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1、印制电路基材词汇讲解印制电路基材词汇讲解鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶 鏀惰棌鍒癐 E 鏀惰棌澶?鏀惰棌鍒版闈?璁句负棣栭 鎮綋鍓嶄负娓稿鐘舵侊紝鐧诲綍鎴栨敞鍐屻傜綉绔欏湴鍥炬渶鏂颁緵搴?鎴蜂富锛歴 mt163 鏀惰棌 娓稿鐧诲綍 | 娉唽闂埛棣栭 渚涙眰淇伅 琛屼笟璧勮 鎶鏈氦娴?浜 搧涓績 浜屾墜璁惧 閰嶄欢鏈嶅姟 姹傝亴鎷涜仒 涓撲笟涔簵 浼佷笟搴?鎶鏈鍧?鐑棬鍏抽敭瀛?鐑棬鍏抽敭璇嶏細 SMT 銆璐寸墖鏈?SMT 璁哄潧 琛潰璐磋鎶鏈?SMT 鎶鏈?瀵艰埅 鐜板湪浣嶇疆锛氶椤? 鍩虹鐭瘑 鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶 鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶 鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶 鍗板埗鐢佃
2、矾鍩烘潗璇嶆眹璁茶 澶 閮界煡閬擄紝鎴戜滑甯哥敤鐨凱 CB 鐢绘澘宸叿閮芥槸澶栧浗宸甯堢爺绌跺嚭鏉殑锛屾墍浠噷闈嚑涔庨兘鏄嫳鏂囧崟璇嶏紝铏界劧鏈変簺宸叿杞欢琚炕璇戞垚涓枃锛屼絾鎺屾彙杩欎簺甯哥敤鐨勫嵃鍒剁數璺瘝姹囪繕鏄鏈夊澶勭殑銆?涓嬮潰鎴戜滑鏉粙缁嶄笅锛?1 銆佸熀鏉愶細 base material2 銆佸眰鍘嬫澘锛歭 aminate3 銆佽閲戝睘绠斿熀鏉愶細 metal-clad bade material4 銆佽閾滅當灞傚帇鏉匡細 copper-clad laminate (CCL)5 銆佸崟闈閾滅當灞傚帇鏉匡細 single-sided copper-clad laminate6 銆佸
3、弻闈閾滅當灞傚帇鏉匡細 double-sided copper-clad laminate7 銆佸鍚堝眰鍘嬫澘锛歝 omposite laminate8 銆佽杽灞傚帇鏉匡細 thin laminate9 銆侀噾灞炶姱瑕嗛摐绠斿眰鍘嬫澘锛歮 etal core copper-clad laminate10 銆侀噾灞炲熀瑕嗛摐灞傚帇鏉匡細 metal base copper-clad laminate11 銆佹尃鎬 閾滅當缁濈紭钖勮啘锛歠 lexible copper-clad dielectric film12 銆佸熀浣撴潗鏂欙細 basis material13 銆侀娴告潗鏂欙細 prepre
4、g14 銆佺矘缁撶墖锛歜 onding sheet15 銆侀娴哥矘缁撶墖锛歱 reimpregnated bonding sheer16 銆佺幆姘 幓鐠冨熀鏉匡細 epoxy glass substrate 17 銆佸姞鎴愭硶鐢眰鍘嬫澘锛歭 aminate for additive process18 銆侀鍒跺唴灞傝绠旀澘锛歮 ass lamination panel19 銆佸唴灞傝姱鏉匡細 core material20 銆佸偓鍖栨澘鏉愶細 catalyzed board ,coated catalyzed laminate21 銆佹秱鑳跺偓鍖栧眰鍘嬫澘锛歛 dhesive-coated c
5、atalyzed laminate22 銆佹秱鑳舵棤鍌眰鍘嬫澘锛歛 dhesive-coated uncatalyzed laminate23 銆佺矘缁撳眰锛歜 onding layer24 銆佺矘缁撹啘锛歠 ilm adhesive25 銆佹秱鑳剁矘鍓傜粷缂樿杽鑶滐細 adhesive coated dielectric film26 銆佹棤鏀拺鑳剁矘鍓傝啘锛歶 nsupported adhesive film27 銆佽鐩栧眰锛歝 over layer (cover lay)28 銆佸寮烘澘鏉愶細 stiffener material29 銆侀摐绠旈潰锛歝 opper-clad surfac
6、e30 銆佸幓閾滅當闈細 foil removal surface31 銆佸眰鍘嬫澘闈細 unclad laminate surface32 銆佸熀鑶滈潰锛歜 ase film surface33 銆佽兌绮樺墏闈細 adhesive faec34 銆佸師濮嬪厜娲侀潰锛歱 late finish35 銆佺矖闈細 matt finish 36 銆佺旱鍚戯細 length wise direction 37 銆佹 鍚戯細 cross wise direction 38 銆佸壀鍒囨澘锛歝 ut to size panel39 銆侀厷閱涚焊璐閾滅當鏉匡細 phenolic cellulose paper
7、 copper-clad laminates(phenolic/paper CCL)40 銆佺幆姘 焊璐閾滅當鏉匡細 epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41 銆佺幆姘 幓鐠冨竷鍩鸿閾滅當鏉匡細 epoxide woven glass fabric copper-clad laminates 42 銆佺幆姘 幓鐠冨竷绾稿鍚堣閾滅當鏉匡細epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43 銆佺幆姘 幓鐠冨竷鐜荤
8、拑绾淮澶嶅悎瑕嗛摐绠旀澘锛歟 poxide non woven/woven glass reinforced copper-clad laminates44 銆佽仛閰幓鐠冨竷瑕嗛摐绠旀澘锛歱 loyester woven glass fabric copper-clad laminates45 銆佽仛閰颁簹鑳虹幓鐠冨竷瑕嗛摐绠旀澘锛歱olyimide woven glass fabric copper-clad laminates46 銆佸弻椹潵閰颁簹鑳轰笁鍡幆姘 幓鐠冨竷瑕嗛摐绠旀澘锛歜 ismaleimide/triazine/epoxide woven glass fabric copp
9、er-clad lamimates47 銆佺幆姘 悎鎴愮氦缁村竷瑕嗛摐绠旀澘锛歟poxide synthetic fiber fabric copper-clad laminates48 銆佽仛鍥涗箼鐑幓鐠冪氦缁磋閾滅當鏉匡細teflon/fiber glass copper-clad laminates49 銆佽秴钖勫瀷灞傚帇鏉匡細 ultra thin laminate50 銆侀櫠鐡峰熀瑕嗛摐绠旀澘锛歝 eramics base copper-clad laminates51 銆佺传澶栫嚎闃绘尅鍨嬭閾滅當鏉匡細 UV blocking copper-clad laminates鍗板埗鐢佃矾
10、鍩烘潗璇嶆眹璁茶 瀹屾瘯銆?鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶 鐩稿叧鏂囩珷 SMT 琛潰璐磋宸壓鍙婅澶囪鏄?8-30SMT 琛潰璐磋鎶鏈绋嬪畨鎺掕鏄?8-29AOI 鑷姩鍏夊妫娴嬬煡璇嗚瑙?8-27浠涔堟槸 NEPCON08-26SMT 宸甯堢粡甯哥敤鍒扮殑宸叿 08-24鍗板埗鐢佃矾鍩烘潗璇嶆眹璁茶 08-23TPI 鐭瘑浠嬬粛 08-23CPU 鑺墖灏佽鐭瘑 08-19鍗佺SMT 宸壓姝璁茶 08-19SMT 杈呭姪鏉愭枡浠嬬粛涔嬮敗鑶?8-18SMT 杈呭姪鏉愭枡浠嬬粛涔嬭创鐗囪兌锛堢孩鑳?锛?8-18SMT 杈呭姪鏉愭枡浠嬬粛涔嬪父鐢湳璇?8-18SMT 甯哥敤璐寸墖鍏冧欢浠嬬粛 08-1
11、8娉嘲鐒婂伐浣滄楠鏄?8-16SMT 璐寸墖鏈哄悕璇嶉噴涔?8-10SMA 鏄粈涔堟剰鎬?8-05BGA 杩斿伐鍐嶆祦鐒婃洸绾胯瀹?8-04瀛範 smt 瑕佹帉鎻摢浜涚煡璇?8-03鍏冨櫒浠跺熀纭鐭瘑璁茶 鈥旂數瀹瑰櫒 08-02鍏冨櫒浠跺熀纭鐭瘑璁茶 -鐢甸樆鍣?7-29鐣欒鏉?鎴戣鐣欒锛?绉板懠锛氭父瀹?鍖垮悕 (鎮繕鍙互杈撳叆 200 涓眽瀛椼? 鑱旂郴鏂瑰紡锛?鍙嬫儏閾炬帴 缇庣缃?SMT 涓嶇編涓界編瀹圭綉 鍟嗘槗 SMT LED 鍚嶇珯鍦嚎 SMT 宸甯堝煿璁綉 閰疯瑙?璐寸墖鏈虹綉 鏇村鍏充簬鏈珯 | 鑱旂郴鎴戜滑 | 鐜颁唬琛潰璐磋璧勮 | 鍏嶈垂绱槄 | 骞垮憡鍒婄櫥 | 鎰忚鍙嶉 | IPC 鏍囧噯涓浗 smt 琛屼笟闂埛 鐗堟潈鎵鏈?锛屾湭缁忎功闈巿鏉冪姝娇鐢?Copyright 漏 2010-2010 by . all rights reserved LinezingStat
