导体IC：指用半导体工艺把电路中的有源器件、无源元件及互 联布线等以相互不可分离的状态制作在半导体上，最后封装在一 个管壳内，构成一个完整的、具有特定功能的电路。半导体IC双极ICMOSICBiCMOSPMOS ICCMOS
13、ICNMOS IC摩尔定律n集成电路工业发展的一个重要规律即所谓摩尔 定律。Intel公司的创始人之一戈登摩尔先生 在1965年4月19日发表于电子学杂志上 的文章中提出，集成电路的能力将每年翻一番 。1975年，他对此提法做了修正，称集成电 路的能力将每两年翻一番。摩尔定律现在的表 达：在价格不变的情况下，集成电路芯片上的 晶体管数量每18个月翻一番，即每3年乘以4 。集成电路工业发展的另一些规律建立一个芯片 厂的造价也是每3年乘以4；线条宽度每6年下 降一半；芯片上每个器件的价格每年下30% 40%。 晶片直径的变化：60年：0.5英寸65年：1英寸70年：2英寸75年：3英寸80年：4英
14、寸90年：6英寸95年：8英寸（200mm）2000年：12英寸（300mm）2007年十大半导体厂商排行 2007年全球半导体营收额为2703亿美元，同比增长2.9%。 英特尔营收 仍然高居榜首，市场份额从去年的11.6%增至12.2%。三星排名第二，市场 份额为7.7%。东芝第三，市场份额为4.6%。德州仪器第四，市场份额为 4.2%。以下为Gartner评出的2007年10大半导体厂商： 1. 英特尔（06年第1） 2. 三星（06年第2） 3. 东芝（06年第6） 4. 德州仪器（06年第3） 5. 意法半导体（06年第5） 6. 英飞凌（06年第4） 7. Hynix半导体（06年第
15、7） 8. Renesas科技（06年第8） 9. NXP半导体（06年未进前10） 10. NEC电子（06年未进前10） Transistor Counts1,000,000100,00010,0001,000101001 197519801985 19901995 20002005 2010808680286i386i486PentiumPentium ProK1 Billion 1 Billion TransistorsTransistorsSource: IntelSource: IntelProjectedProjectedPentium IIPentium IIICourtesy
16、, IntelMoores law in Microprocessors40048008808080858086286386486Pentium procP60.0010.010.1110100100019701980199020002010 YearTransistors (MT)2X growth in 1.96 years!Transistors on Lead Microprocessors double every 2 yearsCourtesy, IntelDie Size Growth400480088080 80858086286386486Pentium procP611010019701980199020002010 YearDie size (mm)7% growth per year 2X growth in 10 yearsDie size grows by 14% to satisfy Moores LawCourtesy, IntelFrequencyP6
