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1、哈尔滨工程大学本科生毕业论文摘 要随着集成电路工艺技术的不断发展，Cu逐渐取代传统的金属互连材料Al，而使器件获得了更高的运算速度和可靠性，但也不可避免地带来了Cu的扩散污染等问题。寻找合适的抑制Cu扩散的阻挡层材料多年来已成为Cu互连工艺研究中的热点课题。在综述了互连的优势及面临的挑战、扩散阻挡层的制备工艺和发展趋势之后，作者在改变氮气流量、沉积偏压和沉积温度的条件下，采用磁控溅射技术在Si衬底上制备了25nm厚的Zr-N膜，在真空条件下对Cu/Zr-N/Si样品进行了600-800温度下的退火处理。用四探针电阻测试仪（FPP）、AFM 、XRD、SEM和AES等分析测试方法对样品的形貌、结
2、构与阻挡性能进行了分析。分析结果表明，随着沉积温度的升高，Zr-N薄膜的结构由非晶态向晶态转变，晶粒的尺寸增大。退火后的FPP、XRD、AES对比结果说明沉积温度的升高有利于提高Zr-N薄膜的扩散阻挡性能，400下制备的Zr-N薄膜有很好的阻挡性能，可以稳定到650。N2分压从20%增加到25%，电阻率快速增高；溅射偏压不同，Zr-N的结构可由非晶态结构转变为纳米晶。纳米晶Zr-N阻挡层650退火1小时后仍能有效地阻止Cu的扩散。关键词：Cu 互连；阻挡层；Zr-N 薄膜；射频反应磁控溅射；纳米晶哈尔滨工程大学本科生毕业论文IABSTRACTWith the development of IC
3、 processing technology, copper metallization is taking the place of classical aluminum interconnect. Although copper metallization has promoted operation speed and reliability of device, contamination of Cu diffusion is inevitable. One crucial problem to solve in Cu metallization to find out the app
4、licable diffusion barrier.In this study, our investigation focuses on the performance of Zr-N films as the barrier. zirconium nitride(Zr-N) thin film with 25nm thickness was grown on Si(100) substrates under various substrate temperatures in a rf magnetron sputtering system. Weve studied the impact
5、of deposition conditions on the material characteristics and performance of the barrier. The optimal scheme of bringing out the barrier represents out ultimate target.It is found that the resistivity of Zr-N film increases rapidly when N2 flow ratio changes from 20% to 25%.Additionally, Zr-N film mi
6、crostructure is very sensitive to the sputtering conditions. Zr-N films deposited at various substrate bias can produce amorphous and nano-crystalline phase. XRD and AFM results before annealing show the microstructure of Zr-N films vary from amorphous to crystalline phase and grain sizes increase w
7、ith increasing substrate temperature. It is also observed that Zr-N film prepared at -200V bias and 400 has better diffusion barrier property and still performed well against Cu diffusion after being annealed under 650 for an hour. Key Word: Cu metallization; diffusion barrier; Zr-N film; rf magnetr
8、on sputtering; nano-crystal哈尔滨工程大学本科生毕业论文0目 录第 1 章 绪论.11.1 引言.1 1.2 扩散阻挡层介绍.1 1.2.1 互连的定义.1 1.2.2 阻挡层所应具备的特性.3 1.2.3 阻挡层分类.4 1.3 阻挡层的制备工艺.6 1.3.1 溅射沉积.6 1.3.2 化学气相沉积.8 1.3.3 其它沉积方法.9 1.4 选题背景、目的及意义.10第 2 章 Zr-N 阻挡层薄膜的制备及表征.122.1 引言.12 2.2 溅射机理及特点.12 2.3 实验设备.13 2.4 实验设备使用方法.14 2.5 ZrN 阻挡层薄膜的制备.15 2.5.1 试验材料.15 2.5.2 基片前处理.15 2.5.3 Zr-N 阻挡层薄膜制备.17 2.6 表征方法.18 2.6.1 X 射线衍射表征方法(XRD).18 2.6.2 表面形貌(AFM).19 2.6.3 俄歇电子能谱(AES) .20 2.6.4 SGC-2 型自动椭圆偏振测厚仪 .21 2.6.5 SDY-4D 型四探针电阻测试仪 .22 2.7 本章小结.23第 3 章 实验结果及分析.243.1 N2分压对 Zr-N 膜电阻率的影
