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1、33Tw 1,62(1.北京华胜科技有限公司,北京 100080;2.合肥通用机械研究所 合肥 230031)K1:本文针对板式泡罩包装机包装出的板块存在的褶皱、弯曲等现象提出了合理的改进措施及解决方法。1oM:板块;褶皱;弯曲;改进ms|:TB486DSM:BcI|:1005-1295(2002)05-0033-02The Improvement of the Technology in the Plate_type Blister Packaging MachineLIU Xiong_xin et al(1.Beijing Huasheng Technology Co.,Ltd,Beiji
2、ng 100080,China)Abstract:This article put forward some equitable measure and the solving method,with the appearance such as fold andbending etc.of the board,in the plate_type blister packaging machine.Key words:board ;fold ;bending;improvementl:2002-07-20Te:刘雄心(1971-),男,北京华胜科技有限公司公司工程师,发表论文10余篇。m1Tm
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