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1、一、 综合词汇 1、 印制电路：printed circuit 2、 印制线路：printed wiring 3、 印制板：printed board 4、 印制板电路：printed circuit board (PCB) 5、 印制线路板：printed wiring board(PWB) 6、 印制元件：printed component 7、 印制接点：printed contact 8、 印制板装配：printed board assembly 9、 板：board 10、单面印制板：single-sided printed board(SSB) 11、双面印制板：double-si
2、ded printed board(DSB) 12、多层印制板：mulitlayer printed board(MLB) 13、多层印制电路板：mulitlayer printed circuit board 14、多层印制线路板：mulitlayer prited wiring board 15、刚性印制板：rigid printed board 16、刚性单面印制板：rigid single-sided printed borad 17、刚性双面印制板：rigid double-sided printed borad 18、刚性多层印制板：rigid multilayer printed
3、 board 19、挠性多层印制板：flexible multilayer printed board 20、挠性印制板：flexible printed board 21、挠性单面印制板：flexible single-sided printed board 22、挠性双面印制板：flexible double-sided printed board 23、挠性印制电路：flexible printed circuit (FPC) 24、挠性印制线路：flexible printed wiring 25、刚性印制板：flex-rigid printed board, rigid-flex p
4、rinted board 26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 28、齐平印制板：flush printed board 29、金属芯印制板：metal core printed board 30、金属基印制板：metal base printed board 31、多重布线印制板：mulit-wirin
5、g printed board 32、陶瓷印制板：ceramic substrate printed board 33、导电胶印制板：electroconductive paste printed board 34、模塑电路板：molded circuit board 35、模压印制板：stamped printed wiring board 36、顺序层压多层印制板：sequentially-laminated mulitlayer 37、散线印制板：discrete wiring board 38、微线印制板：micro wire board 39、积层印制板：buile-up print
6、ed board 40、积层多层印制板：build-up mulitlayer printed board (BUM) 41、积层挠印制板：build-up flexible printed board 42、表面层合电路板：surface laminar circuit (SLC) 43、埋入凸块连印制板：B2it printed board 44、多层膜基板：multi-layered film substrate(MFS) 45、层间全内导通多层印制板：ALIVH multilayer printed board 46、载芯片板：chip on board (COB) 47、埋电阻板：b
7、uried resistance board 48、母板：mother board 49、子板：daughter board 50、背板：backplane 51、裸板：bare board 52、键盘板夹心板：copper-invar-copper board 53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board 55、可断拼板：break-away planel 56、电缆：cable 57、挠性扁平电缆：flexible flat cable (FFC) 58、薄膜开关：membrane switch 59、混合电路：hybrid
8、circuit 60、厚膜：thick film 61、厚膜电路：thick film circuit 62、薄膜：thin film 63、薄膜混合电路：thin film hybrid circuit 64、互连：interconnection 65、导线：conductor trace line 66、齐平导线：flush conductor 67、传输线：transmission line 68、跨交：crossover 69、 板边插头：edge-board contact 70、 增强板：stiffener 71、 基底：substrate 72、 基板面：real estate
9、73、 导线面：conductor side 74、 元件面：component side 75、 焊接面：solder side 76、 印制：printing 77、 网格：grid 78、 图形：pattern 79、 导电图形：conductive pattern 80、 非导电图形：non-conductive pattern 81、 字符：legend 82、 标志：mark 二、 基材： 1、 基材：base material 2、 层压板：laminate 3、 覆金属箔基材：metal-clad bade material 4、 覆铜箔层压板：copper-clad lami
10、nate (CCL) 5、 单面覆铜箔层压板：single-sided copper-clad laminate 6、 双面覆铜箔层压板：double-sided copper-clad laminate 7、 复合层压板：composite laminate 8、 薄层压板：thin laminate 9、 金属芯覆铜箔层压板：metal core copper-clad laminate 10、 金属基覆铜层压板：metal base copper-clad laminate 11、 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film 12、 基体
11、材料：basis material 13、 预浸材料：prepreg 14、 粘结片：bonding sheet 15、 预浸粘结片：preimpregnated bonding sheer 16、 环氧玻璃基板：epoxy glass substrate 17、 加成法用层压板：laminate for additive process 18、 预制内层覆箔板：mass lamination panel 19、 内层芯板：core material 20、 催化板材：catalyzed board ,coated catalyzed laminate 21、 涂胶催化层压板：adhesive
12、-coated catalyzed laminate 22、 涂胶无催层压板：adhesive-coated uncatalyzed laminate 23、 粘结层：bonding layer 24、 粘结膜：film adhesive 25、 涂胶粘剂绝缘薄膜：adhesive coated dielectric film 26、 无支撑胶粘剂膜：unsupported adhesive film 27、 覆盖层：cover layer (cover lay) 28、 增强板材：stiffener material 29、 铜箔面：copper-clad surface 30、 去铜箔面：
13、foil removal surface 31、 层压板面：unclad laminate surface 32、 基膜面：base film surface 33、 胶粘剂面：adhesive faec 34、 原始光洁面：plate finish 35、 粗面：matt finish 36、 纵向：length wise direction 37、 模向：cross wise direction 38、 剪切板：cut to size panel 39、 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/pap
14、er CCL) 40、 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 41、 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates 42、 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced
15、copper-clad laminates 44、 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates 45、 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates 46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板： bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric coppe
16、r-clad laminates 48、 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates 49、 超薄型层压板：ultra thin laminate 50、 陶瓷基覆铜箔板：ceramics base copper-clad laminates 51、 紫外线阻挡型覆铜箔板：UV blocking copper- clad laminates 三、 基材的材料 1、 A 阶树脂：A-stage resin 2、 B 阶树脂：B-stage resin 3、 C 阶树脂：C-stage resin 4、 环氧树脂：epoxy resin 5、 酚醛树脂：phenolic resin 6、 聚
