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1、 培培 训训 实实 现现 价价 值值 联系电话：0755-26506757 13798472936 李正华 E-mail: martin-无铅生产所带来的问题及解决方法培训班无铅生产所带来的问题及解决方法培训班(8/18(8/18 苏州苏州) )您能从此课程中学到哪些内容：您能从此课程中学到哪些内容： 这个课程覆盖了电子行业在无铅转换中发生的焊接相关的问题。更重要的是 它也体现了近年来行业在尽力解决这些问题作出的努力和成果。强调了波峰 焊，选择性波峰焊和维修的制造工艺。讲述表面处理引起的问题，特别是锡 须。关于焊料的选择，会提及什么样的合金焊料是合适的，权衡利弊，如何 选择及评估。详细讨论那些
2、难以避免的问题例如混合合金及便携设备对冲击 损坏的敏感性. 基于有价值的案例提供建议.最后，回顾近来在对可靠性以及 机械性关键因素的研究，来回答如何实现高可靠性的问题。 WhatWhat YouYou CanCan LearnLearn FromFrom ThisThis Course:Course: This course covers the soldering related issues ailing the electron ic manufacturing industry during lead-free conversion. Most importa ntly, it als
3、o presents the most recent efforts and results of the i ndustry in trying to resolve those issues. The manufacturing practi ce emphasizes on wave soldering, selective soldering, and rework. T he problems caused by surface finishes, particularly tin whiskers, are addressed. Regarding the solder mater
4、ials, what solder alloys a re available for selection, what is the pro and con, how to select, and how to evaluate, are presented. The inevitable issues such as m ixed alloys and sensitivity of portable devices toward impact failu re are discussed in details, with advices provided based on valuabl e
5、 cases study experience. Finally, the questions about how to deliv er a high reliability are answered with a close review of most rece nt studies on critical factors affecting reliability and the mechan isms involved. 【主办单位主办单位】中国电子标准协会中国电子标准协会 【协办单位协办单位】深圳市威硕企业管理咨询有限公司 【课程时间课程时间】2012 年 08 月 18-19
6、日 苏州 【课程费用课程费用】2500 元/人（含资料费、授课费、午餐） 【咨询热线咨询热线】0755-26506757 13798472936 李先生 彭小姐 【报名邮箱报名邮箱】martin- 谁应该参加此课程：谁应该参加此课程： 任何对关心实现高直通率和高可靠性的无铅焊点及想了解如何实现的相关人 员都应该参加。 Any one who care about achieving high yield and high reliability le ad-free solder joints and like to know how to achieve them should t ake
7、this course. 老师介绍：老师介绍：李宁成博士 1986 年至今，任职于美国铟科技公司，现任该公司副 总裁。在此之前，任职于 Wright Patterson 空军基地材料实验室（1981-1982 ），Morton 化学（1982-1984）和 SCM（1984-1986）。他在 SMT 助焊剂和培培 训训 实实 现现 价价 值值 联系电话：0755-26506757 13798472936 李正华 E-mail: martin-焊锡膏方面有 20 多年的研究经验。此外，他在底部填充胶和粘接剂方面有着 丰富的经验。现今，他的研究领域涉及到电子和光电子的互联与封装应用的 先进材料，并
8、且侧重于高性能与低成本。 李宁成博士于 1981 年在美国阿克伦城大学获得结构-性质关系聚合体科学博 士学位。1976 年，他在 Rutgers 大学专修有机化学。1973 年他在立大 学获得化学学士学位。 李宁成博士最新出版了再流焊工艺和缺陷侦断：SMT，BGA，CSP 和 Flip Chip 技术。合著编写了无铅，无卤素和导电胶材料的电子制造。同时 ，他还编写了一系列关于无铅焊接书籍的章节。他荣获 SMTA 两项大奖和一 项 SMT 杂志的最佳国际会议论文奖。2002 年荣获 SMTA 杰出会员，2003 年 荣获 Soldertec 的无铅合作奖。2006 年荣获 CPMT 特殊技术成就
9、奖。他就职于 SMTA 执行董事会。此外，他还是焊接与表面组装技术、世界 SMT 与 封装的编辑顾问，和 IEEE 电子封装制造的副编辑。他有众多的出版物以及 经常应邀在全世界许多国际会议或者讨论会上作学术报告，发表演讲和简短 课程。 Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Wright Patterson Air For
10、ce Base Materials Laboratory (1981-1982), Morton Chemical (1982-1984), and SCM (1984-1986). He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. Hi
11、s current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. He received his PhD in polymer science on structure-property relationships from University of Akro
12、n in 1981. Prior to Akron period, he has studied organic chemistry at Rutgers University in 1976. He received a BS in chemistry from National Taiwan University in 1973.Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, a
13、nd co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-培培 训训 实实 现现 价价 值值 联系电话：0755-26506757 13798472936 李正华 E-mail: martin-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received two awards from SM
14、TA and one from SMT Magazine for best proceedings papers of international conferences. He is honored as 2002 SMTA Member of Distinction, and received 2003 Lead-Free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He serves on the board of direc
15、tor for SMTA. Among other editorial responsibilities, he serves as one of the editorial advisory boards of Soldering & Surface Mount Technology, Global SMT & Packaging, and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently g
16、ives presentations, invited seminars, keynote speeches, and short courses worldwide on those subjects at many international conferences or symposiums.本课程将涵盖以下主题：本课程将涵盖以下主题： 主题主题 TopicsTopics1.1. 表面处理问题表面处理问题 (1) 裂缝腐蚀 (2) 各种表面处理的品质和性能(3) 各种表面处理的可靠性比较2.2. 锡须锡须 长期的威胁长期的威胁(1) 锡须产生的原理(2) 锡须的测量(3) 锡堆积物残余应力测量(4) 量
