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1、HDI Manufacturing Process Flow,Pre-engineering,Pattern imaging,Etching,Laminating,Drilling,Laser Ablation,Mechanical drilling,Cu plating,Solder Mask,Gold plating,Routing,Electrical test,Pattern imaging,Hole counter,Shipping,Visual inspection,* Raw material (Thin Core,Copper,Prepreg.),Raw Material :
2、FR-4 (Difuntional,Tetrafuntional) Supplier : EMC ,Nan-Ya Sheet size : 36”*48” , 40”*48” ,42”*48 Core Thickness : 0.003”,0.004”,0.005”,0.006” 0.008”,0.010”,0.012”,0.015” 0.021”,0.031”,0.039”,0.047” Copper Foil : 1/3 oz,1/2 oz,1.0 oz,2 oz Prepreg type : 1080,2113,2116,1506,7628,7630,4. 內層線路製作(顯影)(Deve
3、lop),5. 內層線路製作(蝕刻)(Etch),6. 內層線路製作(去膜)(Strip Resist),7.黑氧化 ( Oxide Coating),8. 疊板 (Lay-up),9. 壓合 (Lamination),10. 鑽孔 (Drilling),11. 電鍍Desmear & Copper Deposition,12. 塞孔(Hole Plugging),13. 去溢膠 (Belt Sanding),14. 減銅 (Copper Reduction) Option,15. 去溢膠 (Belt Sanding) Option,16. 外層壓膜 Dry Film Lamination (
4、Outer layer),17. 外層曝光 Expose,18. After Exposed,19. 外層顯影 Develop,20. 蝕刻 Etch,20. 去乾膜 Strip Resist,21.壓合 (Build-up Layer Lamination),21. 護形層製作 (壓膜)(Conformal Mask),22. 護形層製作 (曝光)(Conformal Mask),Before Exposure,After Exposure,23.護形層製作 (顯像)(Conformal Mask),24. 護形層製作 (蝕銅) (Conformal Mask),25.護形層製作(去膜) (
5、Conformal Mask),26. 雷射鑽孔 (Laser Ablation)及機械鑽孔,27. 機械鑽孔 (Mechanical Drill),28. 電鍍(Desmear & Copper Deposition),29. 外層線路製作 (Pattern imaging),壓膜(D/F Lamination),曝光(Exposure),顯像(D/F Developing),蝕銅 (Etching),去膜(D/F Stripping),30. 防焊(綠漆)製作 (Solder Mask),WWEI 94V-0,R105,31. S/M 顯像 (S/M Developing),32. 印文字
6、 (Legend Printing),33. 浸金(噴錫)製作(Electroless Ni/Au , HAL),Dedicate or universal Tester,Flying Probe Tester,34. 成型 (Profile),35. 測試 (Electrical Testing),36. 終檢 (Final Inspection),37. O.S.P. (entek plus Cu_106A.) Option,LASER BLIND & BURIED VIA LAY-UP,A = THROUGH VIA HOLE (導通孔),B = BURIED VIA HOLE (埋孔)
7、,C = One Level Laser Blind Via (雷射盲孔 ),LASER BLIND & BURIED VIA LAY-UP,BURIED VIA AND LASER BLIND VIA OPTION (雷射盲埋孔之選擇),D,C,C,D = Two Level Laser Via (雷射盲孔 ),C,D,C,B-STAGE,FR-4 Core,RCC,A,B,B,A,BURIED VIA LAY-UP,A = THROUGH VIA HOLE (導通孔),B = BURIED VIA HOLE (埋孔),C = BLIND VIA HOLE (盲孔 ),D = BLIND HOLE MLB VIA (多層盲孔),BLIND VIA LAY-UP,BLIND VIA SEQUENTIAL LAY-UP,A,B,B,A,RESIN,B-STAGE,BLIND AND BURIED VIA OPTION (盲 埋 孔 之 選 擇 ),D,A,C,C,E = VIA IN PAD (VIP) (導通孔在pad裡面),E,Conventional PCB,Photo-Imageable Dielectric (PID),Conventional PCB,Blind Via PCB,Q & A,END,
