MTK智能机平台设计方案比对

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1、MTK 智能平台设计方案比对,MTK 智能机平台示意图,MTK 智能机平台比对- Pattern,A Company design- 8 layers with 1+6+1,Outer layer copper: 0.25mmSolder mask Pad: 0.35mmBuried hole: 0.2mm Buried hole pad: 0.45mm,Comment: Much protection copper in CPU BGA and Flash BGA. connected line focused on second layer.,MTK 智能机平台比对-Pattern,B C

2、ompany design- 8 layers with 1+6+1,Outer layer copper: 0.25mmSolder mask Pad: 0.325mmBuried hole: 0.25mm Buried hole pad: 0.457mm,MTK 智能机平台比对-Pattern,C Company design- 8 layers with 1+6+1,Outer layer copper: 0.25mmSolder mask Pad: 0.325mmBuried hole: 0.2mm Buried hole pad: 0.5mm,MTK 智能机平台比对- Pattern

3、,D Company design- 10 layers with 2+6+2 ( Copper filled）,Outer layer copper: 0.25mmSolder mask Pad: 0.25mmBuried hole: 0.2mm Buried hole pad: 0.4mm,MTK 智能机平台分析-走线,A company design,Flash type : 137 pin,Outer layer line : 0.1 mmSecond layer line : 0.075mm,MTK 智能机平台分析-走线,B company design,Flash type : 1

4、37 pin,Outer layer line : 0.75 mm with in BGA, 0.1mm within FlashSecond layer line : 0.75 mm with in BGA, 0.1mm within Flash,MTK 智能机平台分析-走线,C company design,Flash type : 137 pin,Outer layer line :0.1 mm Second layer line : 0.1 mm,MTK 智能机平台分析-走线,D company design,Flash type : 137 pin,Outer layer line :0.075 mm Second layer line : 0.075 mm,